SG68043A1 - Apparatus for removing and storing semiconductor device trays - Google Patents
Apparatus for removing and storing semiconductor device traysInfo
- Publication number
- SG68043A1 SG68043A1 SG1998000837A SG1998000837A SG68043A1 SG 68043 A1 SG68043 A1 SG 68043A1 SG 1998000837 A SG1998000837 A SG 1998000837A SG 1998000837 A SG1998000837 A SG 1998000837A SG 68043 A1 SG68043 A1 SG 68043A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- storing semiconductor
- device trays
- trays
- storing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- De-Stacking Of Articles (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09995697A JP3591679B2 (ja) | 1997-04-17 | 1997-04-17 | Ic用トレイ取出装置及びic用トレイ収納装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG68043A1 true SG68043A1 (en) | 1999-10-19 |
Family
ID=14261152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998000837A SG68043A1 (en) | 1997-04-17 | 1998-04-16 | Apparatus for removing and storing semiconductor device trays |
Country Status (8)
Country | Link |
---|---|
US (1) | US5906472A (de) |
JP (1) | JP3591679B2 (de) |
KR (1) | KR100301750B1 (de) |
CN (1) | CN1075340C (de) |
DE (1) | DE19817123C2 (de) |
MY (1) | MY116236A (de) |
SG (1) | SG68043A1 (de) |
TW (1) | TW378191B (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6113345A (en) * | 1997-11-12 | 2000-09-05 | Ashby; Harrel Dean | Method for singulating a disk |
US6276513B1 (en) * | 1999-10-08 | 2001-08-21 | Calsonic-Kansei Corporation | Workpiece handling device |
JP2000118681A (ja) * | 1998-10-19 | 2000-04-25 | Shinkawa Ltd | トレイ搬送装置及び方法 |
KR100285658B1 (ko) * | 1998-11-06 | 2001-04-02 | 정문술 | 핸들러의멀티스택커 |
DE19956981B4 (de) * | 1998-11-28 | 2005-07-21 | Mirae Corp., Chunan | Handhabungsvorrichtung für eine Prüfung von IC-Bausteinen |
US7066708B1 (en) | 1999-10-19 | 2006-06-27 | Micron Technology, Inc. | Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectric devices |
KR100481707B1 (ko) * | 2002-04-03 | 2005-04-11 | 주식회사 넥사이언 | 히팅챔버 내에서의 테스트 트레이 이송장치 |
AU2003242260A1 (en) | 2003-06-06 | 2005-01-04 | Advantest Corporation | Transport device, electronic component handling device, and transporting method for electronic component handling device |
JP2006292727A (ja) * | 2005-03-18 | 2006-10-26 | Alps Electric Co Ltd | 半導体搬送トレイ、これを用いたバーンインボード、バーンイン試験用の検査装置及びバーンイン試験方法並びに半導体の製造方法 |
CN100578750C (zh) * | 2005-07-01 | 2010-01-06 | 日商乐华股份有限公司 | 容器搬送装置及容器搬送系统 |
US8118531B2 (en) * | 2005-11-21 | 2012-02-21 | Hirata Corporation | Tray holding device |
DE102006019153B4 (de) * | 2006-04-21 | 2009-10-29 | Felsomat Gmbh & Co Kg | Bereitstellungsmodul für Paletten mit einem Transportmodul, das unter den Stapelplätzen der Paletten samt einer Hebeeinrichtung verfahrbar ist |
JP4333701B2 (ja) * | 2006-06-14 | 2009-09-16 | 村田機械株式会社 | 搬送システム |
JP4367440B2 (ja) | 2006-06-14 | 2009-11-18 | 村田機械株式会社 | 搬送システム |
US20080003084A1 (en) * | 2006-06-30 | 2008-01-03 | Behnke Merlin E | High speed tray transfer system |
KR100817062B1 (ko) | 2006-09-27 | 2008-03-27 | 삼성전자주식회사 | 반도체 패키지 취급에 사용되는 트레이 캐리어 및 그사용방법 |
TWI393901B (zh) * | 2006-11-08 | 2013-04-21 | Hirata Spinning | 工件搬運裝置 |
US9102480B2 (en) * | 2008-11-10 | 2015-08-11 | Steven A. Snapp | Pallet dispenser |
KR101039857B1 (ko) * | 2009-05-19 | 2011-06-09 | 미래산업 주식회사 | 테스트 핸들러용 소자 접속장치 및 이를 이용한 테스트 핸들러 |
JP5389008B2 (ja) * | 2010-12-28 | 2014-01-15 | 株式会社ヤクルト本社 | 容器取り出し機構 |
