ATE297110T1 - Elektronisches gerät mit wärmeerzeugenden teilen und wärmeabsorbierenden teilen - Google Patents

Elektronisches gerät mit wärmeerzeugenden teilen und wärmeabsorbierenden teilen

Info

Publication number
ATE297110T1
ATE297110T1 AT00956879T AT00956879T ATE297110T1 AT E297110 T1 ATE297110 T1 AT E297110T1 AT 00956879 T AT00956879 T AT 00956879T AT 00956879 T AT00956879 T AT 00956879T AT E297110 T1 ATE297110 T1 AT E297110T1
Authority
AT
Austria
Prior art keywords
heat
electronic device
parts
cpu
rectangular
Prior art date
Application number
AT00956879T
Other languages
English (en)
Inventor
Yasuhiro Ootori
Minato-Ku
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Application granted granted Critical
Publication of ATE297110T1 publication Critical patent/ATE297110T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT00956879T 1999-09-06 2000-09-01 Elektronisches gerät mit wärmeerzeugenden teilen und wärmeabsorbierenden teilen ATE297110T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25165699A JP4388174B2 (ja) 1999-09-06 1999-09-06 電子機器
PCT/JP2000/005961 WO2001019153A1 (en) 1999-09-06 2000-09-01 Electronic device with heat generating parts and heat absorbing parts

Publications (1)

Publication Number Publication Date
ATE297110T1 true ATE297110T1 (de) 2005-06-15

Family

ID=17226071

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00956879T ATE297110T1 (de) 1999-09-06 2000-09-01 Elektronisches gerät mit wärmeerzeugenden teilen und wärmeabsorbierenden teilen

Country Status (14)

Country Link
US (1) US6400566B1 (de)
EP (1) EP1210852B1 (de)
JP (1) JP4388174B2 (de)
KR (1) KR100710566B1 (de)
CN (1) CN1295950C (de)
AT (1) ATE297110T1 (de)
AU (1) AU6868600A (de)
BR (1) BR0013830A (de)
CA (1) CA2384164A1 (de)
DE (1) DE60020576T2 (de)
MX (1) MXPA02002454A (de)
RU (1) RU2002107437A (de)
TW (1) TWM252467U (de)
WO (1) WO2001019153A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134968A (ja) * 2000-10-25 2002-05-10 Sony Computer Entertainment Inc 回路基板ユニット、電子機器
JP2003318337A (ja) * 2002-04-22 2003-11-07 Toshiba Corp 電子機器
US6960127B1 (en) * 2002-10-18 2005-11-01 Christopher John Curen Stereo holding refrigerator
KR100486293B1 (ko) * 2002-12-27 2005-04-29 삼성전자주식회사 광디스크 드라이브
US6771507B1 (en) 2003-01-31 2004-08-03 Hewlett-Packard Development Company, L.P. Power module for multi-chip printed circuit boards
US6819562B2 (en) * 2003-01-31 2004-11-16 Hewlett-Packard Development Company, L.P. Cooling apparatus for stacked components
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
US7255494B2 (en) * 2003-05-23 2007-08-14 Intel Corporation Low-profile package for housing an optoelectronic assembly
JP4433412B2 (ja) 2005-05-15 2010-03-17 株式会社ソニー・コンピュータエンタテインメント 電子機器
US7554804B2 (en) * 2006-06-30 2009-06-30 Siemens Energy & Automation, Inc. Electronic module configured for air flow therethrough and system including same
US7869211B2 (en) * 2006-06-30 2011-01-11 Siemens Industry, Inc. Electronic module configured for failure containment and system including same
US7800901B2 (en) * 2006-09-13 2010-09-21 Hypertherm, Inc. Power supply cooling apparatus and configuration
JP4999943B2 (ja) * 2010-01-27 2012-08-15 東芝テック株式会社 情報処理端末
JP5417274B2 (ja) * 2010-07-20 2014-02-12 株式会社東芝 電子機器の放熱構造
CN102159055B (zh) * 2010-12-31 2013-02-13 东莞市宇洁新材料有限公司 一种离子风散热装置
CN105449931B (zh) * 2014-08-28 2017-12-29 上海微电子装备（集团）股份有限公司 一种平面电机
JP6982987B2 (ja) * 2017-06-02 2021-12-17 三菱電機株式会社 基板組立体
US11051421B1 (en) * 2020-03-13 2021-06-29 Quanta Computer Inc. Memory cooling system in a server

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287244A (en) * 1992-05-19 1994-02-15 Sun Microsystems, Inc. Computer housing with low noise cooling system
JPH07106782A (ja) * 1993-10-05 1995-04-21 Nippon Steel Corp 電子機器における冷却構造
US5510954A (en) * 1994-05-20 1996-04-23 Silent Systems, Inc. Silent disk drive assembly
JP3258198B2 (ja) * 1995-04-28 2002-02-18 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器
US5793608A (en) * 1996-06-11 1998-08-11 Sun Microsystems, Inc. Cooling system for enclosed electronic components
US5901040A (en) * 1997-07-30 1999-05-04 Hewlett-Packard Company Heat sink and Faraday Cage assembly for a semiconductor module and a power converter
US6134104A (en) * 1997-12-29 2000-10-17 Compaq Computer Corporation Multi-drive portable computer

Also Published As

Publication number Publication date
CA2384164A1 (en) 2001-03-15
US6400566B1 (en) 2002-06-04
AU6868600A (en) 2001-04-10
BR0013830A (pt) 2002-05-28
JP2001077568A (ja) 2001-03-23
CN1295950C (zh) 2007-01-17
RU2002107437A (ru) 2004-02-10
DE60020576T2 (de) 2006-03-16
MXPA02002454A (es) 2002-07-02
DE60020576D1 (de) 2005-07-07
CN1372784A (zh) 2002-10-02
EP1210852A1 (de) 2002-06-05
KR100710566B1 (ko) 2007-04-24
EP1210852B1 (de) 2005-06-01
KR20020027623A (ko) 2002-04-13
JP4388174B2 (ja) 2009-12-24
WO2001019153A1 (en) 2001-03-15
TWM252467U (en) 2004-12-11

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Legal Events

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