SG169385A1 - Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method - Google Patents
Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the methodInfo
- Publication number
- SG169385A1 SG169385A1 SG201100848-9A SG2011008489A SG169385A1 SG 169385 A1 SG169385 A1 SG 169385A1 SG 2011008489 A SG2011008489 A SG 2011008489A SG 169385 A1 SG169385 A1 SG 169385A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- polishing
- polished
- less
- front side
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 10
- 239000004065 semiconductor Substances 0.000 title abstract 9
- 238000000034 method Methods 0.000 title abstract 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 230000007717 exclusion Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006044367A DE102006044367B4 (de) | 2006-09-20 | 2006-09-20 | Verfahren zum Polieren einer Halbleiterscheibe und eine nach dem Verfahren herstellbare polierte Halbleiterscheibe |
Publications (1)
Publication Number | Publication Date |
---|---|
SG169385A1 true SG169385A1 (en) | 2011-03-30 |
Family
ID=39133976
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200705306-9A SG141306A1 (en) | 2006-09-20 | 2007-07-18 | Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method |
SG201100848-9A SG169385A1 (en) | 2006-09-20 | 2007-07-18 | Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200705306-9A SG141306A1 (en) | 2006-09-20 | 2007-07-18 | Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080070483A1 (zh) |
JP (1) | JP2008078660A (zh) |
KR (2) | KR100915433B1 (zh) |
CN (1) | CN101148025B (zh) |
DE (1) | DE102006044367B4 (zh) |
SG (2) | SG141306A1 (zh) |
TW (1) | TWI336280B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008044646B4 (de) * | 2008-08-27 | 2011-06-22 | Siltronic AG, 81737 | Verfahren zur Herstellung einer Halbleiterscheibe |
DE102008045534B4 (de) * | 2008-09-03 | 2011-12-01 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
JP5170716B2 (ja) * | 2009-05-08 | 2013-03-27 | 株式会社Sumco | 半導体ウェーハの研磨方法及び研磨パッド整形治具 |
DE102009025243B4 (de) * | 2009-06-17 | 2011-11-17 | Siltronic Ag | Verfahren zur Herstellung und Verfahren zur Bearbeitung einer Halbleiterscheibe aus Silicium |
DE102009030292B4 (de) * | 2009-06-24 | 2011-12-01 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
DE102009037281B4 (de) * | 2009-08-12 | 2013-05-08 | Siltronic Ag | Verfahren zur Herstellung einer polierten Halbleiterscheibe |
DE102009049330B3 (de) * | 2009-10-14 | 2011-02-17 | Siltronic Ag | Verfahren zum Nachpolieren einer Halbleiterscheibe |
US8952496B2 (en) | 2009-12-24 | 2015-02-10 | Sumco Corporation | Semiconductor wafer and method of producing same |
JP5423384B2 (ja) | 2009-12-24 | 2014-02-19 | 株式会社Sumco | 半導体ウェーハおよびその製造方法 |
DE102010013520B4 (de) * | 2010-03-31 | 2013-02-07 | Siltronic Ag | Verfahren zur beidseitigen Politur einer Halbleiterscheibe |
DE102013201663B4 (de) | 2012-12-04 | 2020-04-23 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
KR101660900B1 (ko) * | 2015-01-16 | 2016-10-10 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법 |
KR102604525B1 (ko) * | 2017-12-22 | 2023-11-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템, 기판 처리 방법 및 컴퓨터 기억 매체 |
US11145556B2 (en) * | 2019-11-21 | 2021-10-12 | Carl Zeiss Smt Gmbh | Method and device for inspection of semiconductor samples |
JP6885492B1 (ja) * | 2020-05-13 | 2021-06-16 | 信越半導体株式会社 | 両面研磨方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05177539A (ja) * | 1991-12-24 | 1993-07-20 | Sumitomo Electric Ind Ltd | 両面ポリッシュ装置によるウェハ研磨方法 |
DE19704546A1 (de) * | 1997-02-06 | 1998-08-13 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer einseitig beschichteten und mit einem Finish versehenen Halbleiterscheibe |
DE19905737C2 (de) * | 1999-02-11 | 2000-12-14 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe mit verbesserter Ebenheit |
WO2000047369A1 (en) * | 1999-02-12 | 2000-08-17 | Memc Electronic Materials, Inc. | Method of polishing semiconductor wafers |
