KR101079930B1 - 고탄성 에폭시 수지 조성물 - Google Patents

고탄성 에폭시 수지 조성물 Download PDF

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Publication number
KR101079930B1
KR101079930B1 KR1020057016688A KR20057016688A KR101079930B1 KR 101079930 B1 KR101079930 B1 KR 101079930B1 KR 1020057016688 A KR1020057016688 A KR 1020057016688A KR 20057016688 A KR20057016688 A KR 20057016688A KR 101079930 B1 KR101079930 B1 KR 101079930B1
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
weight
compound
epoxy
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Expired - Fee Related
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KR1020057016688A
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English (en)
Korean (ko)
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KR20050107608A (ko
Inventor
요시노리 타카하타
타카히로 모리
세츠코 히라카와
세이이치 사이토
Original Assignee
가부시키가이샤 아데카
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
KR1020057016688A 2003-03-07 2004-03-05 고탄성 에폭시 수지 조성물 Expired - Fee Related KR101079930B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003060794A JP4245377B2 (ja) 2003-03-07 2003-03-07 高弾性エポキシ樹脂組成物
JPJP-P-2003-00060794 2003-03-07
PCT/JP2004/002839 WO2004078843A1 (ja) 2003-03-07 2004-03-05 高弾性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR20050107608A KR20050107608A (ko) 2005-11-14
KR101079930B1 true KR101079930B1 (ko) 2011-11-04

Family

ID=32958941

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057016688A Expired - Fee Related KR101079930B1 (ko) 2003-03-07 2004-03-05 고탄성 에폭시 수지 조성물

Country Status (6)

Country Link
US (1) US20060173101A1 (https=)
EP (1) EP1602689B1 (https=)
JP (1) JP4245377B2 (https=)
KR (1) KR101079930B1 (https=)
TW (1) TW200427771A (https=)
WO (1) WO2004078843A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101189275B (zh) 2005-05-31 2011-08-17 株式会社艾迪科 环氧树脂固化性组合物
US7851052B2 (en) 2005-08-23 2010-12-14 Awi Licensing Company Coating system for sag resistant formaldehyde-free fibrous panels
CN101903351B (zh) 2007-12-19 2014-09-10 贝林格尔.英格海姆国际有限公司 病毒聚合酶抑制剂
CN101952262B (zh) * 2008-02-21 2012-07-18 亨斯迈先进材料美国有限责任公司 用于高tg应用的无卤苯并噁嗪基可固化组合物
JP5349143B2 (ja) * 2008-06-03 2013-11-20 三菱レイヨン株式会社 繊維強化複合材料用樹脂組成物およびそれを用いた繊維強化複合材料
CN102439088A (zh) * 2009-02-12 2012-05-02 吉坤日矿日石能源株式会社 苯并*嗪树脂组合物
JP2010195887A (ja) * 2009-02-24 2010-09-09 Sumitomo Electric Ind Ltd 接着性樹脂組成物並びにこれを用いた積層体及びフレキシブル印刷配線板
JP5431849B2 (ja) * 2009-09-25 2014-03-05 株式会社Ａｄｅｋａ 無溶剤一液型シアン酸エステル−エポキシ複合樹脂組成物
JP5526820B2 (ja) * 2010-01-29 2014-06-18 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ及び積層板
TWI400292B (zh) * 2010-06-14 2013-07-01 Nanya Plastics Corp Used in glass fiber laminates high glass transition temperature resin varnish composition
CN104114526B (zh) * 2012-02-17 2018-09-07 亨斯迈先进材料美国有限责任公司 苯并噁嗪、环氧树脂和酸酐的混合物
US9243164B1 (en) 2012-02-21 2016-01-26 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
US9051465B1 (en) 2012-02-21 2015-06-09 Park Electrochemical Corporation Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound
JP2016071336A (ja) * 2014-09-26 2016-05-09 富士フイルム株式会社 光学フィルム及びそれを備えた偏光板、液晶表示装置、及び光学フィルムの製造方法
US9766378B2 (en) 2014-09-26 2017-09-19 Fujifilm Corporation Optical film, polarizing plate equipped with the optical film, liquid crystal display device, and method for producing an optical film
CA2987755A1 (en) * 2015-06-12 2016-12-15 Leon Dyers, Jr. Curable compositions containing benzoxazine epoxy blend and use thereof
WO2017122952A1 (ko) 2016-01-13 2017-07-20 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그
CN118725518B (zh) * 2024-07-18 2025-02-07 江苏诺德新材料股份有限公司 一种基于覆铜板的高导热环氧树脂组合物及其制备方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2001207031A (ja) 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置

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US3242108A (en) * 1961-04-04 1966-03-22 Union Carbide Corp Compositions for producing polyurethane resins and resinous foams and products prepared therefrom
US4645805A (en) * 1984-03-14 1987-02-24 Mitsubishi Gas Chemical Company, Inc. Adhesive composition and adhesive film or sheet on which the composition is coated
ES2016249T5 (es) * 1985-12-20 1996-05-01 Mitsubishi Rayon Co Procedimiento de preparacion de un intermedio para un material compuesto.
EP0266986A3 (en) * 1986-11-06 1989-09-06 Amoco Corporation Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermplastic polymers and prepreg made therefrom
DE3852839T2 (de) * 1987-04-27 1995-06-22 Mitsubishi Gas Chemical Co Hitzehärtbare Harzzusammensetzung.
TW593528B (en) * 1997-03-31 2004-06-21 Sumitomo Chemical Co Epoxy resin composition
JP3591758B2 (ja) * 1997-10-09 2004-11-24 住友ベークライト株式会社 液状注入封止アンダーフィル材
JP4124295B2 (ja) * 1998-08-20 2008-07-23 株式会社Ａｄｅｋａ 硬化性組成物
US6207077B1 (en) * 2000-02-18 2001-03-27 Orion 21 A.D. Pty Ltd Luminescent gel coats and moldable resins
TWI298412B (https=) * 2000-06-21 2008-07-01 Mitsui Chemicals Inc
US6451931B1 (en) * 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US6437026B1 (en) * 2001-01-05 2002-08-20 Cookson Singapore Pte Ltd. Hardener for epoxy molding compounds
JP2003213081A (ja) * 2002-01-21 2003-07-30 Kyocera Chemical Corp エポキシ樹脂組成物および半導体装置

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2001207031A (ja) 2000-01-28 2001-07-31 Nitto Denko Corp 半導体封止用樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
EP1602689A4 (en) 2007-07-25
EP1602689B1 (en) 2012-04-04
TWI333966B (https=) 2010-12-01
US20060173101A1 (en) 2006-08-03
KR20050107608A (ko) 2005-11-14
WO2004078843A1 (ja) 2004-09-16
JP2004269641A (ja) 2004-09-30
EP1602689A1 (en) 2005-12-07
JP4245377B2 (ja) 2009-03-25
TW200427771A (en) 2004-12-16

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