SG151234A1 - Polishing pad - Google Patents
Polishing padInfo
- Publication number
- SG151234A1 SG151234A1 SG200807222-5A SG2008072225A SG151234A1 SG 151234 A1 SG151234 A1 SG 151234A1 SG 2008072225 A SG2008072225 A SG 2008072225A SG 151234 A1 SG151234 A1 SG 151234A1
- Authority
- SG
- Singapore
- Prior art keywords
- opened
- pores
- foams
- polishing pad
- polyurethane sheet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249978—Voids specified as micro
- Y10T428/249979—Specified thickness of void-containing component [absolute or relative] or numerical cell dimension
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007260351 | 2007-10-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG151234A1 true SG151234A1 (en) | 2009-04-30 |
Family
ID=40297755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200807222-5A SG151234A1 (en) | 2007-10-03 | 2008-09-26 | Polishing pad |
Country Status (8)
Country | Link |
---|---|
US (1) | US7897250B2 (de) |
EP (1) | EP2045038B9 (de) |
JP (1) | JP5297096B2 (de) |
KR (1) | KR101492269B1 (de) |
CN (1) | CN101402187B (de) |
DE (1) | DE602008001138D1 (de) |
SG (1) | SG151234A1 (de) |
TW (1) | TWI405638B (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7799164B2 (en) | 2005-07-28 | 2010-09-21 | High Voltage Graphics, Inc. | Flocked articles having noncompatible insert and porous film |
JP5184448B2 (ja) * | 2009-06-23 | 2013-04-17 | 富士紡ホールディングス株式会社 | 研磨パッド、その製造方法および研磨加工方法 |
JP5502383B2 (ja) * | 2009-07-07 | 2014-05-28 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
JP5544131B2 (ja) * | 2009-09-03 | 2014-07-09 | 富士紡ホールディングス株式会社 | 研磨パッド |
US8162728B2 (en) * | 2009-09-28 | 2012-04-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Dual-pore structure polishing pad |
JP5520021B2 (ja) * | 2009-12-03 | 2014-06-11 | 富士紡ホールディングス株式会社 | 反射抑制シート |
JP5608398B2 (ja) * | 2010-03-26 | 2014-10-15 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP5421839B2 (ja) * | 2010-03-31 | 2014-02-19 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
CN102211319B (zh) * | 2010-04-08 | 2014-06-11 | 三芳化学工业股份有限公司 | 制造抛光垫的方法和抛光垫 |
JP2011218517A (ja) * | 2010-04-13 | 2011-11-04 | Toray Coatex Co Ltd | 研磨パッド |
TWI510328B (zh) * | 2010-05-03 | 2015-12-01 | Iv Technologies Co Ltd | 基底層、包括此基底層的研磨墊及研磨方法 |
KR20130124281A (ko) * | 2010-07-12 | 2013-11-13 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 및 화학 기계 연마 방법 |
JP5885183B2 (ja) * | 2010-09-28 | 2016-03-15 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP5789634B2 (ja) * | 2012-05-14 | 2015-10-07 | 株式会社荏原製作所 | ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法 |
JP5970287B2 (ja) * | 2012-08-02 | 2016-08-17 | 株式会社Filwel | 研磨布 |
JP6178190B2 (ja) * | 2012-09-28 | 2017-08-09 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP6228546B2 (ja) * | 2012-09-28 | 2017-11-08 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP2016502470A (ja) * | 2012-10-12 | 2016-01-28 | ハイ ボルテイジ グラフィックス インコーポレイテッドHigh Voltage Graphics,Inc. | 熱融着可能な可撓性の装飾品およびそれを製造する方法 |
US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
JP6567420B2 (ja) * | 2013-09-11 | 2019-08-28 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
US8980749B1 (en) | 2013-10-24 | 2015-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing silicon wafers |
WO2015153601A1 (en) * | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
CN105269451A (zh) * | 2014-07-02 | 2016-01-27 | 大元化成株式会社 | 具有高精度的平坦度的保持垫 |
US10189143B2 (en) | 2015-11-30 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad, method for manufacturing polishing pad, and polishing method |
US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
TWI621501B (zh) * | 2017-01-06 | 2018-04-21 | 三芳化學工業股份有限公司 | 研磨墊及研磨裝置 |
CN106826541B (zh) * | 2017-03-09 | 2019-03-29 | 佛山市金辉高科光电材料股份有限公司 | 一种抛光垫及其制备方法 |
US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
US11667061B2 (en) * | 2020-04-18 | 2023-06-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming leveraged poromeric polishing pad |
