TW200427771A - Highly elastic epoxy resin composition - Google Patents

Highly elastic epoxy resin composition Download PDF

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Publication number
TW200427771A
TW200427771A TW093105909A TW93105909A TW200427771A TW 200427771 A TW200427771 A TW 200427771A TW 093105909 A TW093105909 A TW 093105909A TW 93105909 A TW93105909 A TW 93105909A TW 200427771 A TW200427771 A TW 200427771A
Authority
TW
Taiwan
Prior art keywords
resin composition
weight
epoxy resin
scope
epoxy
Prior art date
Application number
TW093105909A
Other languages
English (en)
Chinese (zh)
Other versions
TWI333966B (https=
Inventor
Yoshinori Takahata
Takahiro Mori
Setsuko Hirakawa
Seiichi Saito
Original Assignee
Asahi Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Co Ltd filed Critical Asahi Denka Co Ltd
Publication of TW200427771A publication Critical patent/TW200427771A/zh
Application granted granted Critical
Publication of TWI333966B publication Critical patent/TWI333966B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
TW093105909A 2003-03-07 2004-03-05 Highly elastic epoxy resin composition TW200427771A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003060794A JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
TW200427771A true TW200427771A (en) 2004-12-16
TWI333966B TWI333966B (https=) 2010-12-01

Family

ID=32958941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105909A TW200427771A (en) 2003-03-07 2004-03-05 Highly elastic epoxy resin composition

Country Status (6)

Country Link
US (1) US20060173101A1 (https=)
EP (1) EP1602689B1 (https=)
JP (1) JP4245377B2 (https=)
KR (1) KR101079930B1 (https=)
TW (1) TW200427771A (https=)
WO (1) WO2004078843A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101189275B (zh) 2005-05-31 2011-08-17 株式会社艾迪科 环氧树脂固化性组合物
US7851052B2 (en) 2005-08-23 2010-12-14 Awi Licensing Company Coating system for sag resistant formaldehyde-free fibrous panels
CN101903351B (zh) 2007-12-19 2014-09-10 贝林格尔.英格海姆国际有限公司 病毒聚合酶抑制剂
CN101952262B (zh) * 2008-02-21 2012-07-18 亨斯迈先进材料美国有限责任公司 用于高tg应用的无卤苯并噁嗪基可固化组合物
JP5349143B2 (ja) * 2008-06-03 2013-11-20 三菱レイヨン株式会社 繊維強化複合材料用樹脂組成物およびそれを用いた繊維強化複合材料
CN102439088A (zh) * 2009-02-12 2012-05-02 吉坤日矿日石能源株式会社 苯并*嗪树脂组合物
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5431849B2 (ja) * 2009-09-25 2014-03-05 株式会社Adeka 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5526820B2 (ja) * 2010-01-29 2014-06-18 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
TWI400292B (zh) * 2010-06-14 2013-07-01 Nanya Plastics Corp Used in glass fiber laminates high glass transition temperature resin varnish composition
CN104114526B (zh) * 2012-02-17 2018-09-07 亨斯迈先进材料美国有限责任公司 苯并噁嗪、环氧树脂和酸酐的混合物
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2016071336A (ja) * 2014-09-26 2016-05-09 富士フイルム株式会社 光学フィルム及びそれを備えた偏光板、液晶表示装置、及び光学フィルムの製造方法
US9766378B2 (en) 2014-09-26 2017-09-19 Fujifilm Corporation Optical film, polarizing plate equipped with the optical film, liquid crystal display device, and method for producing an optical film
CA2987755A1 (en) * 2015-06-12 2016-12-15 Leon Dyers, Jr. Curable compositions containing benzoxazine epoxy blend and use thereof
WO2017122952A1 (ko) 2016-01-13 2017-07-20 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그
CN118725518B (zh) * 2024-07-18 2025-02-07 江苏诺德新材料股份有限公司 一种基于覆铜板的高导热环氧树脂组合物及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3242108A (en) * 1961-04-04 1966-03-22 Union Carbide Corp Compositions for producing polyurethane resins and resinous foams and products prepared therefrom
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
ES2016249T5 (es) * 1985-12-20 1996-05-01 Mitsubishi Rayon Co Procedimiento de preparacion de un intermedio para un material compuesto.
EP0266986A3 (en) * 1986-11-06 1989-09-06 Amoco Corporation Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermplastic polymers and prepreg made therefrom
DE3852839T2 (de) * 1987-04-27 1995-06-22 Mitsubishi Gas Chemical Co Hitzehärtbare Harzzusammensetzung.
TW593528B (en) * 1997-03-31 2004-06-21 Sumitomo Chemical Co Epoxy resin composition
JP3591758B2 (ja) * 1997-10-09 2004-11-24 住友ベークライト株式会社 液状注入封止アンダーフィル材
JP4124295B2 (ja) * 1998-08-20 2008-07-23 株式会社Adeka 硬化性組成物
US6207077B1 (en) * 2000-02-18 2001-03-27 Orion 21 A.D. Pty Ltd Luminescent gel coats and moldable resins
JP2001207031A (ja) * 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置
TWI298412B (https=) * 2000-06-21 2008-07-01 Mitsui Chemicals Inc
US6451931B1 (en) * 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US6437026B1 (en) * 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds
JP2003213081A (ja) * 2002-01-21 2003-07-30 Kyocera Chemical Corp エポキシ樹脂組成物および半導体装置

Also Published As

Publication number Publication date
KR101079930B1 (ko) 2011-11-04
EP1602689A4 (en) 2007-07-25
EP1602689B1 (en) 2012-04-04
TWI333966B (https=) 2010-12-01
US20060173101A1 (en) 2006-08-03
KR20050107608A (ko) 2005-11-14
WO2004078843A1 (ja) 2004-09-16
JP2004269641A (ja) 2004-09-30
EP1602689A1 (en) 2005-12-07
JP4245377B2 (ja) 2009-03-25

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