TW200301538A - Substrate holding unit, exposure apparatus, and device manufacturing method - Google Patents

Substrate holding unit, exposure apparatus, and device manufacturing method Download PDF

Info

Publication number
TW200301538A
TW200301538A TW091136372A TW91136372A TW200301538A TW 200301538 A TW200301538 A TW 200301538A TW 091136372 A TW091136372 A TW 091136372A TW 91136372 A TW91136372 A TW 91136372A TW 200301538 A TW200301538 A TW 200301538A
Authority
TW
Taiwan
Prior art keywords
aforementioned
substrate
wafer
driving
exposure
Prior art date
Application number
TW091136372A
Other languages
English (en)
Chinese (zh)
Inventor
Makoto Kondo
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200301538A publication Critical patent/TW200301538A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
TW091136372A 2001-12-17 2002-12-17 Substrate holding unit, exposure apparatus, and device manufacturing method TW200301538A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001382897 2001-12-17

Publications (1)

Publication Number Publication Date
TW200301538A true TW200301538A (en) 2003-07-01

Family

ID=19187525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091136372A TW200301538A (en) 2001-12-17 2002-12-17 Substrate holding unit, exposure apparatus, and device manufacturing method

Country Status (4)

Country Link
JP (1) JPWO2003052804A1 (fr)
AU (1) AU2002354196A1 (fr)
TW (1) TW200301538A (fr)
WO (1) WO2003052804A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449109B (fr) * 2011-12-13 2014-08-11
TWI487001B (zh) * 2007-11-14 2015-06-01 尼康股份有限公司 A surface position detecting device, a surface position detecting method, an exposure apparatus, and an element manufacturing method

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332112A1 (de) * 2003-07-09 2005-01-27 Carl Zeiss Smt Ag Projektionsbelichtungsverfahren und Projektionsbelichtungssystem
JP2005259870A (ja) * 2004-03-10 2005-09-22 Nikon Corp 基板保持装置、ステージ装置及び露光装置並びに露光方法
SG10201710046XA (en) * 2004-06-09 2018-01-30 Nippon Kogaku Kk Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate
JP2008140832A (ja) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd ピンチャック式チャックテーブルおよびそれを用いた切削加工装置
JP4826466B2 (ja) * 2006-12-26 2011-11-30 大日本印刷株式会社 露光機のワークステージを用いた露光方法
JP4858636B2 (ja) * 2009-09-29 2012-01-18 株式会社デンソー 半導体装置の金属電極形成方法及び金属電極形成装置
KR20220008392A (ko) * 2011-08-12 2022-01-20 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
NL2009874A (en) * 2011-12-23 2013-06-26 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
JP5912654B2 (ja) 2012-02-24 2016-04-27 株式会社東芝 基板保持装置及びパターン転写装置並びにパターン転写方法
JP6579873B2 (ja) * 2015-09-10 2019-09-25 株式会社ディスコ 加工装置
JP7432354B2 (ja) 2019-12-19 2024-02-16 東京エレクトロン株式会社 熱処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867026A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ステップアンドリピート方式の露光装置
JPS58219735A (ja) * 1982-06-16 1983-12-21 Hitachi Ltd ステップアンドリピート方式のプロキシミティ露光装置
JP3487368B2 (ja) * 1994-09-30 2004-01-19 株式会社ニコン 走査型露光装置
JPH08195335A (ja) * 1995-01-13 1996-07-30 Hitachi Ltd 露光方法及び露光装置
JPH08321457A (ja) * 1995-05-26 1996-12-03 Nikon Corp 露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487001B (zh) * 2007-11-14 2015-06-01 尼康股份有限公司 A surface position detecting device, a surface position detecting method, an exposure apparatus, and an element manufacturing method
TWI449109B (fr) * 2011-12-13 2014-08-11

Also Published As

Publication number Publication date
JPWO2003052804A1 (ja) 2005-04-28
WO2003052804A1 (fr) 2003-06-26
AU2002354196A1 (en) 2003-06-30

Similar Documents

Publication Publication Date Title
US7218383B2 (en) Holding system, exposure apparatus, and device manufacturing method
TWI237744B (en) Level sensor for lithographic apparatus
KR101539153B1 (ko) 노광 방법 및 노광 장치, 그리고 디바이스 제조 방법
WO2006006730A1 (fr) Équipement pour moteur planaire, équipement à étages, équipement d’exposition et méthode de fabrication du dispositif
TW200301538A (en) Substrate holding unit, exposure apparatus, and device manufacturing method
JP4599334B2 (ja) 物品支持部材を製造する方法
US6937319B2 (en) Exposure method and apparatus with vibration-preventative control
JP2006278820A (ja) 露光方法及び装置
WO1999036949A1 (fr) Procede d'exposition et systeme de lithographie, appareil d'exposition et son procede de fabrication
JP2010182866A (ja) 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法
JP2001044116A (ja) 光学補正板、およびリソグラフィ投影装置でのその応用
US6381005B1 (en) Mask holding device, exposure apparatus and device manufacturing method
US7123350B2 (en) Substrate holding device, substrate processing apparatus using the same, and method for aligning and holding substrate
TWI791238B (zh) 半導體處理系統與半導體處理方法
JP2004221296A (ja) 基板保持装置及び露光装置、並びにデバイス製造方法
JP3634539B2 (ja) マスク保持装置、露光装置、デバイス製造方法、及びマスク構造体
TWI269123B (en) Lithographic apparatus and lithographic manufacturing method
JP5644416B2 (ja) 光学ユニット、光学系、露光装置、及びデバイスの製造方法
JP2003156322A (ja) 位置計測方法及び装置、位置決め方法、露光装置、並びにマイクロデバイスの製造方法
JP4382054B2 (ja) リソグラフィ装置、およびフラットパネルディスプレイハンドラを使用するデバイス製造方法
JP2015522838A (ja) リソグラフィ装置およびデバイス製造方法
JP2009302149A (ja) 露光装置およびデバイスの製造方法
JP2009177126A (ja) マスクブランクス、マスク、マスク保持装置、露光装置及びデバイスの製造方法
TWI234189B (en) A method of aligning a substrate, a computer readable medium, a device manufacturing method and a device manufactured thereby
JPH09219357A (ja) 露光装置