JPH0366106B2 - - Google Patents
Info
- Publication number
- JPH0366106B2 JPH0366106B2 JP24424384A JP24424384A JPH0366106B2 JP H0366106 B2 JPH0366106 B2 JP H0366106B2 JP 24424384 A JP24424384 A JP 24424384A JP 24424384 A JP24424384 A JP 24424384A JP H0366106 B2 JPH0366106 B2 JP H0366106B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cut
- cutting
- workpiece
- machining fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003754 machining Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 description 31
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24424384A JPS61121870A (ja) | 1984-11-19 | 1984-11-19 | 脆性材料の切断方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24424384A JPS61121870A (ja) | 1984-11-19 | 1984-11-19 | 脆性材料の切断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61121870A JPS61121870A (ja) | 1986-06-09 |
JPH0366106B2 true JPH0366106B2 (de) | 1991-10-16 |
Family
ID=17115861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24424384A Granted JPS61121870A (ja) | 1984-11-19 | 1984-11-19 | 脆性材料の切断方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61121870A (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH678298A5 (en) * | 1988-05-09 | 1991-08-30 | Charles Hauser | Slicer for materials used in electronic components |
JP4083152B2 (ja) * | 2004-07-29 | 2008-04-30 | 日本碍子株式会社 | ワイヤーソー装置 |
JP2007021676A (ja) * | 2005-07-19 | 2007-02-01 | Asahi Diamond Industrial Co Ltd | ノズル装置、ワイヤ加工装置、及びワイヤ加工方法 |
JP5561194B2 (ja) * | 2011-02-04 | 2014-07-30 | 株式会社デンソー | ワイヤーソー装置 |
JP6159088B2 (ja) * | 2013-01-10 | 2017-07-05 | トーヨーエイテック株式会社 | ワイヤソー |
CN105500534A (zh) * | 2014-05-08 | 2016-04-20 | 沈棋 | 一种改进的多形状手动瓷砖切割机 |
JP6589744B2 (ja) * | 2016-06-07 | 2019-10-16 | 株式会社Sumco | ワークの切断方法 |
-
1984
- 1984-11-19 JP JP24424384A patent/JPS61121870A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61121870A (ja) | 1986-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |