AU2002354196A1 - Substrate holding apparatus, exposure apparatus, and device manufacturing method - Google Patents
Substrate holding apparatus, exposure apparatus, and device manufacturing methodInfo
- Publication number
- AU2002354196A1 AU2002354196A1 AU2002354196A AU2002354196A AU2002354196A1 AU 2002354196 A1 AU2002354196 A1 AU 2002354196A1 AU 2002354196 A AU2002354196 A AU 2002354196A AU 2002354196 A AU2002354196 A AU 2002354196A AU 2002354196 A1 AU2002354196 A1 AU 2002354196A1
- Authority
- AU
- Australia
- Prior art keywords
- device manufacturing
- substrate holding
- exposure apparatus
- holding apparatus
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-382897 | 2001-12-17 | ||
JP2001382897 | 2001-12-17 | ||
PCT/JP2002/013180 WO2003052804A1 (en) | 2001-12-17 | 2002-12-17 | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002354196A1 true AU2002354196A1 (en) | 2003-06-30 |
Family
ID=19187525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002354196A Abandoned AU2002354196A1 (en) | 2001-12-17 | 2002-12-17 | Substrate holding apparatus, exposure apparatus, and device manufacturing method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2003052804A1 (en) |
AU (1) | AU2002354196A1 (en) |
TW (1) | TW200301538A (en) |
WO (1) | WO2003052804A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10332112A1 (en) * | 2003-07-09 | 2005-01-27 | Carl Zeiss Smt Ag | Manufacturing semiconductor, other finely-structured components involves setting working distance at least temporarily to less than maximum size of optical near field of emanating projection light |
JP2005259870A (en) * | 2004-03-10 | 2005-09-22 | Nikon Corp | Substrate retainer, stage device, exposing device and exposing method |
SG10201710046XA (en) * | 2004-06-09 | 2018-01-30 | Nippon Kogaku Kk | Substrate holding device, exposure apparatus having same, exposure method, method for producing device, and liquid repellent plate |
JP2008140832A (en) * | 2006-11-30 | 2008-06-19 | Disco Abrasive Syst Ltd | Pin chuck type chuck table and cutting working device using the same |
JP4826466B2 (en) * | 2006-12-26 | 2011-11-30 | 大日本印刷株式会社 | Exposure method using work stage of exposure machine |
US8111406B2 (en) * | 2007-11-14 | 2012-02-07 | Nikon Corporation | Surface position detecting apparatus, surface position detecting method, exposure apparatus, and device manufacturing method |
JP4858636B2 (en) * | 2009-09-29 | 2012-01-18 | 株式会社デンソー | Metal electrode forming method and metal electrode forming apparatus for semiconductor device |
KR20220008392A (en) | 2011-08-12 | 2022-01-20 | 에베 그룹 에. 탈너 게엠베하 | Apparatus and method for bonding substrates |
TW201324617A (en) * | 2011-12-13 | 2013-06-16 | Metal Ind Res & Dev Ct | Heating device with heat expansion gap monitoring function |
NL2009874A (en) | 2011-12-23 | 2013-06-26 | Asml Netherlands Bv | Support, lithographic apparatus and device manufacturing method. |
JP5912654B2 (en) | 2012-02-24 | 2016-04-27 | 株式会社東芝 | Substrate holding device, pattern transfer device, and pattern transfer method |
JP6579873B2 (en) * | 2015-09-10 | 2019-09-25 | 株式会社ディスコ | Processing equipment |
JP7432354B2 (en) | 2019-12-19 | 2024-02-16 | 東京エレクトロン株式会社 | heat treatment equipment |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5867026A (en) * | 1981-10-19 | 1983-04-21 | Hitachi Ltd | Thin plate metamorphosis device |
JPS58219735A (en) * | 1982-06-16 | 1983-12-21 | Hitachi Ltd | Thin plate exposure method and device therefor |
JP3487368B2 (en) * | 1994-09-30 | 2004-01-19 | 株式会社ニコン | Scanning exposure equipment |
JPH08195335A (en) * | 1995-01-13 | 1996-07-30 | Hitachi Ltd | Exposure method and exposure system |
JPH08321457A (en) * | 1995-05-26 | 1996-12-03 | Nikon Corp | Aligner |
-
2002
- 2002-12-17 JP JP2003553607A patent/JPWO2003052804A1/en not_active Withdrawn
- 2002-12-17 TW TW091136372A patent/TW200301538A/en unknown
- 2002-12-17 WO PCT/JP2002/013180 patent/WO2003052804A1/en active Application Filing
- 2002-12-17 AU AU2002354196A patent/AU2002354196A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JPWO2003052804A1 (en) | 2005-04-28 |
WO2003052804A1 (en) | 2003-06-26 |
TW200301538A (en) | 2003-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |