TW498095B - Method for producing polishing material - Google Patents

Abstract

A method for producing a polishing material can simultaneously obtain a first polishing material formed integrally and having an elastic substrate layer and a bare opening layer, and a second polishing material that has been laminated and has a suitable elastic property or a wafer carrier, in which the two polishing materials all have a smooth and uniform surface.

Description

498095

V. Description of the Invention (l) [Field of Invention] The polishing material may be suitable for semiconducting. The present invention relates to a method for manufacturing a polishing material, which is suitable for the polishing of optical materials and electronic materials. material. [Prior technology] At present, the commercially available polishing material is a base layer, and the surface layer must be a bare open layer. It has the effect of absorbing and maintaining the slurry. The slurry can flow uniformly. Layer and surface layer, where the bottom layer is a bullet hole layer. The polishing method for the bare fruit of the exposed hole layer and the grinding process in the polishing process are as follows: First, the elastic base layer is dipped in a polyurethane resin solution, and the surface is ground and dust-removed into a polishing material after being solidified by water. Second, a polyurethane film is applied to coat a polyurethane resin to form a continuous porous polyurethane resin film, and the continuous porous polyurethane resin film is exposed to continuous holes to become a polishing material after dust removal on the research surface. The disadvantage of this system is that the remaining dust is generated and deposited in the holes. The dust removal at the rear stage is required to remove the dust, which is not easy to clean and time consuming. The polished flatness is poorly controlled. [Objective and technical means of the invention] Polishing material = The manufacturing method is: firstly coating the elastic base layer with polyamine cool resin solution and solidifying with water to form an elastic layer with a continuous porous film; replacing the grinding process and the rear surface deer with a sound sheet, and only the clothing and dust removal process; Cut evenly. In this way, you can get a surface that has an earlier ridge, a flat and uniform surface, and an integrally formed shoulder elastic base layer and bare open sound like soil. ^ Fit different elastic base layers to form a pair of 2 Anti-collapsing 4 li, made with paste and with different elasticity Zhu 498095 V. Description of the invention (2) The polishing material or wafer carrier of shell, where the elasticity is dangerous to numbness 1, and Ding Bi ’s bottom layer may be Pressure = cotton, polyester film, non-woven polyurethane resin or acrylic resin. The first aspect of the present invention is to use the uniformity of the slice replacement to avoid throwing the clean polished material sheet. 'Increase the wafer after polishing to obtain a smoother uniform grinding and dust removal to remove contamination of the residual powder of the engineering light material. The second purpose is to simplify the process and reduce costs and reduce waste. By reducing the surface dust removal process, the process can be simplified, and the surface film can be reprocessed into a polishing material or a wafer carrier.

The second object of the present invention is to increase the yield and variety. A continuous porous polyurethane resin film is cut by sectioning, and a polishing material with an elastic base layer and an exposed opening layer can be obtained at the same time. Made of polishing material or wafer carrier with different elastic characteristics. _ [Examples] Please refer to the attached drawings to illustrate the present invention by the following examples: Please refer to Figs. 1 and 2 and 3 for a semi-finished product of polishing material with a continuous porous film. Layer 丨 2 is coated with a polyurethane resin solution and coagulated with water to form a continuous porous layer 1 1. The continuous porous layer is polished through the grinding process A 丨 丨 Surface polishing can obtain a conventional polishing material 20 and residual powder 21, of which a conventional polishing material 20 is composed of a bare open-pore layer 丨 la and an elastic base layer 12, in which ¥ · residual dust 2 1 remains in the bare open-layer 丨 丨 & must be subjected to a surface dust removal treatment. Please refer to Figure 4 As shown in the figure, the manufacturing method of the present invention is to cut the surface of a semi-finished product of a polishing material 10 (see Figure 5) with a continuous porous film.

498095 V. Description of the invention (3)

Process B cuts the continuous porous layer W all together to produce a first polishing material 30 composed of the exposed open elastic base layer 12 (see Nos. 6 and 7 I = Porous membrane 31, of which-Polished lion series-Body forming It has an elastic layer and an exposed open-cell layer. &Amp; The open-cell film 31 and the adhesive base C are used to form a second polish 40 on another elastic base layer 32 (see Fig. 8). Please select a material with appropriate elasticity for the 2 products. The material is acrylic resin, rubber :: body, foam, polyacetate film or non-woven polyurethane resin. The elastic base layer 32 is composed of Polyolefin or polyimide film or thermoplastic polymer

It is composed of a base material such as an ester woven fabric, so that the second polishing material 40 is used as a wafer carrier. Compared to Figure 2 and Figure 6 ', the conventional manufacturing method and the polishing obtained by the present invention | 2 L Ϊ It is found that the first polishing material of the present invention has a more uniform and flat surface than the exposed opening layer of the conventional polishing material. [Efficacy] The present invention has the following effects: A method for manufacturing a polishing material that can obtain a smooth and even surface of the polishing material. One mention = one kind of polishing that can simultaneously obtain an integrally formed first polishing material with an elastic base layer and an open-layer layer and a composite second polishing material or wafer carrier that is bonded and has appropriate properties.材 制造 方法 Wood manufacturing methods. A method for manufacturing a polishing material that simplifies the manufacturing process is provided. three

498095 V. Description of the invention (4) The present invention can be implemented in various forms. Therefore, the ester resin is prepared by continuous cutting to obtain two polishing base materials, such as a composite polishing material resin, a rubber elastic resin, and a polyolefin woven fabric. Therefore, the foregoing is preferred. Think of it as defined by the scope of the present invention. The scope of the patent application is 0. The scope of the example is clear. The scope of the definition is defined by the content of the modification. Hair, hair type, and aggregation are the limitations of the wafer implementation, rather than the equivalent fine polishing layer. The film, one of which has a carrier, and the foamed polyester is thin, depending on the carrier. Just with. This manual can be used to make a series of daggers or gods and special materials. The two bare open shells, polyester film, heat, etc. The method of the present invention is to pore layer to open the skin and pore layer. The other methods can not be first formed by sectioning the film, respectively, with appropriate layer systems, woven fabrics filled with aminoformaldehyde can be briefly listed, the following. It is the same shape of the present invention—polyamine. Process average. It is attached with elastic special acrylic, polyamine, vinegar, or made separately.

C: \ Logo-5 \ patent \ PK7138.ptd Page 7 498095 Schematic description [Schematic description] Figure 1: Conventional manufacturing method. Fig. 2: An enlarged side view of a longitudinal section of a polishing material obtained by a conventional manufacturing method. Figure 3: An enlarged top view of a polishing material obtained by a conventional manufacturing method. Figure 4: The manufacturing method of the present invention. Fig. 5: Side enlarged view of a longitudinal section of a polishing material semi-finished product obtained by the manufacturing method of the present invention. Fig. 0 Fig. 6: Side enlarged view of a longitudinal section of the polishing material obtained by the present invention. Fig. 7 ... An enlarged top view of a polishing material obtained by the present invention. Figure 8: An enlarged side view of a longitudinal section of a second polishing material obtained by the present invention [Illustration of drawing number] A Grinding process B Sectioning process C Adhesive bonding

10 Continuous porous film 11 Continuous porous film 11 b Exposed open cell layer 12 Flexible base layer 20 Custom polishing material 3 0 First polishing material 32 Elastic base layer 4 0 Second polishing material Elastic base layer Polishing material semi-finished product 11 a Exposed open Pore layer 21 Residual dust 31 Opening film

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Claims (1)

49809S-Announcement VI. Application Patent Scope 1. A method for manufacturing a polishing material. An elastic base layer is coated with a polyurethane resin solution and solidified by water to form a continuous porous layer. The continuous porous layer is uniformly cut by a cutting process to obtain a The first polishing material and an open-hole coating film, wherein the first polishing material is an integrally formed polishing material with an exposed open-hole layer and an elastic layer, and the open-hole film is adhered to another elastic base layer to form a second polishing material. In which, the second polishing material is a composite polishing material with an exposed opening layer and appropriate elastic properties. 2. The polishing material manufacturing method according to item 1 of the scope of the patent application, wherein the elastic base layer of the first polishing material or the second polishing material is made of acrylic resin, rubber elastomer, foamed cotton, polyester film 2. Non-woven fabric is filled with polyurethane resin or acrylic resin. I 3. The polishing material manufacturing method according to item 1 of the scope of the patent application, wherein the elastic base layer of the second polishing material is made of a polyolefin-based, polyester-based film, a thermoplastic polyurethane or a woven fabric, etc. The structure makes the first polishing material a wafer carrier with a flat and uniform surface. 4. A polishing material manufacturing method. First, a continuous porous layer is prepared from a polyurethane resin, and the continuous porous layer is cut evenly by a sectioning process to obtain two open-cell films, wherein the two open-cell films are adhered to each other and have an elasticity. The base layer forms a composite polishing material or wafer carrier with an exposed opening layer and suitable elastic properties. j 5. The polishing material manufacturing method according to item 4 of the scope of the patent application, wherein the elastic base layer is made of rubber elastomer, foam, polyg film, non-woven polyurethane resin, acrylic resin, It consists of a base material such as polyolefin resin, polyester, thermoplastic polyurethane or woven fabric. C: \ Logo-5 \ patent \ PK7138.ptd Page 9