US20210323116A1 (en) * | 2020-04-18 | 2021-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Offset pore poromeric polishing pad |
US20210323115A1 (en) * | 2020-04-18 | 2021-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Leveraged poromeric polishing pad |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006239786A (ja) * | 2005-03-01 | 2006-09-14 | Fujibo Holdings Inc | 保持パッド |
JP2006247807A (ja) * | 2005-03-14 | 2006-09-21 | Fujibo Holdings Inc | 研磨布及び研磨布の製造方法 |
JP2006297515A (ja) * | 2005-04-19 | 2006-11-02 | Fujibo Holdings Inc | 研磨布 |
JP2007260884A (ja) * | 2006-03-30 | 2007-10-11 | Fujibo Holdings Inc | 研磨布 |
JP2008036786A (ja) * | 2006-08-08 | 2008-02-21 | Fujibo Holdings Inc | 研磨布 |
JP2008238323A (ja) * | 2007-03-27 | 2008-10-09 | Toyo Tire & Rubber Co Ltd | ポリウレタン発泡体の製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4841680A (en) * | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
JPH07207052A (ja) * | 1994-01-19 | 1995-08-08 | Mitsubishi Chem Corp | ウレタン樹脂系多孔質複合体 |
JP3042593B2 (ja) * | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
JPH10128674A (ja) * | 1996-10-28 | 1998-05-19 | Rooder Nitta Kk | 研磨用パッド |
JP2001001253A (ja) * | 1999-06-21 | 2001-01-09 | Toray Ind Inc | 研磨布 |
KR100685010B1 (ko) * | 1999-08-31 | 2007-02-20 | 신에쯔 한도타이 가부시키가이샤 | 반도체 웨이퍼용 연마포 및 연마방법 |
TW498095B (en) * | 2000-05-05 | 2002-08-11 | San Fang Chemical Industry Co | Method for producing polishing material |
JP4444522B2 (ja) * | 2001-03-13 | 2010-03-31 | 東レコーテックス株式会社 | 研磨パッド |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
JP4659338B2 (ja) * | 2003-02-12 | 2011-03-30 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド |
JP2004306149A (ja) * | 2003-04-02 | 2004-11-04 | Kanebo Ltd | 研磨用クロス及びその製造方法 |
JP2004358584A (ja) * | 2003-06-03 | 2004-12-24 | Fuji Spinning Co Ltd | 研磨布及び研磨加工方法 |
US6899602B2 (en) * | 2003-07-30 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Nc | Porous polyurethane polishing pads |
JP4555559B2 (ja) * | 2003-11-25 | 2010-10-06 | 富士紡ホールディングス株式会社 | 研磨布及び研磨布の製造方法 |
CN1814410A (zh) * | 2005-02-02 | 2006-08-09 | 三芳化学工业股份有限公司 | 研磨片材及其制造方法与抛光装置 |
JP2007160474A (ja) * | 2005-12-15 | 2007-06-28 | Nitta Haas Inc | 研磨布およびその製造方法 |
EP2062932B1 (de) * | 2006-07-28 | 2013-09-11 | Toray Industries, Inc. | Verfahren zur herstellung einer interpenetrierenden polymernetzwerkstruktur und eines polierkissens |
-
2008
- 2008-06-06 JP JP2008149142A patent/JP5297096B2/ja active Active
- 2008-06-18 KR KR1020080057513A patent/KR101492269B1/ko active IP Right Grant
- 2008-07-03 CN CN2008101260994A patent/CN101402187B/zh active Active
- 2008-07-03 TW TW97125150A patent/TWI405638B/zh active
- 2008-09-23 EP EP20080164895 patent/EP2045038B9/de active Active
- 2008-09-23 DE DE200860001138 patent/DE602008001138D1/de active Active
- 2008-09-26 SG SG200807222-5A patent/SG151234A1/en unknown
- 2008-09-30 US US12/242,588 patent/US7897250B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006239786A (ja) * | 2005-03-01 | 2006-09-14 | Fujibo Holdings Inc | 保持パッド |
JP2006247807A (ja) * | 2005-03-14 | 2006-09-21 | Fujibo Holdings Inc | 研磨布及び研磨布の製造方法 |
JP2006297515A (ja) * | 2005-04-19 | 2006-11-02 | Fujibo Holdings Inc | 研磨布 |
JP2007260884A (ja) * | 2006-03-30 | 2007-10-11 | Fujibo Holdings Inc | 研磨布 |
JP2008036786A (ja) * | 2006-08-08 | 2008-02-21 | Fujibo Holdings Inc | 研磨布 |
JP2008238323A (ja) * | 2007-03-27 | 2008-10-09 | Toyo Tire & Rubber Co Ltd | ポリウレタン発泡体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20090034712A (ko) | 2009-04-08 |
EP2045038B9 (de) | 2010-09-08 |
KR101492269B1 (ko) | 2015-02-11 |
TW200916268A (en) | 2009-04-16 |
TWI405638B (zh) | 2013-08-21 |
US20090093200A1 (en) | 2009-04-09 |
JP5297096B2 (ja) | 2013-09-25 |
CN101402187A (zh) | 2009-04-08 |
US7897250B2 (en) | 2011-03-01 |
EP2045038A1 (de) | 2009-04-08 |
EP2045038B1 (de) | 2010-05-05 |
CN101402187B (zh) | 2011-04-06 |
DE602008001138D1 (de) | 2010-06-17 |
JP2009101504A (ja) | 2009-05-14 |
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