SG141469A1 - Wafer edge wheel with drying function - Google Patents

Wafer edge wheel with drying function

Info

Publication number
SG141469A1
SG141469A1 SG200802526-4A SG2008025264A SG141469A1 SG 141469 A1 SG141469 A1 SG 141469A1 SG 2008025264 A SG2008025264 A SG 2008025264A SG 141469 A1 SG141469 A1 SG 141469A1
Authority
SG
Singapore
Prior art keywords
drying function
edge wheel
wafer edge
wheel
edge
Prior art date
Application number
SG200802526-4A
Other languages
English (en)
Inventor
John Parks
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG141469A1 publication Critical patent/SG141469A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B7/00—Drying solid materials or objects by processes using a combination of processes not covered by a single one of groups F26B3/00 and F26B5/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/24—Arrangements of devices using drying processes not involving heating
    • F26B13/30—Arrangements of devices using drying processes not involving heating for applying suction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B17/00—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement
    • F26B17/24—Machines or apparatus for drying materials in loose, plastic, or fluidised form, e.g. granules, staple fibres, with progressive movement with movement performed by shooting or throwing the materials, e.g. after which the materials are subject to impact
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Textile Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
SG200802526-4A 2004-09-30 2005-09-16 Wafer edge wheel with drying function SG141469A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/957,146 US7089687B2 (en) 2004-09-30 2004-09-30 Wafer edge wheel with drying function

Publications (1)

Publication Number Publication Date
SG141469A1 true SG141469A1 (en) 2008-04-28

Family

ID=36097413

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200802526-4A SG141469A1 (en) 2004-09-30 2005-09-16 Wafer edge wheel with drying function

Country Status (7)

Country Link
US (2) US7089687B2 (ja)
JP (2) JP5238254B2 (ja)
KR (1) KR101182618B1 (ja)
CN (1) CN100565063C (ja)
SG (1) SG141469A1 (ja)
TW (1) TWI278905B (ja)
WO (1) WO2006039127A2 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US7350315B2 (en) 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US20060000494A1 (en) * 2004-06-30 2006-01-05 Lam Research Corporation Self-draining edge wheel system and method
US7089687B2 (en) * 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function
US8211242B2 (en) * 2005-02-07 2012-07-03 Ebara Corporation Substrate processing method, substrate processing apparatus, and control program
DE102005057109A1 (de) * 2005-11-26 2007-05-31 Kunze-Concewitz, Horst, Dipl.-Phys. Vorrichtung und Verfahren für mechanisches Prozessieren flacher, dünner Substrate im Durchlaufverfahren
US20110296634A1 (en) * 2010-06-02 2011-12-08 Jingdong Jia Wafer side edge cleaning apparatus
JP6144531B2 (ja) * 2013-04-23 2017-06-07 株式会社荏原製作所 基板処理装置及び処理基板の製造方法
US20160372317A1 (en) * 2014-03-06 2016-12-22 Imt Co., Ltd Device and method for cleaning backside or edge of wafer

