SK286415B6 - Zariadenie na rozrezávanie materiálov a spôsob rozrezávania materiálov - Google Patents

Zariadenie na rozrezávanie materiálov a spôsob rozrezávania materiálov Download PDF

Info

Publication number
SK286415B6
SK286415B6 SK978-2002A SK9782002A SK286415B6 SK 286415 B6 SK286415 B6 SK 286415B6 SK 9782002 A SK9782002 A SK 9782002A SK 286415 B6 SK286415 B6 SK 286415B6
Authority
SK
Slovakia
Prior art keywords
cutting
coolant
lubricant
cutting disc
cleaning agent
Prior art date
Application number
SK978-2002A
Other languages
English (en)
Slovak (sk)
Other versions
SK9782002A3 (en
Inventor
Ralf Hammer
Ralf Gruszynsky
Andr Kleinwechter
Tilo Flade
Original Assignee
Freiberger Compound Materials Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freiberger Compound Materials Gmbh filed Critical Freiberger Compound Materials Gmbh
Publication of SK9782002A3 publication Critical patent/SK9782002A3/sk
Publication of SK286415B6 publication Critical patent/SK286415B6/sk

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
SK978-2002A 2000-11-08 2001-10-17 Zariadenie na rozrezávanie materiálov a spôsob rozrezávania materiálov SK286415B6 (sk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10055286A DE10055286A1 (de) 2000-11-08 2000-11-08 Vorrichtung und Verfahren zum Trennen von Werkstoffen
PCT/EP2001/012032 WO2002038349A1 (de) 2000-11-08 2001-10-17 Vorrichtung und verfahren zum trennen von werkstoffen

Publications (2)

Publication Number Publication Date
SK9782002A3 SK9782002A3 (en) 2002-12-03
SK286415B6 true SK286415B6 (sk) 2008-09-05

Family

ID=7662530

Family Applications (1)

Application Number Title Priority Date Filing Date
SK978-2002A SK286415B6 (sk) 2000-11-08 2001-10-17 Zariadenie na rozrezávanie materiálov a spôsob rozrezávania materiálov

Country Status (11)

Country Link
US (1) US20030005919A1 (de)
EP (1) EP1224067B1 (de)
JP (2) JP4302979B2 (de)
CN (2) CN101066616A (de)
AT (1) ATE271962T1 (de)
CZ (1) CZ301194B6 (de)
DE (2) DE10055286A1 (de)
RU (1) RU2271927C2 (de)
SK (1) SK286415B6 (de)
TW (1) TW590842B (de)
WO (1) WO2002038349A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105049844B (zh) * 2010-09-30 2017-07-28 三星电子株式会社 通过使用平滑插值滤波器对图像进行插值的方法和装置
KR20120037576A (ko) * 2010-10-12 2012-04-20 주식회사 엘지실트론 단결정 잉곳 절단장치 및 단결정 잉곳 절단방법
DE102011008400B4 (de) 2011-01-12 2014-07-10 Siltronic Ag Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen
JP6722917B2 (ja) * 2016-04-26 2020-07-15 三星ダイヤモンド工業株式会社 スクライブヘッドユニット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1301500A (fr) * 1960-08-19 1962-08-17 Hydrol Chemical Company Ltd Machine à meuler
FR2557000B1 (fr) * 1983-12-23 1987-08-07 Essilor Int Poste de meulage pour machine a meuler, notamment pour le biseautage ou le rainurage d'une lentille ophtalmique
DE3640645A1 (de) * 1986-11-28 1988-06-09 Wacker Chemitronic Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben
JP2979870B2 (ja) * 1992-11-27 1999-11-15 信越半導体株式会社 半導体インゴットのコーン状端部切除方法
DE4309134C2 (de) * 1993-03-22 1999-03-04 Wilfried Wahl Verfahren zur Schmierung und Kühlung von Schneiden und/oder Werkstücken bei zerspanenden Arbeitsprozessen
JPH06328433A (ja) * 1993-05-20 1994-11-29 Tokyo Seimitsu Co Ltd スライシングマシン
JPH07304028A (ja) * 1994-05-13 1995-11-21 Nippon Steel Corp スライシングマシン
SG70097A1 (en) * 1997-08-15 2000-01-25 Disio Corp Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
US6386948B1 (en) * 1999-06-01 2002-05-14 Sumitomo Special Metals Co., Ltd. Magnet member cutting method and magnet member cutting

Also Published As

Publication number Publication date
ATE271962T1 (de) 2004-08-15
CZ301194B6 (cs) 2009-12-02
JP2004512989A (ja) 2004-04-30
TW590842B (en) 2004-06-11
CN100396460C (zh) 2008-06-25
RU2002118120A (ru) 2004-01-20
CN101066616A (zh) 2007-11-07
SK9782002A3 (en) 2002-12-03
CN1394161A (zh) 2003-01-29
EP1224067B1 (de) 2004-07-28
JP2008135712A (ja) 2008-06-12
EP1224067A1 (de) 2002-07-24
JP4302979B2 (ja) 2009-07-29
CZ20022365A3 (cs) 2002-10-16
DE50102989D1 (de) 2004-09-02
US20030005919A1 (en) 2003-01-09
DE10055286A1 (de) 2002-05-23
WO2002038349A1 (de) 2002-05-16
RU2271927C2 (ru) 2006-03-20

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Legal Events

Date Code Title Description
MM4A Patent lapsed due to non-payment of maintenance fees

Effective date: 20091017