SG150508A1 - Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof - Google Patents

Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof

Info

Publication number
SG150508A1
SG150508A1 SG200900977-0A SG2009009770A SG150508A1 SG 150508 A1 SG150508 A1 SG 150508A1 SG 2009009770 A SG2009009770 A SG 2009009770A SG 150508 A1 SG150508 A1 SG 150508A1
Authority
SG
Singapore
Prior art keywords
microelectronic
derivatives
salts
composition containing
cleaning composition
Prior art date
Application number
SG200900977-0A
Other languages
English (en)
Inventor
Chien-Pin Sherman Hsu
Original Assignee
Mallinckrodt Baker Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallinckrodt Baker Inc filed Critical Mallinckrodt Baker Inc
Publication of SG150508A1 publication Critical patent/SG150508A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/423Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/426Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
SG200900977-0A 2004-02-11 2004-11-05 Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof SG150508A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54380104P 2004-02-11 2004-02-11

Publications (1)

Publication Number Publication Date
SG150508A1 true SG150508A1 (en) 2009-03-30

Family

ID=34700209

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200900977-0A SG150508A1 (en) 2004-02-11 2004-11-05 Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof

Country Status (19)

Country Link
US (1) US7521406B2 (pl)
EP (1) EP1564595B1 (pl)
JP (3) JP4208826B2 (pl)
KR (2) KR101316993B1 (pl)
CN (3) CN101833251B (pl)
AT (1) ATE449362T1 (pl)
BR (1) BRPI0418529A (pl)
CA (1) CA2555665C (pl)
DE (1) DE602005017684D1 (pl)
DK (1) DK1564595T3 (pl)
ES (1) ES2334359T3 (pl)
IL (1) IL177305A (pl)
NO (1) NO20064056L (pl)
PL (1) PL1564595T3 (pl)
PT (1) PT1564595E (pl)
SG (1) SG150508A1 (pl)
TW (1) TWI318238B (pl)
WO (1) WO2005083523A1 (pl)
ZA (1) ZA200606544B (pl)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4522408B2 (ja) * 2003-08-19 2010-08-11 マリンクロッド・ベイカー・インコーポレイテッド マイクロエレクトロニクス用のストリッピングおよび洗浄組成物
KR101117939B1 (ko) * 2003-10-28 2012-02-29 사켐,인코포레이티드 세척액 및 에칭제 및 이의 사용 방법
CN101833251B (zh) 2004-02-11 2013-11-13 安万托特性材料股份有限公司 含有卤素含氧酸、其盐及其衍生物的微电子清洗组合物及清洗方法
US8338087B2 (en) * 2004-03-03 2012-12-25 Advanced Technology Materials, Inc Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate
US20060154186A1 (en) * 2005-01-07 2006-07-13 Advanced Technology Materials, Inc. Composition useful for removal of post-etch photoresist and bottom anti-reflection coatings
US7867779B2 (en) 2005-02-03 2011-01-11 Air Products And Chemicals, Inc. System and method comprising same for measurement and/or analysis of particles in gas stream
JP2008536312A (ja) * 2005-04-08 2008-09-04 サッチェム, インコーポレイテッド 金属窒化物の選択的なウェットエッチング
US8772214B2 (en) * 2005-10-14 2014-07-08 Air Products And Chemicals, Inc. Aqueous cleaning composition for removing residues and method using same
US7977228B2 (en) * 2006-06-29 2011-07-12 Intel Corporation Methods for the formation of interconnects separated by air gaps
WO2008039730A1 (en) * 2006-09-25 2008-04-03 Advanced Technology Materials, Inc. Compositions and methods for the removal of photoresist for a wafer rework application
US20100081595A1 (en) * 2007-01-22 2010-04-01 Freescale Semiconductor, Inc Liquid cleaning composition and method for cleaning semiconductor devices
US20090241988A1 (en) * 2008-03-31 2009-10-01 Intel Corporation Photoresist and antireflective layer removal solution and method thereof