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838289A (en) 1982-08-03 1989-06-13 Texas Instruments Incorporated Apparatus and method for edge cleaning
IT1226303B (it) * 1988-07-26 1990-12-27 Montedipe Spa Processo ed apparato per la devolatilizzazione di soluzioni di polimeri.
JPH02130922A (ja) * 1988-11-11 1990-05-18 Toshiba Corp 半導体基板エッチング装置
JPH0712035B2 (ja) 1989-04-20 1995-02-08 三菱電機株式会社 噴流式液処理装置
JPH02309638A (ja) 1989-05-24 1990-12-25 Fujitsu Ltd ウエハーエッチング装置
JPH0693449B2 (ja) * 1989-12-25 1994-11-16 佳英 柴野 温純水引上方式に於ける乾燥装置
US5271774A (en) 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
US5620525A (en) * 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5088441A (en) 1990-08-23 1992-02-18 Belport Co., Inc. Cord impregnator
JP3118737B2 (ja) * 1992-10-23 2000-12-18 東京エレクトロン株式会社 被処理体の処理方法
US5705223A (en) 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
FR2733036B1 (fr) * 1995-04-14 1997-07-04 Unir Dispositif de protection anti-contamination rapprochee
US5660642A (en) 1995-05-26 1997-08-26 The Regents Of The University Of California Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
KR0175278B1 (ko) 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
JPH09270412A (ja) * 1996-04-01 1997-10-14 Canon Inc 洗浄装置及び洗浄方法
DE19622015A1 (de) 1996-05-31 1997-12-04 Siemens Ag Verfahren zum Ätzen von Zerstörungszonen an einem Halbleitersubstratrand sowie Ätzanlage
US5724748A (en) * 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
TW357406B (en) 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
US5868857A (en) * 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
US5967882A (en) * 1997-03-06 1999-10-19 Keltech Engineering Lapping apparatus and process with two opposed lapping platens
JP3549141B2 (ja) * 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
JPH1131672A (ja) * 1997-07-10 1999-02-02 Hitachi Ltd 基板処理方法および基板処理装置
EP0970511B1 (en) 1997-09-24 2005-01-12 Interuniversitair Micro-Elektronica Centrum Vzw Method and apparatus for removing a liquid from a surface
US6491764B2 (en) 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
US6398975B1 (en) 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
EP0905746A1 (en) 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Method of removing a liquid from a surface of a rotating substrate
US6102777A (en) 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JPH11350169A (ja) 1998-06-10 1999-12-21 Chemitoronics Co ウエットエッチング装置およびウエットエッチングの方法
EP1052682B1 (de) * 1999-04-28 2002-01-09 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Vorrichtung und Verfahren zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen
JP4413383B2 (ja) * 1999-06-30 2010-02-10 Ｈｏｙａ株式会社 スクラブ洗浄装置及びスクラブ洗浄方法、並びに情報記録媒体の製造方法
JP3978296B2 (ja) * 1999-08-05 2007-09-19 株式会社カイジョー 基板端面用超音波励振装置及びこれを備えた基板端面用超音波洗浄装置
JP4481394B2 (ja) * 1999-08-13 2010-06-16 株式会社荏原製作所 半導体基板の洗浄装置及びその洗浄方法
US20020121290A1 (en) 1999-08-25 2002-09-05 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US6622334B1 (en) 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US6186873B1 (en) * 2000-04-14 2001-02-13 International Business Machines Corporation Wafer edge cleaning
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US6550091B1 (en) 2000-10-04 2003-04-22 Lam Research Corporation Double-sided wafer edge scrubbing apparatus and method for using the same
JP2002124508A (ja) * 2000-10-13 2002-04-26 Nec Corp 基板用スピン処理装置
DE50015481D1 (de) 2000-10-31 2009-01-22 Sez Ag Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen
WO2002101796A2 (en) 2001-06-12 2002-12-19 Verteq, Inc. Megasonic cleaner and dryer system
US6907637B1 (en) * 2001-06-29 2005-06-21 Lam Research Corporation Edge wheel assembly in a substrate processing brush box
JP3944368B2 (ja) * 2001-09-05 2007-07-11 株式会社荏原製作所 基板処理装置及び基板処理方法
JP3535853B2 (ja) * 2001-09-18 2004-06-07 エム・エフエスアイ株式会社 基板の支持固定具、及びこれを用いた基板表面の乾燥方法
EP1429640B1 (en) * 2001-09-24 2007-03-07 Cosmetic Technologies LLC Apparatus and method for custom cosmetic dispensing
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP4026750B2 (ja) * 2002-04-24 2007-12-26 東京エレクトロン株式会社 基板処理装置
JP2004063796A (ja) * 2002-07-29 2004-02-26 Tatsumo Kk 平板状角型基板の裏面洗浄装置
JP2005150468A (ja) * 2003-11-17 2005-06-09 Ebara Corp 基板乾燥装置及び基板研磨装置
US7350315B2 (en) * 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US20060000494A1 (en) * 2004-06-30 2006-01-05 Lam Research Corporation Self-draining edge wheel system and method
US7089687B2 (en) * 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function

Also Published As

Publication number Publication date
JP2008515227A (ja) 2008-05-08
WO2006039127A2 (en) 2006-04-13
US20060064894A1 (en) 2006-03-30
CN100565063C (zh) 2009-12-02
US20060174510A1 (en) 2006-08-10
JP2013038442A (ja) 2013-02-21
US7254900B2 (en) 2007-08-14
KR101182618B1 (ko) 2012-09-14
TW200616015A (en) 2006-05-16
KR20070072513A (ko) 2007-07-04
TWI278905B (en) 2007-04-11
JP5238254B2 (ja) 2013-07-17
JP5579812B2 (ja) 2014-08-27
WO2006039127A3 (en) 2007-01-11
CN101031765A (zh) 2007-09-05
US7089687B2 (en) 2006-08-15

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