SG97310A1 - Photosemiconductor encapsulating resin composition - Google Patents

Photosemiconductor encapsulating resin composition

Info

Publication number
SG97310A1
SG97310A1 SG200302845A SG200302845A SG97310A1 SG 97310 A1 SG97310 A1 SG 97310A1 SG 200302845 A SG200302845 A SG 200302845A SG 200302845 A SG200302845 A SG 200302845A SG 97310 A1 SG97310 A1 SG 97310A1
Authority
SG
Singapore
Prior art keywords
group
polyvalent carboxylic
resin composition
encapsulating resin
alkylene group
Prior art date
Application number
SG200302845A
Other languages
English (en)
Inventor
Toshiyuki Hasegawa
Yujiro Kawaguchi
Shigeki Naitoh
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of SG97310A1 publication Critical patent/SG97310A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
    • H10K85/621—Aromatic anhydride or imide compounds, e.g. perylene tetra-carboxylic dianhydride or perylene tetracarboxylic di-imide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG200302845A 2001-09-14 2002-09-12 Photosemiconductor encapsulating resin composition SG97310A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001279518 2001-09-14

Publications (1)

Publication Number Publication Date
SG97310A1 true SG97310A1 (en) 2006-09-29

Family

ID=19103695

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200302845A SG97310A1 (en) 2001-09-14 2002-09-12 Photosemiconductor encapsulating resin composition

Country Status (9)

Country Link
US (2) US7423083B2 (fr)
EP (1) EP1426394A4 (fr)
JP (1) JP2009041028A (fr)
KR (2) KR100946607B1 (fr)
CN (1) CN1247651C (fr)
CA (1) CA2442314A1 (fr)
SG (1) SG97310A1 (fr)
TW (1) TWI300073B (fr)
WO (1) WO2003025043A1 (fr)

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* Cited by examiner, † Cited by third party
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CN1247651C (zh) * 2001-09-14 2006-03-29 住友化学工业株式会社 光电半导体密封用树脂组合物
US20060235717A1 (en) * 2005-04-18 2006-10-19 Solaria Corporation Method and system for manufacturing solar panels using an integrated solar cell using a plurality of photovoltaic regions
US20070095386A1 (en) * 2005-06-06 2007-05-03 Solaria Corporation Method and system for integrated solar cell using a plurality of photovoltaic regions
US20080178922A1 (en) * 2005-07-26 2008-07-31 Solaria Corporation Method and system for manufacturing solar panels using an integrated solar cell using a plurality of photovoltaic regions
US8227688B1 (en) 2005-10-17 2012-07-24 Solaria Corporation Method and resulting structure for assembling photovoltaic regions onto lead frame members for integration on concentrating elements for solar cells
US7910822B1 (en) 2005-10-17 2011-03-22 Solaria Corporation Fabrication process for photovoltaic cell
US7910392B2 (en) 2007-04-02 2011-03-22 Solaria Corporation Method and system for assembling a solar cell package
US20090056806A1 (en) * 2007-09-05 2009-03-05 Solaria Corporation Solar cell structure including a plurality of concentrator elements with a notch design and predetermined radii and method
US8119902B2 (en) 2007-05-21 2012-02-21 Solaria Corporation Concentrating module and method of manufacture for photovoltaic strips
US7910035B2 (en) 2007-12-12 2011-03-22 Solaria Corporation Method and system for manufacturing integrated molded concentrator photovoltaic device
CN104650020B (zh) * 2008-01-09 2017-11-17 日立化成株式会社 多元羧酸缩合体及其制造方法、环氧树脂用固化剂及其制造方法以及聚酰胺树脂、聚酯树脂
US8637593B2 (en) * 2008-01-09 2014-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate
TWI370525B (en) * 2008-04-25 2012-08-11 Ind Tech Res Inst Encapsulant composition and method for fabricating encapsulant material
USD699176S1 (en) 2011-06-02 2014-02-11 Solaria Corporation Fastener for solar modules
JP6125349B2 (ja) * 2013-06-25 2017-05-10 日本カーバイド工業株式会社 熱硬化性組成物
WO2015182697A1 (fr) * 2014-05-30 2015-12-03 積水化学工業株式会社 Composition de résine durcissable à la lumière/l'humidité, adhésif pour composants électroniques et adhésif pour éléments d'affichage
KR102224073B1 (ko) * 2016-06-28 2021-03-08 도레이 카부시키가이샤 에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료

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JPH06281801A (ja) * 1992-01-14 1994-10-07 Sanyo Chem Ind Ltd 熱硬化性組成物およびカラーフィルターの表面保護剤
GB2294044A (en) * 1994-10-11 1996-04-17 Daicel Chem Alkenyl and epoxy (meth)acrylates and polymers thereof
JPH09100274A (ja) * 1995-10-04 1997-04-15 Daicel Chem Ind Ltd エポキシ環およびアルケニル基を有する（メタ）アクリレートとその製造方法
JP2000159860A (ja) * 1998-11-27 2000-06-13 Hitachi Chem Co Ltd 耐熱性樹脂組成物

Also Published As

Publication number Publication date
CN1507462A (zh) 2004-06-23
KR20090027737A (ko) 2009-03-17
CA2442314A1 (fr) 2003-03-27
KR100946609B1 (ko) 2010-03-09
CN1247651C (zh) 2006-03-29
US7919550B2 (en) 2011-04-05
EP1426394A4 (fr) 2010-11-03
TWI300073B (en) 2008-08-21
EP1426394A1 (fr) 2004-06-09
US7423083B2 (en) 2008-09-09
US20040092668A1 (en) 2004-05-13
JP2009041028A (ja) 2009-02-26
KR20040032099A (ko) 2004-04-14
US20080249220A1 (en) 2008-10-09
WO2003025043A1 (fr) 2003-03-27
KR100946607B1 (ko) 2010-03-09

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