US8026200B2 (en) * 2008-05-01 2011-09-27 Advanced Technology Materials, Inc. Low pH mixtures for the removal of high density implanted resist
BRPI1008034A2 (pt) * 2009-02-25 2016-03-15 Avantor Performance Mat Inc composições removedoras para limpeza de fotorresistor implantado por íons de discos de silício de dispositivos semicondutores
SG173834A1 (en) * 2009-02-25 2011-09-29 Avantor Performance Mat Inc Multipurpose acidic, organic solvent based microelectronic cleaning composition
US8669189B2 (en) 2009-06-25 2014-03-11 Lam Research Ag Method for treating a semiconductor wafer
CN102460663B (zh) * 2009-06-25 2015-01-28 朗姆研究公司 用于处理半导体晶片的方法
US7994062B2 (en) * 2009-10-30 2011-08-09 Sachem, Inc. Selective silicon etch process
JP2011179085A (ja) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd 電気めっき用前処理剤、電気めっきの前処理方法及び電気めっき方法
US20110253171A1 (en) * 2010-04-15 2011-10-20 John Moore Chemical Composition and Methods for Removing Epoxy-Based Photoimageable Coatings Utilized In Microelectronic Fabrication
SG189292A1 (en) 2010-10-06 2013-05-31 Advanced Tech Materials Composition and process for selectively etching metal nitrides
CN102199499B (zh) * 2011-04-02 2013-01-16 浙江向日葵光能科技股份有限公司 太阳能电池硅片清洗剂及其使用方法
EP2557147B1 (en) * 2011-08-09 2015-04-01 Basf Se Aqueous alkaline compositions and method for treating the surface of silicon substrates
US9257270B2 (en) * 2011-08-15 2016-02-09 Ekc Technology Method and composition for removing resist, etch residue, and copper oxide from substrates having copper, metal hardmask and low-k dielectric material
EP2850495A4 (en) * 2012-05-18 2016-01-20 Entegris Inc COMPOSITION AND METHOD FOR REMOVING PHOTOLACK FROM A SURFACE WITH TITANNITRIDE
JP6157081B2 (ja) * 2012-09-24 2017-07-05 東京応化工業株式会社 フォトリソグラフィ用剥離液、及びパターン形成方法
JP6029419B2 (ja) * 2012-11-02 2016-11-24 ダイキン工業株式会社 半導体ドライプロセス後の残渣除去液及びそれを用いた残渣除去方法
CN103809394B (zh) * 2012-11-12 2019-12-31 安集微电子科技(上海)股份有限公司 一种去除光阻蚀刻残留物的清洗液
US9765288B2 (en) 2012-12-05 2017-09-19 Entegris, Inc. Compositions for cleaning III-V semiconductor materials and methods of using same
CN103275823A (zh) * 2013-05-29 2013-09-04 苏州康和顺医疗技术有限公司 一种用于全自动生化分析仪的清洗剂及其制备方法
EP3004287B1 (en) * 2013-06-06 2021-08-18 Entegris, Inc. Compositions and methods for selectively etching titanium nitride
SG11201601158VA (en) 2013-08-30 2016-03-30 Advanced Tech Materials Compositions and methods for selectively etching titanium nitride
US9957469B2 (en) 2014-07-14 2018-05-01 Versum Materials Us, Llc Copper corrosion inhibition system
CN107078043B (zh) * 2014-11-13 2020-02-21 三菱瓦斯化学株式会社 抑制了包含钽的材料的损伤的半导体元件的清洗液、及使用其的清洗方法
JP6217659B2 (ja) * 2015-01-28 2017-10-25 ダイキン工業株式会社 半導体ドライプロセス後の残渣除去液及びそれを用いた残渣除去方法
CN109642159B (zh) * 2016-03-24 2022-02-15 安万托特性材料有限公司 非水性钨相容性金属氮化物选择性蚀刻剂和清洁剂
CN107357143B (zh) 2017-07-25 2018-06-19 上海新阳半导体材料股份有限公司 一种清洗剂、其制备方法和应用
US11353794B2 (en) * 2017-12-22 2022-06-07 Versum Materials Us, Llc Photoresist stripper
CN109980174A (zh) * 2017-12-27 2019-07-05 中国电子科技集团公司第十八研究所 提高电池热熔性聚合物铜箔表面附着力方法及表面处理剂
WO2019142788A1 (ja) 2018-01-16 2019-07-25 株式会社トクヤマ 次亜塩素酸イオンを含む半導体ウェハの処理液
EP3773616A4 (en) * 2018-04-12 2022-07-27 Briotech, Inc. AQUEOUS HYPOHALOGOUS ACID PREPARATIONS FOR THE INACTIVATION OF RESISTANT INFECTIOUS PATHOGENS
WO2019225541A1 (ja) 2018-05-23 2019-11-28 株式会社トクヤマ 次亜塩素酸第4級アルキルアンモニウム溶液、その製造方法および半導体ウエハの洗浄方法
JP6901998B2 (ja) * 2018-06-15 2021-07-14 株式会社トクヤマ 4級アルキルアンモニウムイオン、亜塩素酸イオン、及び次亜塩素酸イオンを含む酸化性組成物
WO2020049955A1 (ja) * 2018-09-06 2020-03-12 富士フイルム株式会社 薬液、基板の処理方法
JP7219061B2 (ja) 2018-11-14 2023-02-07 関東化学株式会社 ルテニウム除去用組成物
JPWO2020166676A1 (ja) * 2019-02-13 2021-12-16 株式会社トクヤマ 次亜塩素酸イオン、及びpH緩衝剤を含む半導体ウェハの処理液
KR20210063248A (ko) 2019-11-22 2021-06-01 가부시끼가이샤 도꾸야마 차아염소산 제 4 급 알킬암모늄 용액, 그 제조 방법 및 반도체 웨이퍼의 처리 방법
CN115152005A (zh) * 2020-02-25 2022-10-04 株式会社德山 钌的半导体用处理液
US20230126771A1 (en) * 2020-03-31 2023-04-27 Tokuyama Corporation Treatment liquid for semiconductors and method for producing same
US20220356061A1 (en) 2020-04-17 2022-11-10 Tokuyama Corporation Method for producing halogen oxyacid solution
KR20220000375A (ko) 2020-06-25 2022-01-03 가부시끼가이샤 도꾸야마 할로겐 산소산 용액의 제조 방법 및 제조 장치
KR20230048015A (ko) * 2020-08-07 2023-04-10 가부시끼가이샤 도꾸야마 차아브롬산 이온 및 pH 완충제를 함유하는 반도체 웨이퍼의 처리액
CN116529421A (zh) * 2020-11-26 2023-08-01 株式会社德山 半导体晶片处理液及其制造方法
CN116724143A (zh) * 2021-01-19 2023-09-08 朗姆研究公司 具有金属蚀刻残留物的室部件的清洁方法
TW202313454A (zh) * 2021-06-07 2023-04-01 日商德山股份有限公司 鹵素含氧酸的製造方法及其製造裝置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2256958A (en) 1939-05-13 1941-09-23 Pittsburgh Plate Glass Co Quaternary ammonium hypohalites and method of making same
GB1080767A (en) * 1965-05-25 1967-08-23 Ici Ltd Tarnish inhibiting compositions
US3962108A (en) * 1975-11-03 1976-06-08 Kti Chemical, Inc. Chemical stripping solution
DE3308850C2 (de) * 1983-03-12 1985-03-07 B. Braun Melsungen Ag, 3508 Melsungen Bleich-, Reinigungs- und Desinfektionsmittel auf Hypohalitbasis mit verbesserter Lagerstabilität
US4642221A (en) * 1983-07-05 1987-02-10 Atlantic Richfield Company Method and composition for inhibiting corrosion in aqueous heat transfer systems
US5364961A (en) 1992-06-15 1994-11-15 Monsanto Company Process for making optically active α-amino ketones
US5380458A (en) * 1992-10-02 1995-01-10 Colgate-Palmolive Co. Stabilized hypohalite compositions
US5773627A (en) * 1995-03-21 1998-06-30 Betzdearborn Inc. Methods of inhibiting corrosion using halo-benzotriazoles
JP2677235B2 (ja) 1995-03-30 1997-11-17 日本電気株式会社 半導体基板の洗浄装置及び洗浄方法並びに洗浄液の生成方法
JPH0959276A (ja) * 1995-08-11 1997-03-04 Kumiai Chem Ind Co Ltd 縮合ヘテロ環誘導体及び除草剤
JPH09279189A (ja) 1996-04-08 1997-10-28 Nippon Steel Corp 半導体基板用洗浄液
JPH1055993A (ja) * 1996-08-09 1998-02-24 Hitachi Ltd 半導体素子製造用洗浄液及びそれを用いた半導体素子の製造方法
US6573387B1 (en) * 1997-03-21 2003-06-03 The Scripps Research Institute Synthesis of α,β-substituted amino amides, esters, and acids
US5968280A (en) 1997-11-12 1999-10-19 International Business Machines Corporation Method for cleaning a surface
US5889161A (en) * 1998-05-13 1999-03-30 Sri International N,N'-azobis-nitroazoles and analogs thereof as igniter compounds for use in energetic compositions
JP2000056478A (ja) 1998-08-04 2000-02-25 Showa Denko Kk サイドウォール除去液
JP2002528903A (ja) * 1998-10-23 2002-09-03 アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド 活性剤溶液を含有し、化学機械的に磨くためのスラリーシステム
JP4224652B2 (ja) 1999-03-08 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離液およびそれを用いたレジストの剥離方法
MY143399A (en) 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
JP3832399B2 (ja) * 2001-08-28 2006-10-11 栗田工業株式会社 殺菌殺藻剤組成物及び水系の殺菌殺藻方法
JP2003119494A (ja) 2001-10-05 2003-04-23 Nec Corp 洗浄組成物およびこれを用いた洗浄方法と洗浄装置
KR20030082767A (ko) * 2002-04-18 2003-10-23 주식회사 덕성 수용액에서의 전해질의 전기전도도가 높은 물질을 이용한레지스트 박리액 조성물
JP4267359B2 (ja) 2002-04-26 2009-05-27 花王株式会社 レジスト用剥離剤組成物
CA2488737A1 (en) 2002-06-07 2003-12-18 Mallinckrodt Baker, Inc. Microelectronic cleaning and arc remover compositions
CN1659481A (zh) * 2002-06-07 2005-08-24 马林克罗特贝克公司 包含氧化剂和有机溶剂的微电子清洁组合物
CN101833251B (zh) 2004-02-11 2013-11-13 安万托特性材料股份有限公司 含有卤素含氧酸、其盐及其衍生物的微电子清洗组合物及清洗方法

Also Published As

Publication number Publication date
EP1564595A3 (en) 2007-06-27
EP1564595A2 (en) 2005-08-17
CA2555665A1 (en) 2005-09-09
DE602005017684D1 (de) 2009-12-31
CN101923294A (zh) 2010-12-22
JP2008124494A (ja) 2008-05-29
ATE449362T1 (de) 2009-12-15
DK1564595T3 (da) 2010-01-18
CN1954267A (zh) 2007-04-25
PT1564595E (pt) 2009-12-23
BRPI0418529A (pt) 2007-05-15
PL1564595T3 (pl) 2010-06-30
US20050176603A1 (en) 2005-08-11
ZA200606544B (en) 2009-07-29
JP2008156654A (ja) 2008-07-10
JP4393553B2 (ja) 2010-01-06
JP4208826B2 (ja) 2009-01-14
TWI318238B (en) 2009-12-11
ES2334359T3 (es) 2010-03-09
IL177305A (en) 2011-06-30
CN101923294B (zh) 2013-12-04
TW200526774A (en) 2005-08-16
CA2555665C (en) 2012-10-02
KR20130086326A (ko) 2013-08-01
US7521406B2 (en) 2009-04-21
JP2005227749A (ja) 2005-08-25
CN1954267B (zh) 2010-12-08
EP1564595B1 (en) 2009-11-18
WO2005083523A1 (en) 2005-09-09
KR101316993B1 (ko) 2013-10-11
CN101833251B (zh) 2013-11-13
CN101833251A (zh) 2010-09-15
NO20064056L (no) 2006-11-07
IL177305A0 (en) 2006-12-10
KR20050081155A (ko) 2005-08-18

Similar Documents

Publication Publication Date Title
SG150508A1 (en) Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
IL177728A0 (en) Nanoelectronic and microelectronic cleaning compositions
MY158052A (en) Indole compound
ATE548473T1 (de) Palladiumlegierung
WO2007096763A3 (en) Melanocortin type 4 receptor agonist piperidinoylpyrrolidines
MY147677A (en) Piperazinyl derivatives useful in the treatment of gpr38 receptor mediated diseases
TW200745081A (en) Compounds
AP2003002801A0 (en) Benzothiophene derivative compounds, process of preparation and use thereof
WO2008074803A8 (en) 4-benzyl-l ( 2h) -phthalazinones as h1 receptor antagonists
UA84896C2 (ru) Производные гидронопола как агонисты человеческих рецепторов orl1
EP1840659A3 (en) Composition for cleaning microelectronic substrates containing halogen oxygen acids and derivatives thereof
MY141998A (en) Microelectronic cleaning composition containing halogen oxygen acids, salts and derivatives thereof
DE602007004327D1 (de) Einen azepin-kern enthaltende antagonisten des histaminrezeptors
DE602005009487D1 (de) Neutrale endopeptidase (nep) und humane lösliche endopeptidase (hsep) hemmer für die prophylaxe und behandlung von neurodegenerativen erkrankungen
MXPA05012572A (es) Derivado de 5-h-benzo[d]naft[2,1-b]azepina como antagonistas selectivos del receptor d1/d5 para el tratamiento de la obesidad y trastornos del sistema nervioso central.
ATE409242T1 (de) Aufbrennfähige silber-legierung zur herstellung keramisch verblendeter dentalrestaurationen
WO2006061140A3 (en) Composition of ssao substrates and metal compounds of the vla and vlb groups of the periodic table
IL156639A0 (en) Phenethanolamine derivatives, methods for their preparation and pharmaceutical compositions containing them
HK1100176A1 (en) Heterocyclyls as selective melanin concentrating hormone receptor antagonists for the treatment of obesity and related disorders
RU2356970C1 (ru) Сплав на основе золота
TH78156B (th) สารผสมทำความสะอาดนาโนอิเล็กโทรนิก และไมโครอิเล็กทรอนิก
TW200418999A (en) White alloy for ornament
RU2006130033A (ru) Сплав на основе никеля
RU2006128396A (ru) Сплав