TW200421506A - Wire bonding method - Google Patents

Wire bonding method Download PDF

Info

Publication number
TW200421506A
TW200421506A TW092135143A TW92135143A TW200421506A TW 200421506 A TW200421506 A TW 200421506A TW 092135143 A TW092135143 A TW 092135143A TW 92135143 A TW92135143 A TW 92135143A TW 200421506 A TW200421506 A TW 200421506A
Authority
TW
Taiwan
Prior art keywords
conductor
capillary
bonding
lead
inclined wedge
Prior art date
Application number
TW092135143A
Other languages
English (en)
Chinese (zh)
Other versions
TWI300601B (https=
Inventor
Tatsunari Mii
Hiroshi Watanabe
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200421506A publication Critical patent/TW200421506A/zh
Application granted granted Critical
Publication of TWI300601B publication Critical patent/TWI300601B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K13/00—Devices for grooming or caring of animals, e.g. curry-combs; Fetlock rings; Tail-holders; Devices for preventing crib-biting; Washing devices; Protection against weather conditions or insects
    • A01K13/001—Washing, cleaning, or drying devices
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46B—BRUSHES
    • A46B9/00—Arrangements of the bristles in the brush body
    • A46B9/02—Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
    • A46B9/04—Arranged like in or for toothbrushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Animal Behavior & Ethology (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Wire Bonding (AREA)
TW092135143A 2003-02-17 2003-12-12 Wire bonding method TW200421506A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003038314A JP2004247674A (ja) 2003-02-17 2003-02-17 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
TW200421506A true TW200421506A (en) 2004-10-16
TWI300601B TWI300601B (https=) 2008-09-01

Family

ID=32866387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092135143A TW200421506A (en) 2003-02-17 2003-12-12 Wire bonding method

Country Status (4)

Country Link
US (1) US7025247B2 (https=)
JP (1) JP2004247674A (https=)
KR (1) KR20040074914A (https=)
TW (1) TW200421506A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827950B (zh) * 2020-07-15 2024-01-01 日商新川股份有限公司 打線接合裝置及半導體裝置的製造方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7188759B2 (en) * 2004-09-08 2007-03-13 Kulicke And Soffa Industries, Inc. Methods for forming conductive bumps and wire loops
JP4137061B2 (ja) * 2005-01-11 2008-08-20 株式会社カイジョー ワイヤループ形状、そのワイヤループ形状を備えた半導体装置、ワイヤボンディング方法
JP4298665B2 (ja) 2005-02-08 2009-07-22 株式会社新川 ワイヤボンディング方法
KR20060091622A (ko) * 2005-02-16 2006-08-21 삼성테크윈 주식회사 와이어 본딩 방법
US20070216026A1 (en) * 2006-03-20 2007-09-20 Adams Zhu Aluminum bump bonding for fine aluminum wire
JP4694405B2 (ja) * 2006-04-12 2011-06-08 ローム株式会社 ワイヤボンディング方法
US20090042339A1 (en) * 2007-08-10 2009-02-12 Texas Instruments Incorporated Packaged integrated circuits and methods to form a packaged integrated circuit
JP4625858B2 (ja) * 2008-09-10 2011-02-02 株式会社カイジョー ワイヤボンディング方法、ワイヤボンディング装置及びワイヤボンディング制御プログラム
KR101610827B1 (ko) 2009-12-03 2016-04-08 삼성전자주식회사 본딩 구조물의 형성 방법
JP5359977B2 (ja) * 2010-04-12 2013-12-04 株式会社デンソー ワイヤボンディング方法
US9082753B2 (en) * 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
KR102621753B1 (ko) 2018-09-28 2024-01-05 삼성전자주식회사 본딩 와이어, 이를 포함하는 반도체 패키지, 및 와이어 본딩 방법
CN119725286A (zh) * 2023-09-28 2025-03-28 恩智浦美国有限公司 封装半导体装置和其制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5485949A (en) * 1993-04-30 1996-01-23 Matsushita Electric Industrial Co., Ltd. Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary
JP3344235B2 (ja) 1996-10-07 2002-11-11 株式会社デンソー ワイヤボンディング方法
JP3913134B2 (ja) * 2002-08-08 2007-05-09 株式会社カイジョー バンプの形成方法及びバンプ
JP3570551B2 (ja) 2001-03-16 2004-09-29 株式会社カイジョー ワイヤボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827950B (zh) * 2020-07-15 2024-01-01 日商新川股份有限公司 打線接合裝置及半導體裝置的製造方法

Also Published As

Publication number Publication date
JP2004247674A (ja) 2004-09-02
US7025247B2 (en) 2006-04-11
KR20040074914A (ko) 2004-08-26
US20040164127A1 (en) 2004-08-26
TWI300601B (https=) 2008-09-01

Similar Documents

Publication Publication Date Title
JP3913134B2 (ja) バンプの形成方法及びバンプ
TW200421506A (en) Wire bonding method
US6946380B2 (en) Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
KR100817646B1 (ko) 플립칩 상호연결 구조물
US8129263B2 (en) Wire bond interconnection and method of manufacture thereof
TWM429190U (en) Surface mount type contact and connector using same
TW200926378A (en) Package substrate having electrical connecting structure and semiconductor package structure thereof
JP4309948B2 (ja) リードピン付き配線基板およびリードピン
JP3570551B2 (ja) ワイヤボンディング方法
JP4629284B2 (ja) 半導体装置およびその製造方法
CN107230644A (zh) 具有金属海绵的金属柱
JPH06216505A (ja) プリント配線板への端子の接続方法
JPH01220494A (ja) 多層配線基板
JP2008166432A (ja) クラックを生じにくい半田接合部、該半田接続部を備える回路基板などの電子部品、半導体装置、及び電子部品の製造方法
JP2004296624A (ja) 半導体装置
JP3855532B2 (ja) Ｉｃチップと回路基板との接続方法
JPH05326601A (ja) ワイヤボンディング方法
TWI302721B (https=)
JP2000323515A (ja) Ｉｃチップと回路基板との接続方法
JP2000357700A (ja) ボールボンディング方法および電子部品の接続方法
JP2001068497A (ja) 半導体素子と回路基板との接続方法
JP2000252315A (ja) Ｉｃチップと回路基板との接続方法
JP2004200196A (ja) フレキシブル基板および半導体装置
JPH08241950A (ja) 半導体装置及びその実装方法
JP2021072357A (ja) 金属端子及び接続構造