JPH0745657A - ウェッジボンディング用ワイヤ - Google Patents

ウェッジボンディング用ワイヤ

Info

Publication number
JPH0745657A
JPH0745657A JP5204428A JP20442893A JPH0745657A JP H0745657 A JPH0745657 A JP H0745657A JP 5204428 A JP5204428 A JP 5204428A JP 20442893 A JP20442893 A JP 20442893A JP H0745657 A JPH0745657 A JP H0745657A
Authority
JP
Japan
Prior art keywords
alloy
wire
bonding
metal
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5204428A
Other languages
English (en)
Inventor
Juichi Shimizu
寿一 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP5204428A priority Critical patent/JPH0745657A/ja
Publication of JPH0745657A publication Critical patent/JPH0745657A/ja
Pending legal-status Critical Current

Links

Classifications

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【目的】 チップに損傷を生じさせたりチップ電極との
接合性を低下させることなく、ボンディングの狭ピッチ
化および長距離化に充分対応することのできるウェッジ
ボンディング用ワイヤを提供する。 【構成】 断面の一方が接合用の金属もしくは合金、他
方がビッカース硬度１００以上の合金からなる。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、半導体素子のチップ電
極と外部リードをウェッジボンディング方式を用いて接
続するために使用されるワイヤに関する。
【０００２】
【従来の技術】ＩＣ、ＬＳＩ等の半導体素子のチップ電
極と外部リードをウェッジボンディング方式を用いて接
続することが知られている。ウェッジボンディング方式
は、超音波を付加しながらワイヤにウェッジツールから
押圧力をかけることにより接合を行なうものである。こ
の際、従来使用されているワイヤ材は、Ｇｅ，Ａｇ，Ｃ
ａ，Ｂｅ，希土類元素等を合計１００重量ｐｐｍ含有さ
せた金合金、純度９９．９９９重量％以上の銅およびＳ
ｉ，Ｍｇを０．５〜１重量％含有させたアルミニウム合
金等の金属もしくは合金であった。ところで、近年の半
導体デバイスの高集積度化に伴い、ワイヤボンディング
をより狭いピッチで、しかもより長い距離で行なう必要
が生じてきている。
【０００３】
【発明が解決しようとする課題】しかしながら、上記ワ
イヤ材を用いて上記狭ピッチ化即ち細線化および長距離
化に対応しようとすると、ワイヤ変形によるワイヤショ
ートがおこり易い。一方、ワイヤ変形をおこし難くする
ために上記ワイヤ材を改良してその強度をより高くする
と、チップに割れなどの損傷を生じさせたり、チップ電
極との接合性を低下させるという問題が生じ易い。そこ
で、本発明は、上記問題点を解消し、チップに損傷を生
じさせたりチップ電極との接合性を低下させることな
く、ボンディングの狭ピッチ化および長距離化に充分対
応することのできるウェッジボンディング用ワイヤを提
供することを目的とする。
【０００４】
【課題を解決するための手段】本発明は、上記目的を達
成するものとして、断面の一方が接合用の金属もしくは
合金、他方がビッカース硬度１００以上の合金からなる
ウェッジボンディング用ワイヤである。
【０００５】
【作用】本発明のウェッジボンディング用ワイヤにおい
て、断面の一方である金属もしくは合金は、ウェッジボ
ンディング方式でチップ電極および外部リードと接合す
るためのものであり、前記公知の金系、銅系、アルミニ
ウム系など、（１）チップ電極材であるアルミニウム合
金や外部リードの銀めっき層との接合性が良好である、
（２）半導体デバイスの使用環境下で変質しない、
（３）電気伝導性が良好であるなどの条件を備えた金属
もしくは合金を使用することができる。このような金属
もしくは合金は、チップに損傷を生じさせたり、チップ
電極との接合性を低下させたりはしない。
【０００６】断面の他方であるビッカース硬度１００以
上の合金は、半導体デバイス組立て中における本発明の
ウェッジボンディング用ワイヤのワイヤ変形を防止する
ためのものであり、Ｃｕ，Ｎｉ，Ｚｎ，Ａｇ，白金族元
素などのうちの１種以上を含有させた金合金、Ｃｒ，Ｚ
ｒ，Ｍｇ，Ｓｎ，Ａｇ，Ｉｎ，Ｚｎ，Ｆｅ，Ｐ，Ｎｉ，
Ｓｉなどのうちの１種以上を含有させた銅合金、Ｃｕ，
Ｍｇ，Ｚｎ，Ｓｉ，Ｃｒ，Ｚｒ，Ｎｉ，Ｍｎなどのうち
の１種以上を含有させたアルミニウム合金など、（１）
半導体デバイス組立て中ビッカース硬度１００以上を維
持する、（２）半導体デバイスの使用環境下で変質しな
い、（３）電気伝導性が良好であるなどの条件を備えた
ものを使用することができる。これらの合金のビッカー
ス硬度が１００未満では、上記ワイヤ変形を防止する作
用が充分でないため、１００以上であることが必要であ
る。このような合金は、本発明のウェッジボンディング
用ワイヤにボンディングの狭ピッチ化および長距離化に
充分対応させる。
【０００７】接合用の金属もしくは合金の断面占有率
は、２０％未満では、他方のビッカース硬度１００以上
の合金の影響が大きくなって、チップに損傷を生じ易く
なり、一方、７０％を超えると、接合用の金属もしくは
合金の影響が大きくなって前記ワイヤ変形を防止し難く
なるので、２０〜７０％が好ましい。
【０００８】本発明のウェッジボンディング用ワイヤを
製造するには、（１）接合用の金属もしくは合金とビッ
カース硬度１００以上の合金との２種類の板を冷間圧接
し、得た圧接板からビレットを削り出した後、そのビレ
ットを伸線する、（２）半円柱状の接合用の金属もしく
は合金と半円柱状のビッカース硬度１００以上の合金と
を平面を合わせて熱間押出しして素線を作製した後、そ
の素線を伸線する、（３）鋳型に、まず接合用の金属も
しくは合金を鋳造し、次に、その上にビッカース硬度１
００以上の合金を鋳造し、複合鋳塊ビレットを作製した
後、そのビレットを伸線するなどの方法を、所定のビッ
カース硬度、断面占有率、線径などを得るために必要に
より伸線中や伸線後、適宜熱処理を施す工程を加えなが
ら採用すればよい。
【０００９】
【実施例】
実施例１，２，３ 純度９９．９９９重量％の高純度金、電気銀および電気
銅を配合し大気中高周波溶解および鋳造して、銀を２０
重量％、銅を２０重量％含有する金合金鋳塊（ワイヤ変
形防止用）と、純度９９．９９９重量％の高純度金およ
び該高純度金にＣａを１重量％添加した金母合金を配合
し上記と同様に溶解鋳造して、Ｃａを０．０００５重量
％含有する金合金鋳塊（接合用）とを得た。次に、これ
らの鋳塊に夫々圧延、焼きなましを行ない、クラッド化
して上記合金２層からなる厚み３ｍｍの板材を得た。更
に、上記板材を短冊状に切断し、これに伸線と熱処理を
繰返して直径２０μｍ、Ａｕ−Ｃａ合金の断面占有率が
相違する３種のワイヤとした。
【００１０】得られたワイヤを構成する接合用合金層の
断面占有率とワイヤ変形防止用合金層の硬度を測定し
た。また、ワイヤの評価は、接合性として、チップ電極
とウェッジボンディングされたワイヤ接合部にチップ電
極面と平行に加えたシェア荷重の最大値およびこのワイ
ヤ接合部を２００℃で１００時間加熱した後、上記の同
様に加えたシェア荷重の最大値を測定することにより行
なった。また、変形性として、引張り強度およびチップ
電極と外部リードとを５ｍｍ長の直線状にウェッジボン
ディングした半導体素子に４５°の方向からエポキシ樹
脂モールディングを施して生じる流れの最大量（モール
ディング前の直線からの距離）をＸ線写真により測定す
ることにより行なった。
【００１１】実施例４ ワイヤ変形防止用として、クロムを０．２５重量％含有
する銅合金鋳塊、接合用として、ベリリウムを０．００
０５重量％含有する金合金鋳塊を得た以外は、実施例１
と同様に試験した。
【００１２】実施例５ ワイヤ変形防止用として、銅を０．４５重量％、ケイ素
を０．１重量％含有するアルミニウム合金鋳塊、接合用
として、ケイ素を１重量％含有するアルミニウム合金鋳
塊を得た以外は、実施例１と同様に試験した。
【００１３】実施例６ 接合用として、純度９９．９９重量％の高純度アルミニ
ウムを使用した以外は、実施例４と同様に試験した。
【００１４】比較例１ ワイヤ変形防止用としての金合金鋳塊を用いず、クラッ
ド化することなく１層からなるワイヤとした以外は、実
施例１と同様に試験した。
【００１５】比較例２ ワイヤ変形防止用としてのアルミニウム合金鋳塊を用い
ず、クラッド化することなく１層からなるワイヤとした
以外は、実施例５と同様に試験した。
【００１６】比較例３ 接合用としての金合金鋳塊を用いず、クラッド化するこ
となく１層からなるワイヤとした以外は、実施例１と同
様に試験した。以上の結果を表１に示す。
【００１７】
【表１】
【００１８】
【発明の効果】以上から明らかなように、本発明は、チ
ップに損傷を生じさせたりチップ電極との接合性を低下
させることなく、ボンディングの狭ピッチ化および長距
離化に充分対応するウェッジボンディング用ワイヤを提
供することができる。

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】 断面の一方が接合用の金属もしくは合
    金、他方がビッカース硬度１００以上の合金からなるウ
    ェッジボンディング用ワイヤ。
  2. 【請求項２】 接合用の金属もしくは合金の断面占有率
    が２０〜７０％である請求項１記載のウェッジボンディ
    ング用ワイヤ。
JP5204428A 1993-07-28 1993-07-28 ウェッジボンディング用ワイヤ Pending JPH0745657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5204428A JPH0745657A (ja) 1993-07-28 1993-07-28 ウェッジボンディング用ワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5204428A JPH0745657A (ja) 1993-07-28 1993-07-28 ウェッジボンディング用ワイヤ

Publications (1)

Publication Number Publication Date
JPH0745657A true JPH0745657A (ja) 1995-02-14

Family

ID=16490379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5204428A Pending JPH0745657A (ja) 1993-07-28 1993-07-28 ウェッジボンディング用ワイヤ

Country Status (1)

Country Link
JP (1) JPH0745657A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
US6927950B2 (en) * 2001-08-24 2005-08-09 Tdk Corporation Thin-film magnetic head and method of manufacturing same, head gimbal assembly, and hard disk drive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945065A (en) * 1996-07-31 1999-08-31 Tanaka Denshi Kogyo Method for wedge bonding using a gold alloy wire
US6927950B2 (en) * 2001-08-24 2005-08-09 Tdk Corporation Thin-film magnetic head and method of manufacturing same, head gimbal assembly, and hard disk drive

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