CN1771585A - 半导体晶片加工用基膜 - Google Patents

半导体晶片加工用基膜 Download PDF

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Publication number
CN1771585A
CN1771585A CNA2004800094427A CN200480009442A CN1771585A CN 1771585 A CN1771585 A CN 1771585A CN A2004800094427 A CNA2004800094427 A CN A2004800094427A CN 200480009442 A CN200480009442 A CN 200480009442A CN 1771585 A CN1771585 A CN 1771585A
Authority
CN
China
Prior art keywords
film
semiconductor wafer
base film
wafer processing
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2004800094427A
Other languages
English (en)
Chinese (zh)
Inventor
古谷幸治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Film Solutions Ltd
Original Assignee
Teijin DuPont Films Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teijin DuPont Films Japan Ltd filed Critical Teijin DuPont Films Japan Ltd
Publication of CN1771585A publication Critical patent/CN1771585A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNA2004800094427A 2003-04-08 2004-04-06 半导体晶片加工用基膜 Pending CN1771585A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP103908/2003 2003-04-08
JP2003103908 2003-04-08

Publications (1)

Publication Number Publication Date
CN1771585A true CN1771585A (zh) 2006-05-10

Family

ID=33156837

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2004800094427A Pending CN1771585A (zh) 2003-04-08 2004-04-06 半导体晶片加工用基膜

Country Status (5)

Country Link
JP (1) JPWO2004090962A1 (enExample)
KR (1) KR20050118302A (enExample)
CN (1) CN1771585A (enExample)
TW (1) TW200426934A (enExample)
WO (1) WO2004090962A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102015937A (zh) * 2008-04-21 2011-04-13 Lg化学株式会社 压敏粘合剂膜和使用该压敏粘合剂膜的背磨方法
CN101606229B (zh) * 2007-02-06 2011-07-20 琳得科株式会社 切割带及半导体器件的制造方法
CN107431002A (zh) * 2015-03-24 2017-12-01 古河电气工业株式会社 半导体加工用带

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666565B2 (ja) * 2003-10-06 2011-04-06 日東電工株式会社 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法
JP4622360B2 (ja) * 2004-07-23 2011-02-02 東レ株式会社 積層ポリエステルフィルム
JP2006316218A (ja) * 2005-05-16 2006-11-24 Teijin Dupont Films Japan Ltd 二軸配向ポリエステルフィルム
JP4907965B2 (ja) 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP5030461B2 (ja) * 2006-04-03 2012-09-19 グンゼ株式会社 半導体ウェハの裏面研削に用いる表面保護テープ用基材フィルム
TW200800584A (en) * 2006-04-03 2008-01-01 Gunze Kk Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
JP2008047558A (ja) * 2006-08-10 2008-02-28 Nitto Denko Corp 反り抑制ウエハ研削用粘着シート
JP5080039B2 (ja) * 2006-08-21 2012-11-21 帝人デュポンフィルム株式会社 自動車駆動モーター用二軸配向ポリエステルフィルム
JP5014909B2 (ja) * 2007-07-24 2012-08-29 リンテック株式会社 印刷用積層シート
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
JP5249796B2 (ja) * 2009-01-19 2013-07-31 帝人デュポンフィルム株式会社 フレキシブルプリント回路基板補強用フィルム、フレキシブルプリント回路基板補強板およびフレキシブルプリント回路基板積層体
TWI418604B (zh) * 2010-11-17 2013-12-11 Furukawa Electric Co Ltd Semiconductor wafer processing tape
JP2015189960A (ja) * 2014-03-29 2015-11-02 三菱樹脂株式会社 ポリエステルフィルム
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2017005072A (ja) * 2015-06-09 2017-01-05 日東電工株式会社 半導体ウエハ保護用粘着シート
JP6109356B1 (ja) * 2015-11-07 2017-04-05 三菱樹脂株式会社 積層ポリエステルフィルム
JP7100957B2 (ja) * 2015-12-15 2022-07-14 積水化学工業株式会社 半導体保護テープ
JP1574161S (enExample) * 2016-08-31 2017-04-17
SG11201906507PA (en) * 2018-03-28 2019-11-28 Furukawa Electric Co Ltd Tape for semiconductor processing
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3169407B2 (ja) * 1991-12-24 2001-05-28 三井化学株式会社 半導体ウェハ裏面の金属蒸着方法
JPH10214801A (ja) * 1997-01-31 1998-08-11 Teijin Ltd ダイシングテープ
JP2002270560A (ja) * 2001-03-07 2002-09-20 Lintec Corp ウエハの加工方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101606229B (zh) * 2007-02-06 2011-07-20 琳得科株式会社 切割带及半导体器件的制造方法
CN102015937A (zh) * 2008-04-21 2011-04-13 Lg化学株式会社 压敏粘合剂膜和使用该压敏粘合剂膜的背磨方法
CN102015937B (zh) * 2008-04-21 2014-11-12 Lg化学株式会社 压敏粘合剂膜和使用该压敏粘合剂膜的背磨方法
CN107431002A (zh) * 2015-03-24 2017-12-01 古河电气工业株式会社 半导体加工用带
CN107431002B (zh) * 2015-03-24 2020-09-11 古河电气工业株式会社 半导体加工用带

Also Published As

Publication number Publication date
TWI294646B (enExample) 2008-03-11
KR20050118302A (ko) 2005-12-16
TW200426934A (en) 2004-12-01
WO2004090962A1 (ja) 2004-10-21
JPWO2004090962A1 (ja) 2006-07-06

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