US20150118011A1 (en) * | 2013-10-30 | 2015-04-30 | Data I/O Corporation | Tray stacker system and method of operation thereof |
CN105151778A (zh) * | 2015-06-29 | 2015-12-16 | 苏州赛腾精密电子股份有限公司 | 一种产品上料和托盘回收机构 |
JP6593071B2 (ja) * | 2015-09-30 | 2019-10-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
CN106144626A (zh) * | 2016-08-31 | 2016-11-23 | 苏州朗坤自动化设备有限公司 | 一种料盘分拣输送装置 |
CN207861402U (zh) * | 2017-09-28 | 2018-09-14 | 京东方科技集团股份有限公司 | 一种上料设备及背光源生产系统 |
CN108100667A (zh) * | 2017-12-11 | 2018-06-01 | 合肥右传媒科技有限公司 | 一种电路板生产堆叠码放装置 |
CN110092187B (zh) * | 2019-05-27 | 2021-08-20 | Tcl通力电子(惠州)有限公司 | 摆盘机 |
CN111874628B (zh) * | 2020-07-23 | 2022-06-14 | 湖南红太阳光电科技有限公司 | 一种薄片材料高速连续上料系统 |
JP7547932B2 (ja) * | 2020-10-28 | 2024-09-10 | 株式会社デンソー | トレイ収納容器、並びにこれを用いた半導体装置の製造方法 |
TWI742897B (zh) * | 2020-10-29 | 2021-10-11 | 上利新科技股份有限公司 | 承載機構 |
CH718766A1 (de) * | 2021-06-24 | 2022-12-30 | Integra Biosciences Ag | Stapel-Vorrichtung für Mikrotiterplatten. |
CN113299586B (zh) * | 2021-07-28 | 2021-10-19 | 四川通妙科技有限公司 | 一种芯片晶圆暂存装置及芯片晶圆暂存取件方法 |
JP7154449B1 (ja) * | 2021-10-28 | 2022-10-17 | 芝浦メカトロニクス株式会社 | 電子部品実装装置 |
TWI814375B (zh) * | 2022-05-10 | 2023-09-01 | 鴻勁精密股份有限公司 | 承盤裝置、取盤方法、補盤方法及作業機 |
CN115709897A (zh) * | 2022-12-05 | 2023-02-24 | 苏州天准科技股份有限公司 | 一种镜头玻璃上料装置、清洗及瑕疵检测系统 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6071402A (ja) * | 1983-09-29 | 1985-04-23 | Mitsubishi Heavy Ind Ltd | 箱型定形貨物格納設備 |
EP0382264B1 (de) * | 1984-06-29 | 1994-06-15 | Advantest Corporation | IC-Testvorrichtung |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
FR2614286B1 (fr) * | 1987-04-24 | 1989-07-28 | Remy & Cie E P | Dispositif de depilage de recipients et machine de conditionnement equipee de ce dispositif. |
DE3716549A1 (de) * | 1987-05-17 | 1988-12-08 | Leitz Ernst Gmbh | Handhabungsautomat fuer plattenfoermige objekte |
US4971514A (en) * | 1988-11-14 | 1990-11-20 | Prolic Sa | Stacking device for plate-like objects, in particular titer plates or the like |
JP2770529B2 (ja) * | 1990-02-16 | 1998-07-02 | 井関農機株式会社 | 育苗箱の搬送装置 |
JP2543905Y2 (ja) * | 1991-03-27 | 1997-08-13 | 安藤電気株式会社 | 積み重ねたトレーによる分類収納機構 |
JP2744564B2 (ja) * | 1992-11-05 | 1998-04-28 | 株式会社クボタ | 育苗箱分離取り出し装置 |
JP3412114B2 (ja) * | 1995-07-26 | 2003-06-03 | 株式会社アドバンテスト | Ic試験装置 |
JPH10227831A (ja) * | 1997-02-17 | 1998-08-25 | Advantest Corp | Ic試験装置 |
JP3689215B2 (ja) * | 1997-02-20 | 2005-08-31 | 株式会社ルネサステクノロジ | 半導体デバイスのテスト用搬送装置 |
-
1997
- 1997-04-17 JP JP09995697A patent/JP3591679B2/ja not_active Expired - Fee Related
-
1998
- 1998-04-16 TW TW087105820A patent/TW378191B/zh not_active IP Right Cessation
- 1998-04-16 SG SG1998000837A patent/SG68043A1/en unknown
- 1998-04-16 US US09/061,469 patent/US5906472A/en not_active Expired - Fee Related
- 1998-04-17 DE DE19817123A patent/DE19817123C2/de not_active Expired - Fee Related
- 1998-04-17 MY MYPI98001723A patent/MY116236A/en unknown
- 1998-04-17 CN CN98114957A patent/CN1075340C/zh not_active Expired - Fee Related
- 1998-04-17 KR KR1019980013772A patent/KR100301750B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1203884A (zh) | 1999-01-06 |
KR19980081510A (ko) | 1998-11-25 |
CN1075340C (zh) | 2001-11-21 |
KR100301750B1 (ko) | 2001-09-22 |
DE19817123A1 (de) | 1998-10-22 |
MY116236A (en) | 2003-12-31 |
JP3591679B2 (ja) | 2004-11-24 |
DE19817123C2 (de) | 2000-10-26 |
US5906472A (en) | 1999-05-25 |
JPH10291645A (ja) | 1998-11-04 |
TW378191B (en) | 2000-01-01 |
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