JP4245377B2 - 高弾性エポキシ樹脂組成物 - Google Patents

高弾性エポキシ樹脂組成物 Download PDF

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Publication number
JP4245377B2
JP4245377B2 JP2003060794A JP2003060794A JP4245377B2 JP 4245377 B2 JP4245377 B2 JP 4245377B2 JP 2003060794 A JP2003060794 A JP 2003060794A JP 2003060794 A JP2003060794 A JP 2003060794A JP 4245377 B2 JP4245377 B2 JP 4245377B2
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JP
Japan
Prior art keywords
epoxy resin
resin composition
weight
compound
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003060794A
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English (en)
Japanese (ja)
Other versions
JP2004269641A (ja
Inventor
義徳 高畑
貴裕 森
節子 平川
誠一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Priority to JP2003060794A priority Critical patent/JP4245377B2/ja
Priority to US10/548,178 priority patent/US20060173101A1/en
Priority to EP04717817A priority patent/EP1602689B1/en
Priority to TW093105909A priority patent/TW200427771A/zh
Priority to PCT/JP2004/002839 priority patent/WO2004078843A1/ja
Priority to KR1020057016688A priority patent/KR101079930B1/ko
Publication of JP2004269641A publication Critical patent/JP2004269641A/ja
Application granted granted Critical
Publication of JP4245377B2 publication Critical patent/JP4245377B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
JP2003060794A 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物 Expired - Fee Related JP4245377B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003060794A JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物
US10/548,178 US20060173101A1 (en) 2003-03-07 2004-03-05 Highly elastic epoxy resin composition
EP04717817A EP1602689B1 (en) 2003-03-07 2004-03-05 Highly elastic epoxy resin composition
TW093105909A TW200427771A (en) 2003-03-07 2004-03-05 Highly elastic epoxy resin composition
PCT/JP2004/002839 WO2004078843A1 (ja) 2003-03-07 2004-03-05 高弾性エポキシ樹脂組成物
KR1020057016688A KR101079930B1 (ko) 2003-03-07 2004-03-05 고탄성 에폭시 수지 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003060794A JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JP2004269641A JP2004269641A (ja) 2004-09-30
JP4245377B2 true JP4245377B2 (ja) 2009-03-25

Family

ID=32958941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003060794A Expired - Fee Related JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物

Country Status (6)

Country Link
US (1) US20060173101A1 (https=)
EP (1) EP1602689B1 (https=)
JP (1) JP4245377B2 (https=)
KR (1) KR101079930B1 (https=)
TW (1) TW200427771A (https=)
WO (1) WO2004078843A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101189275B (zh) 2005-05-31 2011-08-17 株式会社艾迪科 环氧树脂固化性组合物
US7851052B2 (en) 2005-08-23 2010-12-14 Awi Licensing Company Coating system for sag resistant formaldehyde-free fibrous panels
CN101903351B (zh) 2007-12-19 2014-09-10 贝林格尔.英格海姆国际有限公司 病毒聚合酶抑制剂
CN101952262B (zh) * 2008-02-21 2012-07-18 亨斯迈先进材料美国有限责任公司 用于高tg应用的无卤苯并噁嗪基可固化组合物
JP5349143B2 (ja) * 2008-06-03 2013-11-20 三菱レイヨン株式会社 繊維強化複合材料用樹脂組成物およびそれを用いた繊維強化複合材料
CN102439088A (zh) * 2009-02-12 2012-05-02 吉坤日矿日石能源株式会社 苯并*嗪树脂组合物
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5431849B2 (ja) * 2009-09-25 2014-03-05 株式会社Ａｄｅｋａ 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5526820B2 (ja) * 2010-01-29 2014-06-18 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
TWI400292B (zh) * 2010-06-14 2013-07-01 Nanya Plastics Corp Used in glass fiber laminates high glass transition temperature resin varnish composition
CN104114526B (zh) * 2012-02-17 2018-09-07 亨斯迈先进材料美国有限责任公司 苯并噁嗪、环氧树脂和酸酐的混合物
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2016071336A (ja) * 2014-09-26 2016-05-09 富士フイルム株式会社 光学フィルム及びそれを備えた偏光板、液晶表示装置、及び光学フィルムの製造方法
US9766378B2 (en) 2014-09-26 2017-09-19 Fujifilm Corporation Optical film, polarizing plate equipped with the optical film, liquid crystal display device, and method for producing an optical film
CA2987755A1 (en) * 2015-06-12 2016-12-15 Leon Dyers, Jr. Curable compositions containing benzoxazine epoxy blend and use thereof
WO2017122952A1 (ko) 2016-01-13 2017-07-20 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그
CN118725518B (zh) * 2024-07-18 2025-02-07 江苏诺德新材料股份有限公司 一种基于覆铜板的高导热环氧树脂组合物及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3242108A (en) * 1961-04-04 1966-03-22 Union Carbide Corp Compositions for producing polyurethane resins and resinous foams and products prepared therefrom
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
ES2016249T5 (es) * 1985-12-20 1996-05-01 Mitsubishi Rayon Co Procedimiento de preparacion de un intermedio para un material compuesto.
EP0266986A3 (en) * 1986-11-06 1989-09-06 Amoco Corporation Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermplastic polymers and prepreg made therefrom
DE3852839T2 (de) * 1987-04-27 1995-06-22 Mitsubishi Gas Chemical Co Hitzehärtbare Harzzusammensetzung.
TW593528B (en) * 1997-03-31 2004-06-21 Sumitomo Chemical Co Epoxy resin composition
JP3591758B2 (ja) * 1997-10-09 2004-11-24 住友ベークライト株式会社 液状注入封止アンダーフィル材
JP4124295B2 (ja) * 1998-08-20 2008-07-23 株式会社Ａｄｅｋａ 硬化性組成物
US6207077B1 (en) * 2000-02-18 2001-03-27 Orion 21 A.D. Pty Ltd Luminescent gel coats and moldable resins
JP2001207031A (ja) * 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置
TWI298412B (https=) * 2000-06-21 2008-07-01 Mitsui Chemicals Inc
US6451931B1 (en) * 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US6437026B1 (en) * 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds
JP2003213081A (ja) * 2002-01-21 2003-07-30 Kyocera Chemical Corp エポキシ樹脂組成物および半導体装置

Also Published As

Publication number Publication date
KR101079930B1 (ko) 2011-11-04
EP1602689A4 (en) 2007-07-25
EP1602689B1 (en) 2012-04-04
TWI333966B (https=) 2010-12-01
US20060173101A1 (en) 2006-08-03
KR20050107608A (ko) 2005-11-14
WO2004078843A1 (ja) 2004-09-16
JP2004269641A (ja) 2004-09-30
EP1602689A1 (en) 2005-12-07
TW200427771A (en) 2004-12-16

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