TW200504113A - Curable polycyclic compounds and process for the production thereof - Google Patents

Curable polycyclic compounds and process for the production thereof

Info

Publication number
TW200504113A
TW200504113A TW093117764A TW93117764A TW200504113A TW 200504113 A TW200504113 A TW 200504113A TW 093117764 A TW093117764 A TW 093117764A TW 93117764 A TW93117764 A TW 93117764A TW 200504113 A TW200504113 A TW 200504113A
Authority
TW
Taiwan
Prior art keywords
production
polycyclic compounds
integer
curable polycyclic
fluoro
Prior art date
Application number
TW093117764A
Other languages
English (en)
Other versions
TWI304071B (zh
Inventor
Junji Takenaka
Hiromasa Yamamoto
Kenji Tanaka
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of TW200504113A publication Critical patent/TW200504113A/zh
Application granted granted Critical
Publication of TWI304071B publication Critical patent/TWI304071B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
    • C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
    • C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
    • C07D303/28—Ethers with hydroxy compounds containing oxirane rings
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D305/00—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms
    • C07D305/02—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings
    • C07D305/04—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C07D305/06—Heterocyclic compounds containing four-membered rings having one oxygen atom as the only ring hetero atoms not condensed with other rings having no double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to the ring atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW093117764A 2003-06-20 2004-06-18 Curable polycyclic compounds and process for the production thereof TW200504113A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003175754 2003-06-20
JP2003324162 2003-09-17
JP2003324268 2003-09-17
JP2003358270 2003-10-17
JP2003359205 2003-10-20

Publications (2)

Publication Number Publication Date
TW200504113A true TW200504113A (en) 2005-02-01
TWI304071B TWI304071B (zh) 2008-12-11

Family

ID=33545602

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117764A TW200504113A (en) 2003-06-20 2004-06-18 Curable polycyclic compounds and process for the production thereof

Country Status (6)

Country Link
US (1) US7754903B2 (zh)
EP (1) EP1637526B1 (zh)
KR (1) KR100740760B1 (zh)
ES (1) ES2376550T3 (zh)
TW (1) TW200504113A (zh)
WO (1) WO2004113313A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612125B (zh) * 2013-12-18 2018-01-21 Rohm And Haas Electronic Materials Llc 可變換之波長轉換介質

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WO2006086304A1 (en) * 2005-02-08 2006-08-17 Wilson-Cook Medical Inc. Self contracting stent
WO2007010784A1 (ja) * 2005-07-15 2007-01-25 Idemitsu Kosan Co., Ltd. 含フッ素アダマンタン誘導体、それを含有する樹脂組成物及びその樹脂組成物を用いた光学電子部材
EP1930327A4 (en) 2005-09-01 2010-03-03 Idemitsu Kosan Co ADAMANTANE DERIVATIVE, RESIN COMPOSITION CONTAINING THE SAME, AND OPTOELECTRONIC COMPONENT USING THE SAME
JP4042067B2 (ja) * 2006-03-31 2008-02-06 大日本インキ化学工業株式会社 多官能オキセタニル基含有紫外線硬化性樹脂組成物
JPWO2007125829A1 (ja) * 2006-04-28 2009-09-10 出光興産株式会社 含フッ素アダマンタン誘導体、重合性基含有含フッ素アダマンタン誘導体、それを含有する樹脂組成物及び反射防止膜
JP5134233B2 (ja) * 2006-11-29 2013-01-30 出光興産株式会社 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物
JP2011213716A (ja) * 2010-03-15 2011-10-27 Mitsubishi Chemicals Corp ポリアリルオキシ化合物の製造方法及びポリグリシジルオキシ化合物の製造方法
WO2015138128A1 (en) * 2014-03-12 2015-09-17 Dow Global Technologies Llc Epoxy resin compositions

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US3404102A (en) * 1964-04-09 1968-10-01 Union Carbide Corp Polycyclic epoxide compositions and presins produced therefrom
GB1409250A (en) * 1971-12-15 1975-10-08 Shell Int Research Brominated epoxy compounds
US3795658A (en) * 1971-12-30 1974-03-05 Sun Research Development Epoxy resins from dimethyladamantane bisphenols
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JPS60100537A (ja) 1983-11-08 1985-06-04 Japan Synthetic Rubber Co Ltd アダマンタンジカルボン酸ジアリル
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI612125B (zh) * 2013-12-18 2018-01-21 Rohm And Haas Electronic Materials Llc 可變換之波長轉換介質

Also Published As

Publication number Publication date
EP1637526B1 (en) 2011-11-09
KR100740760B1 (ko) 2007-07-19
TWI304071B (zh) 2008-12-11
EP1637526A4 (en) 2008-02-27
KR20060024810A (ko) 2006-03-17
EP1637526A1 (en) 2006-03-22
US7754903B2 (en) 2010-07-13
US20060252911A1 (en) 2006-11-09
ES2376550T3 (es) 2012-03-14
WO2004113313A1 (ja) 2004-12-29

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