TW200426934A - Base film for semiconductor wafer processing - Google Patents

Base film for semiconductor wafer processing Download PDF

Info

Publication number
TW200426934A
TW200426934A TW093109605A TW93109605A TW200426934A TW 200426934 A TW200426934 A TW 200426934A TW 093109605 A TW093109605 A TW 093109605A TW 93109605 A TW93109605 A TW 93109605A TW 200426934 A TW200426934 A TW 200426934A
Authority
TW
Taiwan
Prior art keywords
film
wafer processing
tape
patent application
semiconductor wafer
Prior art date
Application number
TW093109605A
Other languages
English (en)
Chinese (zh)
Other versions
TWI294646B (enExample
Inventor
Koji Furuya
Original Assignee
Teijin Dupont Films Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin Dupont Films Japan Ltd filed Critical Teijin Dupont Films Japan Ltd
Publication of TW200426934A publication Critical patent/TW200426934A/zh
Application granted granted Critical
Publication of TWI294646B publication Critical patent/TWI294646B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW093109605A 2003-04-08 2004-04-07 Base film for semiconductor wafer processing TW200426934A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003103908 2003-04-08

Publications (2)

Publication Number Publication Date
TW200426934A true TW200426934A (en) 2004-12-01
TWI294646B TWI294646B (enExample) 2008-03-11

Family

ID=33156837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093109605A TW200426934A (en) 2003-04-08 2004-04-07 Base film for semiconductor wafer processing

Country Status (5)

Country Link
JP (1) JPWO2004090962A1 (enExample)
KR (1) KR20050118302A (enExample)
CN (1) CN1771585A (enExample)
TW (1) TW200426934A (enExample)
WO (1) WO2004090962A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694508B (zh) * 2018-03-28 2020-05-21 日商古河電氣工業股份有限公司 半導體加工用膠帶
TWI699420B (zh) * 2015-03-24 2020-07-21 日商古河電氣工業股份有限公司 半導體加工用膠帶

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666565B2 (ja) * 2003-10-06 2011-04-06 日東電工株式会社 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法
JP4622360B2 (ja) * 2004-07-23 2011-02-02 東レ株式会社 積層ポリエステルフィルム
JP2006316218A (ja) * 2005-05-16 2006-11-24 Teijin Dupont Films Japan Ltd 二軸配向ポリエステルフィルム
JP4907965B2 (ja) 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP5030461B2 (ja) * 2006-04-03 2012-09-19 グンゼ株式会社 半導体ウェハの裏面研削に用いる表面保護テープ用基材フィルム
TW200800584A (en) * 2006-04-03 2008-01-01 Gunze Kk Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
JP2008047558A (ja) * 2006-08-10 2008-02-28 Nitto Denko Corp 反り抑制ウエハ研削用粘着シート
JP5080039B2 (ja) * 2006-08-21 2012-11-21 帝人デュポンフィルム株式会社 自動車駆動モーター用二軸配向ポリエステルフィルム
JP5008999B2 (ja) * 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
JP5014909B2 (ja) * 2007-07-24 2012-08-29 リンテック株式会社 印刷用積層シート
EP2267090B8 (en) * 2008-04-21 2018-10-17 LG Chem, Ltd. Pressure-sensitive adhesive film and back-grinding method using the same
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
JP5249796B2 (ja) * 2009-01-19 2013-07-31 帝人デュポンフィルム株式会社 フレキシブルプリント回路基板補強用フィルム、フレキシブルプリント回路基板補強板およびフレキシブルプリント回路基板積層体
TWI418604B (zh) * 2010-11-17 2013-12-11 Furukawa Electric Co Ltd Semiconductor wafer processing tape
JP2015189960A (ja) * 2014-03-29 2015-11-02 三菱樹脂株式会社 ポリエステルフィルム
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2017005072A (ja) * 2015-06-09 2017-01-05 日東電工株式会社 半導体ウエハ保護用粘着シート
JP6109356B1 (ja) * 2015-11-07 2017-04-05 三菱樹脂株式会社 積層ポリエステルフィルム
JP7100957B2 (ja) * 2015-12-15 2022-07-14 積水化学工業株式会社 半導体保護テープ
JP1574161S (enExample) * 2016-08-31 2017-04-17
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3169407B2 (ja) * 1991-12-24 2001-05-28 三井化学株式会社 半導体ウェハ裏面の金属蒸着方法
JPH10214801A (ja) * 1997-01-31 1998-08-11 Teijin Ltd ダイシングテープ
JP2002270560A (ja) * 2001-03-07 2002-09-20 Lintec Corp ウエハの加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI699420B (zh) * 2015-03-24 2020-07-21 日商古河電氣工業股份有限公司 半導體加工用膠帶
TWI694508B (zh) * 2018-03-28 2020-05-21 日商古河電氣工業股份有限公司 半導體加工用膠帶

Also Published As

Publication number Publication date
TWI294646B (enExample) 2008-03-11
CN1771585A (zh) 2006-05-10
KR20050118302A (ko) 2005-12-16
WO2004090962A1 (ja) 2004-10-21
JPWO2004090962A1 (ja) 2006-07-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees