SG77142A1 - Gold alloy wire for wedge bonding and use thereof in wedge bonding - Google Patents

Gold alloy wire for wedge bonding and use thereof in wedge bonding

Info

Publication number
SG77142A1
SG77142A1 SG1997002742A SG1997002742A SG77142A1 SG 77142 A1 SG77142 A1 SG 77142A1 SG 1997002742 A SG1997002742 A SG 1997002742A SG 1997002742 A SG1997002742 A SG 1997002742A SG 77142 A1 SG77142 A1 SG 77142A1
Authority
SG
Singapore
Prior art keywords
wedge bonding
alloy wire
gold alloy
gold
weight
Prior art date
Application number
SG1997002742A
Other languages
English (en)
Inventor
Teruo Kikuchi
Mitsuyoshi Ishii
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG77142A1 publication Critical patent/SG77142A1/en

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
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SG1997002742A 1996-07-31 1997-07-31 Gold alloy wire for wedge bonding and use thereof in wedge bonding SG77142A1 (en)

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Application Number Priority Date Filing Date Title
JP20241396 1996-07-31
JP20227496 1996-07-31

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SG1997002742A SG77142A1 (en) 1996-07-31 1997-07-31 Gold alloy wire for wedge bonding and use thereof in wedge bonding

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KR (1) KR100294242B1 (zh)
CN (1) CN1154181C (zh)
DE (1) DE69708545T2 (zh)
MY (1) MY119444A (zh)
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CN1154181C (zh) 2004-06-16
US5945065A (en) 1999-08-31
KR100294242B1 (ko) 2001-11-14
CN1172349A (zh) 1998-02-04
DE69708545T2 (de) 2002-05-23
MY119444A (en) 2005-05-31
EP0822264B1 (en) 2001-11-28
KR980011960A (ko) 1998-04-30
DE69708545D1 (de) 2002-01-10
EP0822264A1 (en) 1998-02-04
TW398048B (en) 2000-07-11

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