JP6963446B2 - Holding pad - Google Patents
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- JP6963446B2 JP6963446B2 JP2017171621A JP2017171621A JP6963446B2 JP 6963446 B2 JP6963446 B2 JP 6963446B2 JP 2017171621 A JP2017171621 A JP 2017171621A JP 2017171621 A JP2017171621 A JP 2017171621A JP 6963446 B2 JP6963446 B2 JP 6963446B2
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- holding pad
- holding
- polyurethane resin
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- polished
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- 239000002390 adhesive tape Substances 0.000 claims description 66
- 229920005749 polyurethane resin Polymers 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 19
- 238000005498 polishing Methods 0.000 description 18
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 17
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 238000000227 grinding Methods 0.000 description 6
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- 239000000654 additive Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
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- 238000010030 laminating Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 230000001112 coagulating effect Effects 0.000 description 3
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- 239000011248 coating agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
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- 238000002360 preparation method Methods 0.000 description 2
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- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明は、湿式成膜法により製造されたポリウレタン樹脂シートを有してなる保持パッドに関する。 The present invention relates to a holding pad having a polyurethane resin sheet manufactured by a wet film forming method.
近年、例えば、液晶用ガラス基板等のフラットディスプレイパネルでは、大型化、軽量化、薄型化のニーズが大きく、例えば、一辺が3mを超える大型のガラス基板が使用されるに至っている。このようなガラス基板等の被研磨物を研磨パッドによって研磨加工するときには、該被研磨物を保持する保持パッドも該被研磨物のサイズの拡大に合わせて大型化する必要がある。 In recent years, for example, in a flat display panel such as a glass substrate for a liquid crystal display, there is a great need for larger size, lighter weight, and thinner size, and for example, a large glass substrate having a side of more than 3 m has been used. When an object to be polished such as a glass substrate is polished by a polishing pad, the holding pad for holding the object to be polished also needs to be enlarged in accordance with the increase in the size of the object to be polished.
大型保持パッドは、軟質で密着保持性のある保持面を備えて被研磨物を保持するポリウレタン樹脂シートと、このポリウレタン樹脂シートにおける保持面の反対側に粘着されて該ポリウレタン樹脂シートを保持定盤に貼り付ける両面粘着テープとを有して構成される。両面粘着テープが備えるテープ基材の存在によって軟質なポリウレタン樹脂シートに腰の強さを付加し、取扱い性の向上を図っている。 The large holding pad has a polyurethane resin sheet that has a soft and adhesive holding surface to hold the object to be polished, and a platen that is adhered to the opposite side of the holding surface of the polyurethane resin sheet to hold the polyurethane resin sheet. It is configured to have a double-sided adhesive tape to be attached to. The presence of the tape base material provided by the double-sided adhesive tape adds waist strength to the soft polyurethane resin sheet to improve handleability.
このような大型ガラス基板用の大型保持パッドでは、保持定盤に貼り付けるための両面粘着テープも大型保持パッドに対応する大型のものが必要であるが、2000mm幅以上(特に、2500mm幅以上)の両面粘着テープは汎用品としての入手に困難があるため、1個の大型保持パッドに複数枚の両面粘着テープを並べて用いるものが提案されてきた。ところが、両面粘着テープは剛性のあるテープ基材の両面に粘着層を設けたものであり、このような両面粘着テープの保管や運搬時には相隣る両面粘着テープの境界部で折れ曲がり、折れ痕に起因して保持面の平坦性を損なうおそれがある。また、保持定盤への貼付け時には、ポリウレタン樹脂シートが軟質であることから、相隣る両面粘着テープの境界部でポリウレタン樹脂シートが伸ばされることがあり、保持定盤に貼り付けられたポリウレタン樹脂シートの保持面に皺やくぼみを形成し、このような保持パッドを用いて研磨加工された被研磨物の研磨品質を損なうおそれもある。 In such a large holding pad for a large glass substrate, a large double-sided adhesive tape for attaching to the holding surface plate is also required to be large enough to correspond to the large holding pad, but the width is 2000 mm or more (particularly 2500 mm width or more). Since it is difficult to obtain the double-sided adhesive tape as a general-purpose product, it has been proposed to use a plurality of double-sided adhesive tapes side by side on one large holding pad. However, double-sided adhesive tape has adhesive layers provided on both sides of a rigid tape base material, and when such double-sided adhesive tape is stored or transported, it bends at the boundary between adjacent double-sided adhesive tapes, resulting in creases. As a result, the flatness of the holding surface may be impaired. In addition, since the polyurethane resin sheet is soft when attached to the holding platen, the polyurethane resin sheet may be stretched at the boundary between adjacent double-sided adhesive tapes, and the polyurethane resin attached to the holding platen may be stretched. Wrinkles and dents may be formed on the holding surface of the sheet, and the polishing quality of the object to be polished using such a holding pad may be impaired.
そこで従来、大型保持パッド用の両面粘着テープとして、大型ポリウレタン樹脂シートと同じサイズで高剛性の1枚物をなすPETフィルム等からなるテープ基材を採用し、このテープ基材の両面に、粘着層のみでシート状に形成された複数枚のノンサポート型粘着テープを互いに隙間を介して並列に貼り合わせるものが開示されている(特許文献1、特許文献2)。 Therefore, conventionally, as a double-sided adhesive tape for a large holding pad, a tape base material made of PET film or the like, which has the same size as a large polyurethane resin sheet and forms a single piece with high rigidity, has been adopted, and adhesive to both sides of the tape base material. A plurality of non-support type adhesive tapes formed in a sheet shape with only layers are disclosed in parallel with each other through a gap (Patent Documents 1 and 2).
特許文献1に記載の保持パッドは、両面粘着テープを構成するテープ基材の一面の側に備えた複数枚のノンサポート型粘着テープ間の隙間と、テープ基材の他面の側に備えた複数枚のノンサポート型粘着テープ間の隙間とが、保持パッドの厚み方向において重なり合っている。このような保持パッドによって保持された被研磨物の研磨加工時には、片面研磨装置の保持定盤に上述の両面粘着テープを介して配置される軟質のポリウレタン樹脂の保持面に保持されることとなる被研磨物が、両面粘着テープの一面の側の隙間と他面の側の隙間がそれらの長さ方向に渡り重複して相乗的に転写された状態で研磨加工されるものになり、被研磨物の研磨品質を損なう。 The holding pad described in Patent Document 1 is provided in a gap between a plurality of non-support type adhesive tapes provided on one side of a tape base material constituting a double-sided adhesive tape and on the other side of the tape base material. The gaps between the plurality of non-support type adhesive tapes overlap in the thickness direction of the holding pad. At the time of polishing the object to be polished held by such a holding pad, it is held on the holding surface of the soft polyurethane resin arranged on the holding platen of the single-sided polishing device via the above-mentioned double-sided adhesive tape. The object to be polished is polished in a state where the gap on one side and the gap on the other side of the double-sided adhesive tape overlap in the length direction and are synergistically transferred. It impairs the polishing quality of objects.
特許文献2に記載の保持パッドは、両面粘着テープを構成するテープ基材の一面の側に備えた複数枚のノンサポート型粘着テープ間の隙間の延在方向と、テープ基材の他面の側に備えた複数枚のノンサポート型粘着テープ間の隙間の延在方向とが、互いに平行をなす位置に配置され、特許文献1に記載の如くの厚み方向における重なり合いが回避されている。このような両面粘着テープを用いて研磨加工される被研磨物であっても、両面粘着テープの互いに平行をなす位置に配置された隙間のそれぞれが転写され、その被研磨面には一定間隔で平行をなす極めて特徴的な筋状の研磨ムラを生じる場合がある。この特徴的な研磨ムラは、薄厚化に伴い、従来では問題にならなかった程度の品質でも、薄い基板の研磨では、影響が出易く品質低下になり、望ましくない。 The holding pad described in Patent Document 2 includes the extending direction of the gap between a plurality of non-support type adhesive tapes provided on one side of the tape base material constituting the double-sided adhesive tape, and the other side of the tape base material. The extending direction of the gap between the plurality of non-support type adhesive tapes provided on the side is arranged at a position parallel to each other, and the overlap in the thickness direction as described in Patent Document 1 is avoided. Even for an object to be polished using such a double-sided adhesive tape, each of the gaps arranged at positions parallel to each other of the double-sided adhesive tape is transferred to the surface to be polished at regular intervals. Extremely characteristic streaky polishing unevenness may occur in parallel. This characteristic polishing unevenness is not desirable because the quality is not a problem in the past due to the thinning, but the polishing of a thin substrate tends to have an influence and the quality deteriorates.
本発明の課題は、テープ基材の一面と他面にそれぞれ複数枚のノンサポート型粘着テープが互いに隙間を形成せず、又は小隙間を介して並んで貼り合わされた両面粘着テープを、ポリウレタン樹脂シートの保持面の反対側面に粘着して構成される保持パッドを用いる研磨加工において、被研磨物の被研磨面における特徴的な研磨ムラの発生を抑制することにある。 An object of the present invention is to prepare a double-sided adhesive tape in which a plurality of non-support type adhesive tapes are bonded side by side through a small gap on one surface and the other surface of the tape base material without forming a gap with each other. The purpose is to suppress the occurrence of characteristic polishing unevenness on the surface to be polished of the object to be polished in the polishing process using the holding pad formed by adhering to the opposite side surface of the holding surface of the sheet.
請求項1に係る発明は、被研磨物を保持する保持面を備えたポリウレタン樹脂シートを有し、テープ基材の一面と他面にそれぞれ複数枚のノンサポート型粘着テープが互いに重ならずに隣接して貼り合わされた両面粘着テープが、ポリウレタン樹脂シートの保持面の反対側面に粘着される保持パッドであって、テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間のすべての境界の延在方向のそれぞれと、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間のすべての境界の延在方向のそれぞれとが互いに交差配置されるようにしたものである。 The invention according to claim 1 has a polyurethane resin sheet provided with a holding surface for holding an object to be polished, and a plurality of non-support type adhesive tapes do not overlap each other on one surface and the other surface of the tape base material. Adjacently bonded double-sided adhesive tape is a holding pad that is adhered to the opposite side of the holding surface of the polyurethane resin sheet, and is all between a plurality of non-support type adhesive tapes provided on one surface of the tape base material. and each of the extending direction of the border, in which as the respective extending directions of all the boundaries between a plurality of non-support type adhesive tape with the other surface of the tape base material is cross each other ..
請求項2に係る発明は、請求項1に係る発明において更に、前記保持パッドが、隣り合う2辺の長さがいずれも2000mm以上とする矩形状、又は直径を2000mm以上とする円形状であるようにしたものである。 The invention according to claim 2 is the invention according to claim 1, wherein the holding pad has a rectangular shape having two adjacent sides having a length of 2000 mm or more, or a circular shape having a diameter of 2000 mm or more. It was made like this.
請求項3に係る発明は、請求項1又は2に係る発明において更に、前記テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間の境界の延在方向と、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間の境界の延在方向の交差角が60度乃至120度の範囲内に定められるようにしたものである。 The invention according to claim 3 is the invention according to claim 1 or 2, further comprising the extending direction of the boundary between a plurality of non-support type adhesive tapes provided on one surface of the tape base material, the tape base material, and the like. The intersection angle in the extending direction of the boundary between a plurality of non-support type adhesive tapes provided on the surface is set within the range of 60 degrees to 120 degrees.
請求項4に係る発明は、請求項1乃至3のいずれかに係る発明において更に、前記テープ基材の一面と他面にそれぞれ貼り合わされた複数枚のノンサポート型粘着テープ間の境界の幅が1.0mm以下であるようにしたものである。 In the invention according to claim 4, in the invention according to any one of claims 1 to 3, the width of the boundary between a plurality of non-support type adhesive tapes bonded to one surface and the other surface of the tape base material is further set. It is set to 1.0 mm or less.
請求項5に係る発明は、請求項1乃至4のいずれかに係る発明において更に、前記保持パッドを構成するポリウレタン樹脂シートが、A硬度を5以上50以下とする保持面を備えるようにしたものである。 The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the polyurethane resin sheet constituting the holding pad further includes a holding surface having an A hardness of 5 or more and 50 or less. Is.
本発明によれば、保持パッドを構成するポリウレタン樹脂シートの保持面の反対側面に粘着される両面粘着テープにおいて、テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間の境界の延在方向と、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間の境界の延在方向とが互いに交差配置されるものにした。これにより、このような保持パッドを用いる研磨加工において、被研磨物の被研磨面に上述の2方向の境界に起因して該被研磨面に生ずる研磨ムラを抑制することができる。 According to the present invention, in a double-sided adhesive tape that is adhered to the opposite side surface of a polyurethane resin sheet constituting a holding pad, the boundary between a plurality of non-support type adhesive tapes provided on one surface of the tape base material is extended. The existing direction and the extending direction of the boundary between the plurality of non-supported adhesive tapes provided on the other surface of the tape base material are arranged so as to intersect each other. Thereby, in the polishing process using such a holding pad, it is possible to suppress the polishing unevenness that occurs on the surface to be polished due to the above-mentioned boundary in the two directions on the surface to be polished.
1.保持パッドの特徴的構成及び作用
(1)保持パッドを構成するポリウレタン樹脂シートに粘着される両面粘着テープにおいて、テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間で隙間を形成せず、又は小隙間を形成してなる境界G1の延在方向と、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間で隙間を形成せず、又は小隙間を形成してなる境界G2の延在方向とが交差角αをなして互いに交差配置される。
1. 1. Characteristic composition and action of holding pad
(1) In the double-sided adhesive tape that is adhered to the polyurethane resin sheet that constitutes the holding pad, no gap is formed or a small gap is formed between a plurality of non-support type adhesive tapes provided on one surface of the tape base material. The extending direction of the boundary G1 and the extending direction of the boundary G2 formed on the other surface of the tape base material without forming a gap or forming a small gap. Are arranged to intersect each other with an intersection angle α.
このようは保持パッドにおいて、上述のテープ基材の両面のそれぞれに形成された境界G1と境界G2が該保持パッドの厚み方向で重なり合う箇所は、それらの境界G1と境界G2の交点である局所のみになる。従って、このような保持パッドに被研磨物を保持して研磨加工するに際しては、上述の境界G1、G2の重なり部分が少なく影響も極僅かになり、該被研磨物における被研磨面の平坦性を大きく損なうことがない。また、被研磨物の被研磨面に、一定間隔で平行をなす極めて特徴的な筋状の研磨ムラが発生せず、品質低下を抑制する。 In this way, in the holding pad, the boundary G1 and the boundary G2 formed on both sides of the above-mentioned tape base material overlap each other in the thickness direction of the holding pad only locally, which is the intersection of the boundary G1 and the boundary G2. become. Therefore, when the object to be polished is held on such a holding pad and polished, the overlapping portion of the above-mentioned boundaries G1 and G2 is small and the influence is very small, and the flatness of the surface to be polished in the object to be polished Does not significantly damage. In addition, extremely characteristic streak-like polishing unevenness that is parallel to the surface to be polished of the object to be polished does not occur at regular intervals, and deterioration of quality is suppressed.
(2)保持パッドが、隣り合う2辺の長さがいずれも2000mm以上とする矩形状、又は直径を2000mm以上とする円形状とする大型保持パッドであるとき、保持パッドは、両面粘着テープが備えるテープ基材の存在によって軟質なポリウレタン樹脂シートに腰の強さを付加し、保持定盤への貼り付け時に該保持定盤との間に空気の噛み込みを生じたり、皺を生ずることなく、従って熟練を要することなく貼り付けでき、取扱い性を向上できる。 (2) When the holding pad is a large holding pad having a rectangular shape having two adjacent sides having a length of 2000 mm or more or a circular shape having a diameter of 2000 mm or more, the holding pad is made of double-sided adhesive tape. The presence of the provided tape base material adds waist strength to the soft polyurethane resin sheet, and does not cause air to get caught or wrinkle between the flexible polyurethane resin sheet and the holding surface plate when it is attached to the holding surface plate. Therefore, it can be pasted without requiring skill, and the handleability can be improved.
また、両面粘着テープを構成するテープ基材が1枚物とされることにより、保持パッドの保管や運搬時に該保持パッドを巻物とするときにも、テープ基材の両面に貼り合わされたノンサポート型粘着テープの境界部分における保持パッドの折れ曲がりを抑えることができる。また、保持パッドの保持定盤への貼り付け時に軟質なポリウレタン樹脂シートが上述のノンサポート型粘着テープの境界に対応する部分で伸びるのを抑えることができる。これにより、保持パッドを構成するポリウレタン樹脂シートの保持面に皺やくぼみを生ずることが回避され、これらの皺やくぼみが被研磨物に転写して該被研磨物における被研磨面の平坦性を損なうことを防止できる。 Further, since the tape base material constituting the double-sided adhesive tape is made of one piece, the non-support bonded to both sides of the tape base material can be used even when the holding pad is used as a scroll during storage or transportation of the holding pad. Bending of the holding pad at the boundary portion of the type adhesive tape can be suppressed. Further, it is possible to prevent the soft polyurethane resin sheet from stretching at the portion corresponding to the boundary of the non-support type adhesive tape described above when the holding pad is attached to the holding surface plate. As a result, it is possible to prevent wrinkles and dents from being generated on the holding surface of the polyurethane resin sheet constituting the holding pad, and these wrinkles and dents are transferred to the object to be polished to improve the flatness of the surface to be polished in the object to be polished. It can be prevented from being damaged.
(3)前述(1)の境界G1と境界G2の交差角αは、90度とすることが理想であるものの、90度±30度(60度乃至120度)であれば前述(1)の作用を得ることができ、90度±10度(80度乃至100度)であれば前述(1)の作用をより確実に得ることができる。 (3) Ideally, the intersection angle α of the boundary G1 and the boundary G2 of the above-mentioned (1) is 90 degrees, but if it is 90 degrees ± 30 degrees (60 to 120 degrees), the above-mentioned (1) The action can be obtained, and if it is 90 degrees ± 10 degrees (80 degrees to 100 degrees), the action of (1) described above can be obtained more reliably.
(4)前述(1)の境界G1と境界G2の幅は、0.0mmである(隙間がない)ことが最も好ましいが、1.0mm以下(小隙間)であれば、それらの境界G1、G2の存在が被研磨物における被研磨面の平坦性に及ぼす悪影響を最小限に抑えることができる。 (4) The width of the boundary G1 and the boundary G2 in (1) described above is most preferably 0.0 mm (no gap), but if it is 1.0 mm or less (small gap), the boundary G1 and the boundary G2, The adverse effect of the presence of G2 on the flatness of the surface to be polished on the object to be polished can be minimized.
(5)本発明の保持パッドを構成するポリウレタン樹脂シートが、A硬度を5以上50以下とする程度に軟質な保持面を備えるとき、ポリウレタン樹脂シートの保持面は被研磨物を安定的に密着保持するに必要とされる軟質性を確実に備えつつ、被研磨物が保持面に過度に沈み込むことを抑制するものになる。そして、このような保持パッドに本発明が適用されるとき、前述(1)の境界G1、G2の重なりがそのように軟質なポリウレタン樹脂シートの保持面を介して被研磨物に転写し、該被研磨物における被研磨面の平坦性が損なわれるおそれを効果的かつ顕著に回避できる。 (5) When the polyurethane resin sheet constituting the holding pad of the present invention has a holding surface soft to such an extent that the A hardness is 5 or more and 50 or less, the holding surface of the polyurethane resin sheet stably adheres to the object to be polished. It ensures that the softness required for holding is provided, and prevents the object to be polished from excessively sinking into the holding surface. Then, when the present invention is applied to such a holding pad, the overlap of the boundaries G1 and G2 of the above-mentioned (1) is transferred to the object to be polished through the holding surface of such a soft polyurethane resin sheet, and the said. It is possible to effectively and remarkably avoid the possibility that the flatness of the surface to be polished in the object to be polished is impaired.
2.保持パッドの製造方法
本発明の保持パッドを製造する方法として、代表的な方法を以下に説明する。該方法は、少なくとも以下の構成:
準備工程
塗布工程
凝固再生工程
洗浄・乾燥工程
研削処理工程
ラミネート加工工程
を含んでいる。
2. Method for manufacturing a holding pad A typical method for manufacturing the holding pad of the present invention will be described below. The method has at least the following configurations:
Preparation process Coating process Solidification regeneration process Cleaning / drying process Grinding process Includes laminating process.
(準備工程)
準備工程では、ポリウレタン樹脂、ポリウレタン樹脂を溶解可能な水混和性の有機溶媒のN、N−ジメチルホルムアミド(以下、DMFと略記する。)及び添加剤を混合してポリウレタン樹脂を溶解させる。水混和性の有機溶媒としては、水と任意の割合で混ざり合う有機溶媒であれば良く、DMF以外に、例えばN,N−ジメチルアセトアミド等を用いても良い。ポリウレタン樹脂には、ポリエステル系、ポリエーテル系、ポリカーボネート系等の樹脂から数平均分子量が5,000〜100,000の範囲のものを選択して用い、例えば、ポリウレタン樹脂が30重量%となるようにDMFに溶解させる。ポリウレタン樹脂の分子量を制限することにより、凝固再生工程において、ポリウレタン樹脂の分子移動を円滑にすることができる。添加剤としては、発泡の平均厚さ方向の長さや単位体積あたりの個数を制御するため、カーボンブラック等の顔料、発泡の形成を促進させる親水性添加剤及びポリウレタン樹脂の凝固再生を安定化させる疎水性添加剤等を用いることができる。得られた溶液を減圧下で脱泡してポリウレタン樹脂溶液を得る。
(Preparation process)
In the preparatory step, the polyurethane resin, N, N-dimethylformamide (hereinafter abbreviated as DMF), which is a water-miscible organic solvent capable of dissolving the polyurethane resin, and an additive are mixed to dissolve the polyurethane resin. The water-miscible organic solvent may be any organic solvent that mixes with water at an arbitrary ratio, and for example, N, N-dimethylacetamide or the like may be used in addition to DMF. As the polyurethane resin, a resin having a number average molecular weight in the range of 5,000 to 100,000 is selected from resins such as polyester, polyether, and polycarbonate, and the polyurethane resin is, for example, 30% by weight. Dissolve in DMF. By limiting the molecular weight of the polyurethane resin, the molecular movement of the polyurethane resin can be facilitated in the solidification / regeneration step. As additives, in order to control the length in the average thickness direction of foam and the number per unit volume, pigments such as carbon black, hydrophilic additives that promote the formation of foam, and the solidification and regeneration of polyurethane resin are stabilized. Hydrophobic additives and the like can be used. The obtained solution is defoamed under reduced pressure to obtain a polyurethane resin solution.
(塗布工程)
塗布工程では、準備工程で得られたポリウレタン樹脂溶液を常温下でナイフコータ等により帯状の成膜基材に略均一となるように、連続的に塗布する。このとき、ナイフコータ等と成膜基材との間隙(クリアランス)を調整することで、ポリウレタン樹脂溶液の塗布厚さ(塗布量)が調整される。成膜基材にはPET樹脂等の樹脂製の不織布やフィルムを用いることができるが、本例では、成膜基材としてPET製フィルムが用いられる。
(Applying process)
In the coating step, the polyurethane resin solution obtained in the preparatory step is continuously coated at room temperature with a knife coater or the like so as to be substantially uniform on the strip-shaped film-forming substrate. At this time, the coating thickness (coating amount) of the polyurethane resin solution is adjusted by adjusting the gap (clearance) between the knife coater or the like and the film-forming substrate. A non-woven fabric or film made of a resin such as PET resin can be used as the film-forming base material, but in this example, a PET film is used as the film-forming base material.
(凝固再生工程)
凝固再生工程では、成膜基材に塗布されたポリウレタン樹脂溶液が、ポリウレタン樹脂に対して貧溶媒である水を主成分とする凝固液(水系凝固液)に案内される。本例では、凝固液として、水を用いている。凝固液中では、まず、ポリウレタン樹脂溶液の表面側に緻密な微細孔が形成されスキン層が形成される。その後、ポリウレタン樹脂溶液中のDMFと凝固液との置換の進行によりポリウレタン樹脂が成膜基材上にシート状に凝固再生されて発泡が形成された樹脂シートが形成される。ポリウレタン樹脂溶液からDMFが脱溶媒し、DMFと水とが置換することで、発泡及び微細孔が網目状に連通する。
(Coagulation regeneration process)
In the solidification / regeneration step, the polyurethane resin solution applied to the film-forming substrate is guided to a coagulation liquid (aqueous coagulation liquid) containing water, which is a poor solvent for the polyurethane resin, as a main component. In this example, water is used as the coagulating liquid. In the coagulating liquid, first, dense micropores are formed on the surface side of the polyurethane resin solution to form a skin layer. After that, as the replacement of the DMF with the coagulating liquid in the polyurethane resin solution progresses, the polyurethane resin is solidified and regenerated into a sheet on the film-forming substrate to form a resin sheet in which foam is formed. DMF is desolvated from the polyurethane resin solution, and DMF is replaced with water, so that foaming and micropores communicate with each other in a mesh pattern.
(洗浄・乾燥工程)
洗浄・乾燥工程では、凝固再生工程で凝固再生したシート状のポリウレタン樹脂(以下、成膜樹脂という。)を成膜基材から剥離し、水等の洗浄液中で洗浄してポリウレタン樹脂中に残留するDMFを除去する。洗浄後、成膜樹脂をシリンダ乾燥機で乾燥させる。シリンダ乾燥機は内部に熱源を有するシリンダを備えている。成膜樹脂がシリンダの周面に沿って通過することで乾燥する。乾燥後の成膜樹脂は、ロール状に巻き取られる。
(Washing / drying process)
In the washing / drying step, the sheet-shaped polyurethane resin (hereinafter referred to as film-forming resin) solidified and regenerated in the solidification / regeneration step is peeled off from the film-forming substrate, washed in a cleaning solution such as water, and remains in the polyurethane resin. Remove the DMF. After cleaning, the film-forming resin is dried in a cylinder dryer. The cylinder dryer is provided with a cylinder having a heat source inside. The film-forming resin passes along the peripheral surface of the cylinder to dry. The film-forming resin after drying is wound into a roll.
(研削処理工程)
研削処理工程では、成膜樹脂の表面に形成されたスキン層と反対の面側にバフ処理等の研削処理を施す。研削処理には、バフ機やスライス機等を用いることができる。これにより、成膜樹脂の厚みが均一化され、ポリウレタン樹脂シートが得られる。
(Grinding process)
In the grinding process, a grinding process such as a buffing process is performed on the surface side opposite to the skin layer formed on the surface of the film-forming resin. A buffing machine, a slicing machine, or the like can be used for the grinding process. As a result, the thickness of the film-forming resin is made uniform, and a polyurethane resin sheet can be obtained.
(ラミネート加工工程)
ラミネート加工工程は、研削処理工程で得られたポリウレタン樹脂シートの保持面の反対側面に、別途作製した両面粘着テープをラミネート機により並ばせて貼り合わせる。
(Laminating process)
In the laminating process, a separately produced double-sided adhesive tape is lined up and bonded to the opposite side surface of the holding surface of the polyurethane resin sheet obtained in the grinding process by a laminating machine.
両面粘着テープは、1枚の高剛性のPETフィルム等からなるテープ基材の両面に、粘着層のみでシート状に形成された複数枚のノンサポート型粘着テープを互いに重ならずに隣接して貼り合わせたものである。このとき、テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間の境界G1の延在方向と、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間の境界G2の延在方向とが交差角αをなして互いに交差配置される。ノンサポート型粘着テープのポリウレタン樹脂シートが粘着される面の反対側面は剥離フィルムで覆われている。 In the double-sided adhesive tape, a plurality of non-support type adhesive tapes formed in a sheet shape with only an adhesive layer are adjacent to each other on both sides of a tape base material made of one high-rigidity PET film or the like without overlapping each other. It is pasted together. At this time, the extending direction of the boundary G1 between the plurality of non-support type adhesive tapes provided on one surface of the tape base material and the boundary G2 between the plurality of non-support type adhesive tapes provided on the other surface of the tape base material. The extending directions of the above form an intersection angle α and are arranged so as to intersect each other. The opposite side of the surface to which the polyurethane resin sheet of the non-support type adhesive tape is adhered is covered with a release film.
テープ基材の厚さは本発明の主旨を逸脱しない範囲で任意に設定できるが、例えば、50〜200μm、好ましくは50〜100μmとすることができる。また、テープ基材としてPETフィルムを例示しているが、本発明はこれに限定されるものではない。例えば、ポリプロピレンや二軸延伸ポリプロピレン(OPP)等を用いても良い。粘着層の厚さは本発明の主旨を逸脱しない範囲で任意に設定できるが、例えば、10〜70μmとすることができる。 The thickness of the tape base material can be arbitrarily set within a range that does not deviate from the gist of the present invention, and can be, for example, 50 to 200 μm, preferably 50 to 100 μm. Moreover, although PET film is exemplified as a tape base material, the present invention is not limited thereto. For example, polypropylene, biaxially stretched polypropylene (OPP), or the like may be used. The thickness of the adhesive layer can be arbitrarily set as long as it does not deviate from the gist of the present invention, and can be, for example, 10 to 70 μm.
尚、このようにして製造されたポリウレタン樹脂シートの表面には、内部よりも高密度で皮膜状の表面層(スキン層)が形成される。このスキン層の表面は被研磨物との接触性に優れるため、被研磨物の保持が可能となる。即ち、スキン層の表面が被研磨物を保持するための保持面となる。 A film-like surface layer (skin layer) is formed on the surface of the polyurethane resin sheet produced in this manner at a higher density than the inside. Since the surface of this skin layer has excellent contact with the object to be polished, it is possible to hold the object to be polished. That is, the surface of the skin layer serves as a holding surface for holding the object to be polished.
3.具体的実施結果
3-1.実施例1(図1参照)
(1)実施例1の保持パッド100を以下の手順で用意した。
i.湿式成膜法により得たA硬度30であるポリウレタン樹脂シート10の保持面11に対する反対側面をバフ処理し、厚さを0.8mmとした。
3. 3. Specific implementation results
3-1. Example 1 (see FIG. 1)
(1) The
i. The side surface of the
A硬度は、25℃におけるものであり、日本工業規格(JIS K 6253)に準拠して測定した。より具体的には、30mm×30mmの試料片を厚さ4.5mm以上となるように重ね、A型硬度計(日本工業規格、JIS K7311)を用いて測定した。 The A hardness was at 25 ° C. and was measured in accordance with Japanese Industrial Standards (JIS K 6253). More specifically, sample pieces of 30 mm × 30 mm were stacked so as to have a thickness of 4.5 mm or more, and measured using an A-type hardness tester (Japanese Industrial Standards, JIS K7311).
得られたポリウレタン樹脂シート10を、1辺の長さを2100mmとする正方形に裁断した。
The obtained
ii.両面粘着テープ20を作製した。両面粘着テープ20は、1枚の高剛性のPETフィルムからなる厚さ75μmのテープ基材20Aの両面に、粘着層のみでシート状に形成された厚さ55μmのノンサポート型粘着テープ21、22を、各面において2枚ずつ、互いに重ならずに隣接して貼り合わせた。このとき、テープ基材20Aの一面に備えた2枚のノンサポート型粘着テープ21間の境界G1の延在方向と、テープ基材20Aの他面に備えた2枚のノンサポート型粘着テープ22間の境界G2の延在方向とが交差角α=90度をなして互いに交差配置するようにした。各ノンサポート型粘着テープ21、22の外面には剥離フィルム21F、22Fが貼り合わされていた。
ii. A double-sided
iii.ポリウレタン樹脂シート10の保持面11に対する反対側のバフ処理面に、図1に示す如くに両面粘着テープ20における剥離フィルム21Fが剥離されたノンサポート型粘着テープ21を粘着させた。これにより、保持パッド100が作製された。
iii. As shown in FIG. 1, the non-support type
(2)上述(1)で作製した保持パッド100を、試験研磨用に直径680mmの円形に裁断した。このとき、粘着テープ間の境界G1及びG2をいずれも含むように裁断した。裁断した保持パッド100における剥離フィルム22Fを剥離し、この保持パッド100をノンサポート型粘着テープ22を介して保持定盤に貼り付けた。
(2) The
保持パッド100に被研磨物としてガラス基板を保持し、片面研磨装置の研磨定盤に設けた研磨パッドによりガラス基板を研磨加工した。
The glass substrate was held on the
3-2.比較例1
実施例1におけると同様のポリウレタン樹脂シート10、両面粘着テープ20によって保持パッドを作製するに際し、境界G1と境界G2を互いに平行配置させ、実施例1と同様のガラス基板の研磨加工にこの保持パッドを供した。
3-2. Comparative Example 1
When producing the holding pad by the same
3-3.結果
実施例1と比較例1によるガラス基板の研磨加工後、ガラス基板の被研磨面にハロゲンランプを照射し、外観検査を実施した。
3-3. Results After polishing the glass substrate according to Example 1 and Comparative Example 1, the surface to be polished of the glass substrate was irradiated with a halogen lamp, and an appearance inspection was carried out.
比較例1の保持パッドでは、一部のガラス表面に、柔らかい保持パッドに同方向でのたるみが発生したためか、一定間隔で平行をなすような薄い筋が観察された。これに対し、実施例1の保持パッドでは、外観上筋は観察されなかった。 In the holding pad of Comparative Example 1, thin streaks that were parallel at regular intervals were observed on a part of the glass surface, probably because the soft holding pad had slack in the same direction. On the other hand, in the holding pad of Example 1, no streaks were observed on the appearance.
本発明によれば、テープ基材の一面と他面にそれぞれ複数枚のノンサポート型粘着テープが互いに重ならずに隣接して貼り合わされた両面粘着テープを、ポリウレタン樹脂シートの保持面の反対側面に粘着して構成される保持パッドを用いる研磨加工において、被研磨物の被研磨面における特徴的な研磨ムラの発生を抑制することができる。 According to the present invention, a double-sided adhesive tape in which a plurality of non-support type adhesive tapes are laminated adjacent to each other on one surface and the other surface of the tape base material without overlapping each other is formed on the opposite side surface of the holding surface of the polyurethane resin sheet. In the polishing process using the holding pad formed by adhering to the material, it is possible to suppress the occurrence of characteristic polishing unevenness on the surface to be polished of the object to be polished.
100 保持パッド
10 ポリウレタン樹脂シート
11 保持面
20 両面粘着テープ
21、22 ノンサポート型粘着テープ
G1、G2 境界
α 交差角
100
Claims (5)
テープ基材の一面に備えた複数枚のノンサポート型粘着テープ間のすべての境界の延在方向のそれぞれと、テープ基材の他面に備えた複数枚のノンサポート型粘着テープ間のすべての境界の延在方向のそれぞれとが互いに交差配置される保持パッド。 A double-sided adhesive having a polyurethane resin sheet having a holding surface for holding an object to be polished, and a plurality of non-support type adhesive tapes are laminated adjacent to each other on one surface and the other surface of the tape base material without overlapping each other. A holding pad in which the tape is adhered to the opposite side of the holding surface of the polyurethane resin sheet.
All in the extending direction of all boundaries between multiple non-supported adhesive tapes on one side of the tape substrate and all between multiple non-supported adhesive tapes on the other side of the tape substrate . A holding pad in which each of the extending directions of the boundary is arranged so as to intersect with each other.
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