TW200421374A - Feature formation in thick-film inks - Google Patents

Feature formation in thick-film inks Download PDF

Info

Publication number
TW200421374A
TW200421374A TW092129566A TW92129566A TW200421374A TW 200421374 A TW200421374 A TW 200421374A TW 092129566 A TW092129566 A TW 092129566A TW 92129566 A TW92129566 A TW 92129566A TW 200421374 A TW200421374 A TW 200421374A
Authority
TW
Taiwan
Prior art keywords
thick film
film ink
photoimageable material
substrate
deposited
Prior art date
Application number
TW092129566A
Other languages
English (en)
Chinese (zh)
Inventor
Marvin Glenn Wong
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200421374A publication Critical patent/TW200421374A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00—Switches operated by change of a physical condition
    • H01H35/24—Switches operated by change of fluid pressure, by fluid pressure waves, or by change of fluid flow
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H29/00—Switches having at least one liquid contact
    • H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
  • Printing Methods (AREA)
TW092129566A 2003-04-14 2003-10-24 Feature formation in thick-film inks TW200421374A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/413,854 US7070908B2 (en) 2003-04-14 2003-04-14 Feature formation in thick-film inks

Publications (1)

Publication Number Publication Date
TW200421374A true TW200421374A (en) 2004-10-16

Family

ID=32176449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092129566A TW200421374A (en) 2003-04-14 2003-10-24 Feature formation in thick-film inks

Country Status (5)

Country Link
US (1) US7070908B2 (enExample)
JP (1) JP2004320013A (enExample)
DE (1) DE10360987A1 (enExample)
GB (1) GB2401993B (enExample)
TW (1) TW200421374A (enExample)

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CN103764349B (zh) 2011-06-30 2017-06-09 圣戈本陶瓷及塑料股份有限公司 液相烧结碳化硅研磨颗粒
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KR20140106737A (ko) 2011-12-30 2014-09-03 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자들 형성
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US9242346B2 (en) 2012-03-30 2016-01-26 Saint-Gobain Abrasives, Inc. Abrasive products having fibrillated fibers
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CN106029301B (zh) 2013-12-31 2018-09-18 圣戈班磨料磨具有限公司 包括成形磨粒的研磨制品
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Also Published As

Publication number Publication date
GB0405762D0 (en) 2004-04-21
JP2004320013A (ja) 2004-11-11
DE10360987A1 (de) 2004-11-25
US20040202844A1 (en) 2004-10-14
GB2401993B (en) 2006-07-05
US7070908B2 (en) 2006-07-04
GB2401993A (en) 2004-11-24

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