KR20130098876A - 경화성 수지 조성물 및 그 경화물 - Google Patents
경화성 수지 조성물 및 그 경화물 Download PDFInfo
- Publication number
- KR20130098876A KR20130098876A KR1020127031395A KR20127031395A KR20130098876A KR 20130098876 A KR20130098876 A KR 20130098876A KR 1020127031395 A KR1020127031395 A KR 1020127031395A KR 20127031395 A KR20127031395 A KR 20127031395A KR 20130098876 A KR20130098876 A KR 20130098876A
- Authority
- KR
- South Korea
- Prior art keywords
- acid
- resin composition
- group
- curable resin
- zinc
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-134465 | 2010-06-11 | ||
JP2010134465 | 2010-06-11 | ||
PCT/JP2011/063412 WO2011155613A1 (ja) | 2010-06-11 | 2011-06-10 | 硬化性樹脂組成物およびその硬化物 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130098876A true KR20130098876A (ko) | 2013-09-05 |
Family
ID=45098215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020127031395A KR20130098876A (ko) | 2010-06-11 | 2011-06-10 | 경화성 수지 조성물 및 그 경화물 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5768047B2 (zh) |
KR (1) | KR20130098876A (zh) |
CN (1) | CN102939315A (zh) |
SG (1) | SG186254A1 (zh) |
TW (1) | TWI504628B (zh) |
WO (1) | WO2011155613A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180060337A (ko) | 2016-11-28 | 2018-06-07 | 주식회사 만도 | 디스크 브레이크 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5472924B2 (ja) * | 2010-10-21 | 2014-04-16 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
WO2013035740A1 (ja) * | 2011-09-09 | 2013-03-14 | 日本化薬株式会社 | 光半導体素子封止用硬化性樹脂組成物およびその硬化物 |
JP6602170B2 (ja) * | 2015-11-16 | 2019-11-06 | 日本化薬株式会社 | 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置 |
CN108885400A (zh) * | 2016-03-31 | 2018-11-23 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物和印刷电路板 |
CN107742286B (zh) * | 2017-09-28 | 2021-01-29 | 河北工业大学 | 一种多晶硅太阳能电池片el测试裂纹缺陷检测方法 |
CN112442256B (zh) * | 2020-11-03 | 2021-12-17 | 南京大学 | 一种环氧树脂基高分子材料及其制备方法和应用 |
CN112708277A (zh) * | 2020-12-23 | 2021-04-27 | 北京化工大学 | 一种高强度柔性聚硅氧烷气凝胶及制备方法 |
CN113461359B (zh) * | 2021-06-29 | 2022-05-10 | 江苏先帅科技有限公司 | 一种管片预制件用复合聚羧酸减水剂及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH089658B2 (ja) * | 1988-12-13 | 1996-01-31 | 新日本理化株式会社 | エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物 |
JPH07108935B2 (ja) * | 1989-01-10 | 1995-11-22 | 新日本理化株式会社 | エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物 |
JP3012358B2 (ja) * | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性エポキシ樹脂組成物 |
US6335304B1 (en) * | 1999-11-09 | 2002-01-01 | King Industries, Inc | Metal salts of phosphoric acid esters as cross linking catalysts |
JP2003124529A (ja) * | 2002-09-24 | 2003-04-25 | Nichia Chem Ind Ltd | 発光ダイオードおよびその形成方法 |
JP2004292706A (ja) * | 2003-03-27 | 2004-10-21 | Nof Corp | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
US7279223B2 (en) * | 2003-12-16 | 2007-10-09 | General Electric Company | Underfill composition and packaged solid state device |
JP5109873B2 (ja) * | 2008-08-27 | 2012-12-26 | 日油株式会社 | 熱硬化性樹脂組成物 |
JP5141499B2 (ja) * | 2008-10-31 | 2013-02-13 | 日油株式会社 | 熱硬化性樹脂組成物 |
CN102648244B (zh) * | 2009-10-06 | 2014-05-07 | 日本化药株式会社 | 多元羧酸组合物及其制造方法以及含有该多元羧酸组合物的可固化树脂组合物 |
-
2011
- 2011-06-10 CN CN2011800288827A patent/CN102939315A/zh active Pending
- 2011-06-10 KR KR1020127031395A patent/KR20130098876A/ko not_active Application Discontinuation
- 2011-06-10 JP JP2012519441A patent/JP5768047B2/ja not_active Expired - Fee Related
- 2011-06-10 SG SG2012090577A patent/SG186254A1/en unknown
- 2011-06-10 WO PCT/JP2011/063412 patent/WO2011155613A1/ja active Application Filing
- 2011-06-10 TW TW100120614A patent/TWI504628B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180060337A (ko) | 2016-11-28 | 2018-06-07 | 주식회사 만도 | 디스크 브레이크 |
Also Published As
Publication number | Publication date |
---|---|
CN102939315A (zh) | 2013-02-20 |
TWI504628B (zh) | 2015-10-21 |
WO2011155613A1 (ja) | 2011-12-15 |
SG186254A1 (en) | 2013-01-30 |
JPWO2011155613A1 (ja) | 2013-08-15 |
TW201200536A (en) | 2012-01-01 |
JP5768047B2 (ja) | 2015-08-26 |
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |