SG84563A1 - Method for manufacturing electronic component of laminated ceramics - Google Patents

Method for manufacturing electronic component of laminated ceramics

Info

Publication number
SG84563A1
SG84563A1 SG200000587A SG200000587A SG84563A1 SG 84563 A1 SG84563 A1 SG 84563A1 SG 200000587 A SG200000587 A SG 200000587A SG 200000587 A SG200000587 A SG 200000587A SG 84563 A1 SG84563 A1 SG 84563A1
Authority
SG
Singapore
Prior art keywords
electronic component
manufacturing electronic
laminated ceramics
ceramics
laminated
Prior art date
Application number
SG200000587A
Other languages
English (en)
Inventor
Baba Hiroyuki
Kato Koji
Yoneda Yasunobu
Hosokawa Takao
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of SG84563A1 publication Critical patent/SG84563A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B35/00—Stereoscopic photography
    • G03B35/18—Stereoscopic photography by simultaneous viewing
    • G03B35/22—Stereoscopic photography by simultaneous viewing using single projector with stereoscopic-base-defining system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/595—Aspects relating to the structure of the interlayer whereby the interlayer is continuous, but heterogeneous on macro-scale, e.g. one part of the interlayer being a joining material, another part being an electrode material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/708—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the interlayers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
SG200000587A 1999-02-23 2000-02-02 Method for manufacturing electronic component of laminated ceramics SG84563A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4418199 1999-02-23
JP37464499A JP3758442B2 (ja) 1999-02-23 1999-12-28 積層セラミックコンデンサの製造方法

Publications (1)

Publication Number Publication Date
SG84563A1 true SG84563A1 (en) 2001-11-20

Family

ID=26384034

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200000587A SG84563A1 (en) 1999-02-23 2000-02-02 Method for manufacturing electronic component of laminated ceramics

Country Status (7)

Country Link
US (1) US6475317B1 (ja)
JP (1) JP3758442B2 (ja)
KR (1) KR100356487B1 (ja)
CN (1) CN1282206C (ja)
GB (1) GB2347383B (ja)
MY (1) MY120376A (ja)
SG (1) SG84563A1 (ja)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
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US7435613B2 (en) * 2001-02-12 2008-10-14 Agere Systems Inc. Methods of fabricating a membrane with improved mechanical integrity
GB2376207B (en) * 2001-05-25 2005-03-30 Kyocera Corp Method of producing ceramic laminates,laminated electronic parts and method of producing the same
JP4663173B2 (ja) * 2001-08-03 2011-03-30 京セラ株式会社 セラミック積層体の製法
JP3726035B2 (ja) * 2001-05-25 2005-12-14 京セラ株式会社 セラミック積層体の製法
JP2003017362A (ja) * 2001-06-28 2003-01-17 Kyocera Corp セラミック積層体の製法
JP4035988B2 (ja) * 2001-12-06 2008-01-23 株式会社デンソー セラミック積層体及びその製造方法
US20030111158A1 (en) * 2001-12-14 2003-06-19 Murata Manufacturing Co., Ltd. Method for manufacturing multilayer ceramic electronic element
JP2004111939A (ja) * 2002-08-29 2004-04-08 Ngk Insulators Ltd 積層型圧電素子及びその製造方法
JP3940421B2 (ja) * 2003-07-09 2007-07-04 Ｔｄｋ株式会社 積層セラミック部品およびその製造方法
US7732326B2 (en) * 2004-02-25 2010-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device having a second level of metallization formed over a first level with minimal damage to the first level and method
JP4151846B2 (ja) * 2004-03-03 2008-09-17 Ｔｄｋ株式会社 積層セラミック電子部品、回路基板等、および当該部品、基板等の製造に供せられるセラミックグリーンシートの製造方法
JP4483508B2 (ja) * 2004-07-27 2010-06-16 Ｔｄｋ株式会社 積層型電子部品の製造方法
JP4650616B2 (ja) * 2005-01-25 2011-03-16 Ｔｄｋ株式会社 積層電子部品の製造方法
JP2006253371A (ja) * 2005-03-10 2006-09-21 Tdk Corp 多端子型積層コンデンサ及びその製造方法
JP2006286860A (ja) * 2005-03-31 2006-10-19 Tdk Corp 積層電子部品及びその製造方法
JP4784264B2 (ja) * 2005-10-31 2011-10-05 Ｔｄｋ株式会社 積層型電子部品の製造方法
CN100414336C (zh) * 2006-01-12 2008-08-27 群光电子股份有限公司 镜头座的防止溢胶结构
US20070193675A1 (en) * 2006-02-22 2007-08-23 Abhijit Gurav Process of manufacturing a multilayer device and device manufactured thereby
US20070227641A1 (en) * 2006-04-04 2007-10-04 Skamser Daniel J Flowable compensation layer for multilayer devices
JP4807169B2 (ja) * 2006-07-07 2011-11-02 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
EP1993228B1 (en) * 2007-05-18 2012-05-23 Huawei Technologies Co., Ltd. Message sending method, message sending device and message transmission system
US7579937B2 (en) * 2007-11-07 2009-08-25 Tdk Corporation Laminated inductor and method of manufacture of same
JP4737182B2 (ja) * 2007-11-07 2011-07-27 Ｔｄｋ株式会社 積層型インダクタ及びその製造方法
JP4737181B2 (ja) * 2007-11-07 2011-07-27 Ｔｄｋ株式会社 積層型インダクタ及びその製造方法
JP5071493B2 (ja) * 2010-02-26 2012-11-14 Ｔｄｋ株式会社 積層型電子部品の製造方法
JP5678905B2 (ja) * 2011-03-14 2015-03-04 株式会社村田製作所 積層セラミック電子部品の製造方法
KR20160000753A (ko) 2014-06-25 2016-01-05 삼성전기주식회사 박막형 커패시터 소자 및 이의 제조 방법
JP6390705B2 (ja) * 2014-07-02 2018-09-19 株式会社村田製作所 積層型電子部品の製造方法
JP6119921B2 (ja) * 2014-09-10 2017-04-26 株式会社村田製作所 Ｅｓｄ保護装置およびその製造方法
KR101762032B1 (ko) * 2015-11-27 2017-07-26 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조 방법
DE112017003656T5 (de) * 2016-07-21 2019-04-04 Ngk Insulators, Ltd. Herstellungsverfahren für Sensorelement
KR101952871B1 (ko) * 2017-04-13 2019-02-28 삼성전기주식회사 적층 세라믹 커패시터 및 그의 실장 기판
JP7356207B2 (ja) * 2017-12-22 2023-10-04 太陽誘電株式会社 積層セラミック電子部品、積層セラミック電子部品実装基板及び積層セラミック電子部品包装体
KR20200040429A (ko) 2018-10-10 2020-04-20 삼성전기주식회사 적층 세라믹 전자부품
KR20190121225A (ko) 2018-11-23 2019-10-25 삼성전기주식회사 커패시터 부품
US11600446B2 (en) * 2019-12-27 2023-03-07 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
US11367573B2 (en) * 2019-12-27 2022-06-21 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
WO2024029188A1 (ja) * 2022-08-05 2024-02-08 株式会社村田製作所 積層セラミック電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009744A (en) * 1987-08-10 1991-04-23 Murata Manufacturing Co., Ltd. Method of manufacturing laminated ceramic electronic component
US5316602A (en) * 1990-04-19 1994-05-31 Murata Manufacturing Co., Ltd. Method for manufacturing ceramic green sheet laminate for an electronic component
US5692280A (en) * 1994-06-02 1997-12-02 Murata Manufacturing Co., Ltd. Manufacturing method of laminated ceramic electronic components

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JPS52135051A (en) 1976-05-06 1977-11-11 Murata Manufacturing Co Method of manufacturing laminated ceramic capacitor
US4677254A (en) * 1985-08-07 1987-06-30 International Business Machines Corporation Process for minimizing distortion in multilayer ceramic substrates and the intermediate unsintered green ceramic substrate produced thereby
JPH01226140A (ja) 1988-03-07 1989-09-08 Matsushita Electric Ind Co Ltd 績層セラミック電子部品の製造方法
JPH0266916A (ja) * 1988-08-31 1990-03-07 Nec Corp 積層型セラミックコンデンサの製造方法
JPH03105905A (ja) * 1989-09-19 1991-05-02 Tokin Corp 積層セラミックコンデンサの製造方法
JPH0714745A (ja) 1993-06-28 1995-01-17 Murata Mfg Co Ltd セラミック積層電子部品の製造方法
DE4334059A1 (de) * 1993-10-06 1995-04-13 Philips Patentverwaltung Schichtverbundfolie, Mehrfarbensiebdruckverfahren zu ihrer Herstellung und ihre Verwendung
JPH09153429A (ja) * 1995-11-30 1997-06-10 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法
US5935358A (en) * 1998-04-17 1999-08-10 New Create Corporation Method of producing a laminate ceramic capacitor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009744A (en) * 1987-08-10 1991-04-23 Murata Manufacturing Co., Ltd. Method of manufacturing laminated ceramic electronic component
US5316602A (en) * 1990-04-19 1994-05-31 Murata Manufacturing Co., Ltd. Method for manufacturing ceramic green sheet laminate for an electronic component
US5692280A (en) * 1994-06-02 1997-12-02 Murata Manufacturing Co., Ltd. Manufacturing method of laminated ceramic electronic components

Also Published As

Publication number Publication date
KR100356487B1 (ko) 2002-10-18
JP2000311831A (ja) 2000-11-07
GB0002197D0 (en) 2000-03-22
JP3758442B2 (ja) 2006-03-22
MY120376A (en) 2005-10-31
KR20000076700A (ko) 2000-12-26
CN1264905A (zh) 2000-08-30
GB2347383A (en) 2000-09-06
US6475317B1 (en) 2002-11-05
CN1282206C (zh) 2006-10-25
GB2347383B (en) 2001-05-09

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