JP5768047B2 - 硬化性樹脂組成物およびその硬化物 - Google Patents

硬化性樹脂組成物およびその硬化物 Download PDF

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Publication number
JP5768047B2
JP5768047B2 JP2012519441A JP2012519441A JP5768047B2 JP 5768047 B2 JP5768047 B2 JP 5768047B2 JP 2012519441 A JP2012519441 A JP 2012519441A JP 2012519441 A JP2012519441 A JP 2012519441A JP 5768047 B2 JP5768047 B2 JP 5768047B2
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acid
group
curable resin
resin composition
reaction
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JP2012519441A
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Japanese (ja)
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JPWO2011155613A1 (ja
Inventor
智江 佐々木
智江 佐々木
義浩 川田
義浩 川田
政隆 中西
政隆 中西
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012519441A 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物 Expired - Fee Related JP5768047B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012519441A JP5768047B2 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010134465 2010-06-11
JP2010134465 2010-06-11
PCT/JP2011/063412 WO2011155613A1 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物
JP2012519441A JP5768047B2 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物

Publications (2)

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JPWO2011155613A1 JPWO2011155613A1 (ja) 2013-08-15
JP5768047B2 true JP5768047B2 (ja) 2015-08-26

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JP2012519441A Expired - Fee Related JP5768047B2 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物

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JP (1) JP5768047B2 (zh)
KR (1) KR20130098876A (zh)
CN (1) CN102939315A (zh)
SG (1) SG186254A1 (zh)
TW (1) TWI504628B (zh)
WO (1) WO2011155613A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472924B2 (ja) * 2010-10-21 2014-04-16 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
JP6006725B2 (ja) * 2011-09-09 2016-10-12 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP6602170B2 (ja) * 2015-11-16 2019-11-06 日本化薬株式会社 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置
JP6951323B2 (ja) * 2016-03-31 2021-10-20 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102624978B1 (ko) 2016-11-28 2024-01-15 에이치엘만도 주식회사 디스크 브레이크
CN107742286B (zh) * 2017-09-28 2021-01-29 河北工业大学 一种多晶硅太阳能电池片el测试裂纹缺陷检测方法
CN112442256B (zh) * 2020-11-03 2021-12-17 南京大学 一种环氧树脂基高分子材料及其制备方法和应用
CN112708277A (zh) * 2020-12-23 2021-04-27 北京化工大学 一种高强度柔性聚硅氧烷气凝胶及制备方法
CN113461359B (zh) * 2021-06-29 2022-05-10 江苏先帅科技有限公司 一种管片预制件用复合聚羧酸减水剂及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255827A (ja) * 1988-12-13 1990-10-16 New Japan Chem Co Ltd エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物
JPH0395215A (ja) * 1989-01-10 1991-04-19 New Japan Chem Co Ltd エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物
JP2003124529A (ja) * 2002-09-24 2003-04-25 Nichia Chem Ind Ltd 発光ダイオードおよびその形成方法
JP2004292706A (ja) * 2003-03-27 2004-10-21 Nof Corp 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2010053203A (ja) * 2008-08-27 2010-03-11 Nof Corp 熱硬化性樹脂組成物
JP2010106205A (ja) * 2008-10-31 2010-05-13 Nof Corp 熱硬化性樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3012358B2 (ja) * 1991-04-30 2000-02-21 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性エポキシ樹脂組成物
US6335304B1 (en) * 1999-11-09 2002-01-01 King Industries, Inc Metal salts of phosphoric acid esters as cross linking catalysts
US7279223B2 (en) * 2003-12-16 2007-10-09 General Electric Company Underfill composition and packaged solid state device
JP5574447B2 (ja) * 2009-10-06 2014-08-20 日本化薬株式会社 多価カルボン酸組成物およびその製造方法、ならびに該多価カルボン酸組成物を含有してなる硬化性樹脂組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02255827A (ja) * 1988-12-13 1990-10-16 New Japan Chem Co Ltd エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物
JPH0395215A (ja) * 1989-01-10 1991-04-19 New Japan Chem Co Ltd エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物
JP2003124529A (ja) * 2002-09-24 2003-04-25 Nichia Chem Ind Ltd 発光ダイオードおよびその形成方法
JP2004292706A (ja) * 2003-03-27 2004-10-21 Nof Corp 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP2010053203A (ja) * 2008-08-27 2010-03-11 Nof Corp 熱硬化性樹脂組成物
JP2010106205A (ja) * 2008-10-31 2010-05-13 Nof Corp 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
KR20130098876A (ko) 2013-09-05
JPWO2011155613A1 (ja) 2013-08-15
WO2011155613A1 (ja) 2011-12-15
TW201200536A (en) 2012-01-01
SG186254A1 (en) 2013-01-30
TWI504628B (zh) 2015-10-21
CN102939315A (zh) 2013-02-20

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