US6299514B1 (en) * | 1999-03-13 | 2001-10-09 | Peter Wolters Werkzeugmachinen Gmbh | Double-disk polishing machine, particularly for tooling semiconductor wafers |
DE10007390B4 (de) * | 1999-03-13 | 2008-11-13 | Peter Wolters Gmbh | Zweischeiben-Poliermaschine, insbesondere zur Bearbeitung von Halbleiterwafern |
JP4280397B2 (ja) * | 1999-10-21 | 2009-06-17 | スピードファム株式会社 | ワークの研磨方法 |
DE19956250C1 (de) * | 1999-11-23 | 2001-05-17 | Wacker Siltronic Halbleitermat | Kostengünstiges Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben |
DE10023002B4 (de) * | 2000-05-11 | 2006-10-26 | Siltronic Ag | Satz von Läuferscheiben sowie dessen Verwendung |
DE10314212B4 (de) * | 2002-03-29 | 2010-06-02 | Hoya Corp. | Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske |
JP4352229B2 (ja) * | 2003-11-20 | 2009-10-28 | 信越半導体株式会社 | 半導体ウェーハの両面研磨方法 |
JP4748968B2 (ja) * | 2004-10-27 | 2011-08-17 | 信越半導体株式会社 | 半導体ウエーハの製造方法 |
JP2006198751A (ja) * | 2005-01-24 | 2006-08-03 | Showa Denko Kk | 磁気ディスク用サブストレート基板の製造方法及び研磨装置 |
-
2006
- 2006-09-20 DE DE102006044367A patent/DE102006044367B4/de not_active Expired - Fee Related
-
2007
- 2007-07-18 SG SG200705306-9A patent/SG141306A1/en unknown
- 2007-07-18 SG SG201100848-9A patent/SG169385A1/en unknown
- 2007-08-22 CN CN2007101423520A patent/CN101148025B/zh not_active Expired - Fee Related
- 2007-08-28 KR KR1020070086640A patent/KR100915433B1/ko not_active IP Right Cessation
- 2007-09-11 US US11/853,103 patent/US20080070483A1/en not_active Abandoned
- 2007-09-13 TW TW096134221A patent/TWI336280B/zh not_active IP Right Cessation
- 2007-09-20 JP JP2007244188A patent/JP2008078660A/ja active Pending
-
2009
- 2009-02-04 KR KR1020090008911A patent/KR100945774B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20080026485A (ko) | 2008-03-25 |
KR100945774B1 (ko) | 2010-03-08 |
DE102006044367B4 (de) | 2011-07-14 |
DE102006044367A1 (de) | 2008-04-03 |
US20080070483A1 (en) | 2008-03-20 |
KR100915433B1 (ko) | 2009-09-03 |
KR20090020671A (ko) | 2009-02-26 |
TWI336280B (en) | 2011-01-21 |
JP2008078660A (ja) | 2008-04-03 |
CN101148025A (zh) | 2008-03-26 |
TW200815153A (en) | 2008-04-01 |
CN101148025B (zh) | 2010-06-23 |
SG141306A1 (en) | 2008-04-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG169385A1 (en) | Method for polishing a semiconductor wafer and polished semiconductor wafer producible according to the method | |
WO2009041277A1 (ja) | 半導体ウェハの製造方法 | |
TW200705562A (en) | Method for machining a semiconductor wafer on both sides in a carrier, carrier and a semiconductor wafer produced by the method | |
US20140206261A1 (en) | Method for polishing a semiconductor wafer | |
WO2008120578A1 (ja) | 金属膜研磨用パッドおよびそれを用いる金属膜の研磨方法 | |
US20130189904A1 (en) | Method for polishing a semiconductor wafer | |
TW200723382A (en) | Method for processing wafer | |
KR101600171B1 (ko) | 반도체 재료 웨이퍼를 연마하는 방법 | |
SG149772A1 (en) | Method for polishing a substrate composed of semiconductor material | |
IN2014MN01903A (zh) | ||
TW200620447A (en) | Semiconductor wafer and method for manufacturing the same | |
MY158519A (en) | Method of manufacturing a glass substrate for a magnetic disk | |
SG152978A1 (en) | Method for producing a semiconductor wafer with a polished edge | |
MY153077A (en) | Method to selectively polish silicon carbide films | |
TW200610012A (en) | Method of planarizing a semiconductor substrate | |
MY138427A (en) | Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer. | |
JP2008306189A (ja) | 裸半導体ウェハの片面ポリシングのための方法 | |
SE0802294L (sv) | Förfarande för tillverkning av en kiselkarbid-halvledarkrets | |
MY163691A (en) | Method for the double-side polishing of a semiconductor wafer | |
TW200420430A (en) | Lens blocking system | |
TW200621960A (en) | Polishing composition and polishing method using the same | |
SG171513A1 (en) | Method for polishing a semiconductor wafer | |
MY156911A (en) | Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers | |
TW200727369A (en) | A dicing die adhesive film for semiconductor | |
TWI416611B (zh) | 拋光墊及拋光半導體晶圓的方法 |