SG185736A1 - Composition for metal electroplating comprising leveling agent - Google Patents

Composition for metal electroplating comprising leveling agent Download PDF

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Publication number
SG185736A1
SG185736A1 SG2012086377A SG2012086377A SG185736A1 SG 185736 A1 SG185736 A1 SG 185736A1 SG 2012086377 A SG2012086377 A SG 2012086377A SG 2012086377 A SG2012086377 A SG 2012086377A SG 185736 A1 SG185736 A1 SG 185736A1
Authority
SG
Singapore
Prior art keywords
composition according
anyone
metal
compound
substrate
Prior art date
Application number
SG2012086377A
Other languages
English (en)
Inventor
Michael Siemer
Cornelia Roeger-Goepfert
Nicole Meier
Roman Benedikt Raether
Marco Arnold
Charlotte Emnet
Dieter Mayer
Alexander Fluegel
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG185736A1 publication Critical patent/SG185736A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG2012086377A 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent SG185736A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01
PCT/IB2011/052385 WO2011151785A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Publications (1)

Publication Number Publication Date
SG185736A1 true SG185736A1 (en) 2012-12-28

Family

ID=45066252

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201504251WA SG10201504251WA (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent
SG2012086377A SG185736A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201504251WA SG10201504251WA (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Country Status (11)

Country Link
US (1) US9683302B2 (OSRAM)
EP (1) EP2576696B1 (OSRAM)
JP (1) JP5933532B2 (OSRAM)
KR (3) KR101955869B1 (OSRAM)
CN (1) CN102939339B (OSRAM)
IL (1) IL223183B (OSRAM)
MY (1) MY164464A (OSRAM)
RU (1) RU2603675C2 (OSRAM)
SG (2) SG10201504251WA (OSRAM)
TW (1) TWI539036B (OSRAM)
WO (1) WO2011151785A1 (OSRAM)

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US11585004B2 (en) * 2018-04-19 2023-02-21 Basf Se Composition for cobalt or cobalt alloy electroplating
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
EP4034697A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
WO2021058334A1 (en) 2019-09-27 2021-04-01 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN110938847B (zh) * 2019-10-30 2021-11-12 苏州清飙科技有限公司 电镀铜整平剂及其制备方法、以及电镀液
US12134834B2 (en) 2020-04-03 2024-11-05 Basf Se Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
US20230265576A1 (en) 2020-07-13 2023-08-24 Basf Se Composition For Copper Electroplating On A Cobalt Seed
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
CN118043502A (zh) 2021-10-01 2024-05-14 巴斯夫欧洲公司 用于铜电沉积的包含聚氨基酰胺型流平剂的组合物
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CN120457244A (zh) 2022-12-19 2025-08-08 巴斯夫欧洲公司 用于铜纳米孪晶电沉积的组合物
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Also Published As

Publication number Publication date
US20130068626A1 (en) 2013-03-21
MY164464A (en) 2017-12-15
WO2011151785A1 (en) 2011-12-08
EP2576696B1 (en) 2017-10-04
JP5933532B2 (ja) 2016-06-15
KR20180017244A (ko) 2018-02-20
KR20180094140A (ko) 2018-08-22
RU2603675C2 (ru) 2016-11-27
US9683302B2 (en) 2017-06-20
TWI539036B (zh) 2016-06-21
RU2012157535A (ru) 2014-07-20
KR101891473B1 (ko) 2018-08-27
KR101955869B1 (ko) 2019-03-07
TW201211321A (en) 2012-03-16
IL223183B (en) 2018-03-29
EP2576696A4 (en) 2014-07-16
JP2013527325A (ja) 2013-06-27
KR20130112018A (ko) 2013-10-11
SG10201504251WA (en) 2015-07-30
KR101829866B1 (ko) 2018-02-20
CN102939339B (zh) 2016-02-17
CN102939339A (zh) 2013-02-20
IL223183A0 (en) 2013-02-03
EP2576696A1 (en) 2013-04-10

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