SG176502A1 - Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes - Google Patents

Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes Download PDF

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Publication number
SG176502A1
SG176502A1 SG2011085818A SG2011085818A SG176502A1 SG 176502 A1 SG176502 A1 SG 176502A1 SG 2011085818 A SG2011085818 A SG 2011085818A SG 2011085818 A SG2011085818 A SG 2011085818A SG 176502 A1 SG176502 A1 SG 176502A1
Authority
SG
Singapore
Prior art keywords
electrodes
gas
outer perimeter
plasma
process chambers
Prior art date
Application number
SG2011085818A
Other languages
English (en)
Inventor
V Bolden Ii Thomas
Fierro Louis
D Getty James
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Publication of SG176502A1 publication Critical patent/SG176502A1/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J15/00—Gas-filled discharge tubes with gaseous cathodes, e.g. plasma cathode
    • H01J15/02—Details, e.g. electrode, gas filling, shape of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/093—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts
    • H10W20/095—Manufacture or treatment of dielectric parts thereof by modifying materials of the dielectric parts by irradiating with electromagnetic or particle radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning In General (AREA)
  • Drying Of Semiconductors (AREA)
SG2011085818A 2008-05-20 2009-05-07 Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes SG176502A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/123,954 US8372238B2 (en) 2008-05-20 2008-05-20 Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes

Publications (1)

Publication Number Publication Date
SG176502A1 true SG176502A1 (en) 2011-12-29

Family

ID=41341204

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2011085818A SG176502A1 (en) 2008-05-20 2009-05-07 Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes
SG200903198-0A SG157301A1 (en) 2008-05-20 2009-05-07 Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200903198-0A SG157301A1 (en) 2008-05-20 2009-05-07 Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes

Country Status (6)

Country Link
US (2) US8372238B2 (enExample)
JP (2) JP5713542B2 (enExample)
KR (2) KR101645191B1 (enExample)
CN (2) CN101587827B (enExample)
SG (2) SG176502A1 (enExample)
TW (1) TWI519212B (enExample)

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US8333166B2 (en) * 2011-05-04 2012-12-18 Nordson Corporation Plasma treatment systems and methods for uniformly distributing radiofrequency power between multiple electrodes
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CN108787634A (zh) * 2018-07-19 2018-11-13 深圳市神州天柱科技有限公司 一种等离子清洗机
CN113491174A (zh) 2018-12-20 2021-10-08 机械解析有限公司 用于等离子体放电设备的电极组件
CN110223904A (zh) * 2019-07-19 2019-09-10 江苏鲁汶仪器有限公司 一种具有法拉第屏蔽装置的等离子体处理系统
WO2021109425A1 (zh) * 2019-12-04 2021-06-10 江苏菲沃泰纳米科技有限公司 镀膜设备
US20230018842A1 (en) * 2020-01-09 2023-01-19 Nordson Corporation Workpiece support system for plasma treatment and method of using the same
CN111517117A (zh) * 2020-04-16 2020-08-11 昆山辉跃通信设备有限公司 一种等离子体设备用滑动装置

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Also Published As

Publication number Publication date
KR20090121225A (ko) 2009-11-25
KR101645191B1 (ko) 2016-08-12
CN101587827A (zh) 2009-11-25
US8372238B2 (en) 2013-02-12
US20130139967A1 (en) 2013-06-06
JP6078571B2 (ja) 2017-02-08
SG157301A1 (en) 2009-12-29
US20090288773A1 (en) 2009-11-26
CN103474327B (zh) 2016-03-16
KR101695632B1 (ko) 2017-01-13
JP5713542B2 (ja) 2015-05-07
JP2015146317A (ja) 2015-08-13
JP2009295580A (ja) 2009-12-17
US10109448B2 (en) 2018-10-23
TW201004493A (en) 2010-01-16
CN103474327A (zh) 2013-12-25
KR20160095654A (ko) 2016-08-11
CN101587827B (zh) 2013-09-04
TWI519212B (zh) 2016-01-21

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