WO2009060912A1 - エピタキシャル膜成長方法、ウェーハ支持構造およびサセプタ - Google Patents
エピタキシャル膜成長方法、ウェーハ支持構造およびサセプタ Download PDFInfo
- Publication number
- WO2009060912A1 WO2009060912A1 PCT/JP2008/070235 JP2008070235W WO2009060912A1 WO 2009060912 A1 WO2009060912 A1 WO 2009060912A1 JP 2008070235 W JP2008070235 W JP 2008070235W WO 2009060912 A1 WO2009060912 A1 WO 2009060912A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- susceptor
- supporting structure
- epitaxial film
- growing method
- Prior art date
Links
- 239000002245 particle Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/682,850 US8324063B2 (en) | 2007-11-08 | 2008-11-06 | Epitaxial film growing method, wafer supporting structure and susceptor |
JP2009540085A JP5370850B2 (ja) | 2007-11-08 | 2008-11-06 | エピタキシャル膜成長方法、ウェーハ支持構造およびサセプタ |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-291338 | 2007-11-08 | ||
JP2007291338 | 2007-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009060912A1 true WO2009060912A1 (ja) | 2009-05-14 |
Family
ID=40625799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/070235 WO2009060912A1 (ja) | 2007-11-08 | 2008-11-06 | エピタキシャル膜成長方法、ウェーハ支持構造およびサセプタ |
Country Status (4)
Country | Link |
---|---|
US (1) | US8324063B2 (ja) |
JP (1) | JP5370850B2 (ja) |
TW (1) | TW200935500A (ja) |
WO (1) | WO2009060912A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012023557A1 (ja) * | 2010-08-20 | 2012-02-23 | 昭和電工株式会社 | 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体 |
JP2015095599A (ja) * | 2013-11-13 | 2015-05-18 | シャープ株式会社 | 化合物半導体薄膜成長装置 |
JP2021525966A (ja) * | 2018-06-06 | 2021-09-27 | アイクストロン、エスイー | 基板取扱い用担持リングを有するcvdリアクタ及びcvdリアクタでの担持リングの使用 |
WO2022097456A1 (ja) * | 2020-11-09 | 2022-05-12 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5699425B2 (ja) * | 2008-08-05 | 2015-04-08 | 東京エレクトロン株式会社 | 載置台構造及び成膜装置 |
JP2011082443A (ja) * | 2009-10-09 | 2011-04-21 | Sumco Corp | エピタキシャルウェーハおよびその製造方法 |
WO2013173152A1 (en) | 2012-05-18 | 2013-11-21 | Veeco Instruments Inc. | Rotating disk reactor with ferrofluid seal for chemical vapor deposition |
US10361097B2 (en) * | 2012-12-31 | 2019-07-23 | Globalwafers Co., Ltd. | Apparatus for stressing semiconductor substrates |
TWI559440B (zh) * | 2015-01-28 | 2016-11-21 | 漢民科技股份有限公司 | 晶圓承載裝置 |
US20170032992A1 (en) | 2015-07-31 | 2017-02-02 | Infineon Technologies Ag | Substrate carrier, a method and a processing device |
DE102018131987A1 (de) | 2018-12-12 | 2020-06-18 | Aixtron Se | Substrathalter zur Verwendung in einem CVD-Reaktor |
TW202334490A (zh) * | 2021-10-21 | 2023-09-01 | 荷蘭商Asm Ip私人控股有限公司 | 基板支撐件、基板支撐件總成、反應室及膜沉積方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
JPH0952792A (ja) * | 1995-08-11 | 1997-02-25 | Hitachi Cable Ltd | 半導体成長装置における基板ホルダ |
JPH09266242A (ja) * | 1996-03-27 | 1997-10-07 | Kuroda Precision Ind Ltd | 吸着用チャック装置 |
JPH11176916A (ja) * | 1997-12-11 | 1999-07-02 | Toshiba Mach Co Ltd | ウェーハ支持体 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002231713A (ja) * | 2001-01-30 | 2002-08-16 | Ibiden Co Ltd | 半導体製造装置用治具 |
JP2003229370A (ja) | 2001-11-30 | 2003-08-15 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ |
JP3541838B2 (ja) * | 2002-03-28 | 2004-07-14 | 信越半導体株式会社 | サセプタ、エピタキシャルウェーハの製造装置および製造方法 |
JP2005005379A (ja) * | 2003-06-10 | 2005-01-06 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの熱処理方法及び熱処理用縦型ボート |
JP4868503B2 (ja) * | 2006-03-30 | 2012-02-01 | Sumco Techxiv株式会社 | エピタキシャルウェーハの製造方法 |
JP5156446B2 (ja) | 2008-03-21 | 2013-03-06 | 株式会社Sumco | 気相成長装置用サセプタ |
JP5092975B2 (ja) | 2008-07-31 | 2012-12-05 | 株式会社Sumco | エピタキシャルウェーハの製造方法 |
-
2008
- 2008-11-06 WO PCT/JP2008/070235 patent/WO2009060912A1/ja active Application Filing
- 2008-11-06 JP JP2009540085A patent/JP5370850B2/ja active Active
- 2008-11-06 US US12/682,850 patent/US8324063B2/en active Active
- 2008-11-07 TW TW097142975A patent/TW200935500A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
JPH0952792A (ja) * | 1995-08-11 | 1997-02-25 | Hitachi Cable Ltd | 半導体成長装置における基板ホルダ |
JPH09266242A (ja) * | 1996-03-27 | 1997-10-07 | Kuroda Precision Ind Ltd | 吸着用チャック装置 |
JPH11176916A (ja) * | 1997-12-11 | 1999-07-02 | Toshiba Mach Co Ltd | ウェーハ支持体 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012023557A1 (ja) * | 2010-08-20 | 2012-02-23 | 昭和電工株式会社 | 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体 |
JP2012044030A (ja) * | 2010-08-20 | 2012-03-01 | Showa Denko Kk | 化合物半導体の製造装置、化合物半導体の製造方法及び化合物半導体 |
US9064696B2 (en) | 2010-08-20 | 2015-06-23 | Toyoda Gosei Co., Ltd. | Apparatus for manufacturing compound semiconductor, method for manufacturing compound semiconductor, and compound semiconductor |
JP2015095599A (ja) * | 2013-11-13 | 2015-05-18 | シャープ株式会社 | 化合物半導体薄膜成長装置 |
JP2021525966A (ja) * | 2018-06-06 | 2021-09-27 | アイクストロン、エスイー | 基板取扱い用担持リングを有するcvdリアクタ及びcvdリアクタでの担持リングの使用 |
JP7307100B2 (ja) | 2018-06-06 | 2023-07-11 | アイクストロン、エスイー | 基板取扱い用担持リングを有するcvdリアクタ及びcvdリアクタでの担持リングの使用 |
WO2022097456A1 (ja) * | 2020-11-09 | 2022-05-12 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP7440660B2 (ja) | 2020-11-09 | 2024-02-28 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200935500A (en) | 2009-08-16 |
JPWO2009060912A1 (ja) | 2011-03-24 |
TWI375257B (ja) | 2012-10-21 |
US20100227455A1 (en) | 2010-09-09 |
JP5370850B2 (ja) | 2013-12-18 |
US8324063B2 (en) | 2012-12-04 |
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