KR101064023B1 - 열연화성 열전도성 부재 - Google Patents

열연화성 열전도성 부재 Download PDF

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Publication number
KR101064023B1
KR101064023B1 KR1020040063528A KR20040063528A KR101064023B1 KR 101064023 B1 KR101064023 B1 KR 101064023B1 KR 1020040063528 A KR1020040063528 A KR 1020040063528A KR 20040063528 A KR20040063528 A KR 20040063528A KR 101064023 B1 KR101064023 B1 KR 101064023B1
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KR
South Korea
Prior art keywords
component
conductive member
thermally conductive
sheet
heat
Prior art date
Application number
KR1020040063528A
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English (en)
Korean (ko)
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KR20050017389A (ko
Inventor
요시따까 아오끼
아끼오 나까노
히로아끼 데쯔까
구니히꼬 미따
즈또무 요네야마
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20050017389A publication Critical patent/KR20050017389A/ko
Application granted granted Critical
Publication of KR101064023B1 publication Critical patent/KR101064023B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020040063528A 2003-08-14 2004-08-12 열연화성 열전도성 부재 KR101064023B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00293312 2003-08-14
JP2003293312A JP3932125B2 (ja) 2003-08-14 2003-08-14 熱軟化性熱伝導性部材

Publications (2)

Publication Number Publication Date
KR20050017389A KR20050017389A (ko) 2005-02-22
KR101064023B1 true KR101064023B1 (ko) 2011-09-08

Family

ID=34370316

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040063528A KR101064023B1 (ko) 2003-08-14 2004-08-12 열연화성 열전도성 부재

Country Status (4)

Country Link
JP (1) JP3932125B2 (zh)
KR (1) KR101064023B1 (zh)
CN (1) CN1268712C (zh)
TW (1) TW200506001A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4901327B2 (ja) * 2005-07-25 2012-03-21 信越化学工業株式会社 放熱部材
RU2530894C2 (ru) * 2009-04-22 2014-10-20 Киова Кемикал Индастри Ко., Лтд. Столбчатые частицы оксида цинка и способ их получения
JP6815143B2 (ja) * 2016-09-14 2021-01-20 東洋アルミニウム株式会社 外科用固定材の製造方法
WO2019093052A1 (ja) * 2017-11-09 2019-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
US20230141794A1 (en) * 2020-03-11 2023-05-11 Sumitomo Metal Mining Co., Ltd. Thermally conductive paste
US20230141757A1 (en) * 2020-03-11 2023-05-11 Sumitomo Metal Mining Co., Ltd. Thermally conductive composition
US20230151259A1 (en) * 2020-03-11 2023-05-18 Sumitomo Metal Mining Co., Ltd. Thermally conductive composition
JP7286575B2 (ja) * 2020-03-24 2023-06-05 信越化学工業株式会社 熱軟化性付加硬化型熱伝導性シリコーン組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000063873A (ja) 1998-08-21 2000-02-29 Shin Etsu Chem Co Ltd 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2002003718A (ja) * 2000-06-23 2002-01-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
WO2002091465A1 (en) * 2001-04-23 2002-11-14 Shin-Etsu Chemical Co., Ltd. Heat radiating member
JP2002327116A (ja) 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3072491U (ja) * 2000-04-13 2000-10-20 富士高分子工業株式会社 保護フィルム付きシリコーンゲル放熱シート
JP2002084083A (ja) * 2000-07-06 2002-03-22 Fuji Kobunshi Kogyo Kk 放熱シート製品
JP2002329989A (ja) * 2001-05-02 2002-11-15 Shin Etsu Chem Co Ltd 熱軟化性放熱シート
JP3844125B2 (ja) * 2002-01-22 2006-11-08 信越化学工業株式会社 放熱部材、その製造方法及びその敷設方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000063873A (ja) 1998-08-21 2000-02-29 Shin Etsu Chem Co Ltd 熱伝導性グリース組成物及びそれを使用した半導体装置
JP2002003718A (ja) * 2000-06-23 2002-01-09 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置
WO2002091465A1 (en) * 2001-04-23 2002-11-14 Shin-Etsu Chemical Co., Ltd. Heat radiating member
JP2002327116A (ja) 2001-05-01 2002-11-15 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物及び半導体装置

Also Published As

Publication number Publication date
TWI352102B (zh) 2011-11-11
TW200506001A (en) 2005-02-16
CN1268712C (zh) 2006-08-09
KR20050017389A (ko) 2005-02-22
CN1590500A (zh) 2005-03-09
JP3932125B2 (ja) 2007-06-20
JP2005064281A (ja) 2005-03-10

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