SG186254A1 - Curable resin composition and cured product thereof - Google Patents

Curable resin composition and cured product thereof Download PDF

Info

Publication number
SG186254A1
SG186254A1 SG2012090577A SG2012090577A SG186254A1 SG 186254 A1 SG186254 A1 SG 186254A1 SG 2012090577 A SG2012090577 A SG 2012090577A SG 2012090577 A SG2012090577 A SG 2012090577A SG 186254 A1 SG186254 A1 SG 186254A1
Authority
SG
Singapore
Prior art keywords
acid
group
anhydride
curable resin
resin composition
Prior art date
Application number
SG2012090577A
Other languages
English (en)
Inventor
Chie Sasaki
Yoshihiro Kawada
Masataka Nakanishi
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of SG186254A1 publication Critical patent/SG186254A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG2012090577A 2010-06-11 2011-06-10 Curable resin composition and cured product thereof SG186254A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010134465 2010-06-11
PCT/JP2011/063412 WO2011155613A1 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
SG186254A1 true SG186254A1 (en) 2013-01-30

Family

ID=45098215

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012090577A SG186254A1 (en) 2010-06-11 2011-06-10 Curable resin composition and cured product thereof

Country Status (6)

Country Link
JP (1) JP5768047B2 (zh)
KR (1) KR20130098876A (zh)
CN (1) CN102939315A (zh)
SG (1) SG186254A1 (zh)
TW (1) TWI504628B (zh)
WO (1) WO2011155613A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472924B2 (ja) * 2010-10-21 2014-04-16 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
WO2013035740A1 (ja) * 2011-09-09 2013-03-14 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP6602170B2 (ja) * 2015-11-16 2019-11-06 日本化薬株式会社 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置
JP6951323B2 (ja) * 2016-03-31 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102624978B1 (ko) 2016-11-28 2024-01-15 에이치엘만도 주식회사 디스크 브레이크
CN107742286B (zh) * 2017-09-28 2021-01-29 河北工业大学 一种多晶硅太阳能电池片el测试裂纹缺陷检测方法
CN112442256B (zh) * 2020-11-03 2021-12-17 南京大学 一种环氧树脂基高分子材料及其制备方法和应用
CN112708277A (zh) * 2020-12-23 2021-04-27 北京化工大学 一种高强度柔性聚硅氧烷气凝胶及制备方法
CN113461359B (zh) * 2021-06-29 2022-05-10 江苏先帅科技有限公司 一种管片预制件用复合聚羧酸减水剂及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089658B2 (ja) * 1988-12-13 1996-01-31 新日本理化株式会社 エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物
JPH07108935B2 (ja) * 1989-01-10 1995-11-22 新日本理化株式会社 エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物
JP3012358B2 (ja) * 1991-04-30 2000-02-21 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性エポキシ樹脂組成物
US6335304B1 (en) * 1999-11-09 2002-01-01 King Industries, Inc Metal salts of phosphoric acid esters as cross linking catalysts
JP2003124529A (ja) * 2002-09-24 2003-04-25 Nichia Chem Ind Ltd 発光ダイオードおよびその形成方法
JP2004292706A (ja) * 2003-03-27 2004-10-21 Nof Corp 光半導体封止用エポキシ樹脂組成物及び光半導体装置
US7279223B2 (en) * 2003-12-16 2007-10-09 General Electric Company Underfill composition and packaged solid state device
JP5109873B2 (ja) * 2008-08-27 2012-12-26 日油株式会社 熱硬化性樹脂組成物
JP5141499B2 (ja) * 2008-10-31 2013-02-13 日油株式会社 熱硬化性樹脂組成物
JP5574447B2 (ja) * 2009-10-06 2014-08-20 日本化薬株式会社 多価カルボン酸組成物およびその製造方法、ならびに該多価カルボン酸組成物を含有してなる硬化性樹脂組成物

Also Published As

Publication number Publication date
JP5768047B2 (ja) 2015-08-26
CN102939315A (zh) 2013-02-20
TWI504628B (zh) 2015-10-21
KR20130098876A (ko) 2013-09-05
TW201200536A (en) 2012-01-01
WO2011155613A1 (ja) 2011-12-15
JPWO2011155613A1 (ja) 2013-08-15

Similar Documents

Publication Publication Date Title
JP5878862B2 (ja) 硬化性樹脂組成物、及びその硬化物
JP5730852B2 (ja) オルガノポリシロキサンの製造方法、該製造方法により得られるオルガノポリシロキサン、該オルガノポリシロキサンを含有する組成物
JP5768047B2 (ja) 硬化性樹脂組成物およびその硬化物
JP5348764B2 (ja) 光半導体封止用硬化性樹脂組成物、及びその硬化物
JP5433705B2 (ja) 硬化性樹脂組成物およびその硬化物
JP5626856B2 (ja) 硬化性樹脂組成物およびその硬化物
JP5948317B2 (ja) 多価カルボン酸樹脂およびその組成物
JP5698453B2 (ja) エポキシ樹脂組成物
JP5561778B2 (ja) 硬化性樹脂組成物およびその硬化物
JP5472924B2 (ja) 硬化性樹脂組成物およびその硬化物
JP5300148B2 (ja) エポキシ樹脂組成物、硬化性樹脂組成物
JP5700618B2 (ja) エポキシ樹脂組成物、硬化性樹脂組成物
JP2014237861A (ja) エポキシ樹脂組成物、硬化性樹脂組成物
JP5832601B2 (ja) 硬化性樹脂組成物およびその硬化物
JP2017031247A (ja) 硫黄系酸化防止剤を含有する硬化性樹脂組成物およびエポキシ樹脂組成物とその硬化物