ATE447238T1 - Randrad-trockenverteiler - Google Patents

Randrad-trockenverteiler

Info

Publication number
ATE447238T1
ATE447238T1 AT04815000T AT04815000T ATE447238T1 AT E447238 T1 ATE447238 T1 AT E447238T1 AT 04815000 T AT04815000 T AT 04815000T AT 04815000 T AT04815000 T AT 04815000T AT E447238 T1 ATE447238 T1 AT E447238T1
Authority
AT
Austria
Prior art keywords
edge wheel
substrate
edge
vacuum
rim wheel
Prior art date
Application number
AT04815000T
Other languages
English (en)
Inventor
Glenn Davis
Carl Woods
John Parks
Fred Redeker
Mike Ravkin
Michael Orbock
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of ATE447238T1 publication Critical patent/ATE447238T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Washing And Drying Of Tableware (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Magnetic Record Carriers (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
AT04815000T 2003-12-22 2004-12-20 Randrad-trockenverteiler ATE447238T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/745,219 US7350315B2 (en) 2003-12-22 2003-12-22 Edge wheel dry manifold
PCT/US2004/042871 WO2005064648A1 (en) 2003-12-22 2004-12-20 Edge wheel dry manifold

Publications (1)

Publication Number Publication Date
ATE447238T1 true ATE447238T1 (de) 2009-11-15

Family

ID=34679094

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04815000T ATE447238T1 (de) 2003-12-22 2004-12-20 Randrad-trockenverteiler

Country Status (11)

Country Link
US (1) US7350315B2 (de)
EP (1) EP1697969B1 (de)
JP (1) JP4928950B2 (de)
KR (1) KR101121934B1 (de)
CN (1) CN100444309C (de)
AT (1) ATE447238T1 (de)
DE (1) DE602004023878D1 (de)
IL (1) IL176467A (de)
MY (1) MY144397A (de)
TW (1) TWI305928B (de)
WO (1) WO2005064648A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
DE10302611B4 (de) * 2003-01-23 2011-07-07 Siltronic AG, 81737 Polierte Halbleiterscheibe und Verfahren zu deren Herstellung und Anordnung bestehend aus einer Halbleiterscheibe und einem Schild
EP1652222A1 (de) * 2003-08-07 2006-05-03 Ebara Corporation Substratverarbeitungsvorrichtung, substratverarbeitungsverfahren und substrathaltevorrichtung
US7350315B2 (en) 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US20060000494A1 (en) * 2004-06-30 2006-01-05 Lam Research Corporation Self-draining edge wheel system and method
US7089687B2 (en) * 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function
US8211242B2 (en) * 2005-02-07 2012-07-03 Ebara Corporation Substrate processing method, substrate processing apparatus, and control program
US8127395B2 (en) * 2006-05-05 2012-03-06 Lam Research Corporation Apparatus for isolated bevel edge clean and method for using the same
JP4976949B2 (ja) * 2007-07-26 2012-07-18 大日本スクリーン製造株式会社 基板処理装置
US20090217953A1 (en) * 2008-02-28 2009-09-03 Hui Chen Drive roller for a cleaning system
WO2011017060A2 (en) 2009-08-07 2011-02-10 Applied Materials, Inc. Dual temperature heater

Family Cites Families (37)

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US4838289A (en) 1982-08-03 1989-06-13 Texas Instruments Incorporated Apparatus and method for edge cleaning
JPS62128142A (ja) * 1985-11-29 1987-06-10 Canon Inc 薄板状物体の回転装置
US4921093A (en) * 1988-05-09 1990-05-01 Sequa Corporation Infeed means for high speed continuous motion can decorator
IT1226303B (it) 1988-07-26 1990-12-27 Montedipe Spa Processo ed apparato per la devolatilizzazione di soluzioni di polimeri.
JPH02130922A (ja) 1988-11-11 1990-05-18 Toshiba Corp 半導体基板エッチング装置
US5271774A (en) 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
US5620525A (en) 1990-07-16 1997-04-15 Novellus Systems, Inc. Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate
US5088441A (en) * 1990-08-23 1992-02-18 Belport Co., Inc. Cord impregnator
US5705223A (en) 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
FR2733036B1 (fr) 1995-04-14 1997-07-04 Unir Dispositif de protection anti-contamination rapprochee
US5660642A (en) 1995-05-26 1997-08-26 The Regents Of The University Of California Moving zone Marangoni drying of wet objects using naturally evaporated solvent vapor
KR0175278B1 (ko) * 1996-02-13 1999-04-01 김광호 웨이퍼 세정장치
JPH09270412A (ja) * 1996-04-01 1997-10-14 Canon Inc 洗浄装置及び洗浄方法
DE19622015A1 (de) 1996-05-31 1997-12-04 Siemens Ag Verfahren zum Ätzen von Zerstörungszonen an einem Halbleitersubstratrand sowie Ätzanlage
US5724748A (en) 1996-07-24 1998-03-10 Brooks; Ray G. Apparatus for packaging contaminant-sensitive articles and resulting package
TW357406B (en) 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
US5868857A (en) 1996-12-30 1999-02-09 Intel Corporation Rotating belt wafer edge cleaning apparatus
US5967882A (en) 1997-03-06 1999-10-19 Keltech Engineering Lapping apparatus and process with two opposed lapping platens
JP3549141B2 (ja) 1997-04-21 2004-08-04 大日本スクリーン製造株式会社 基板処理装置および基板保持装置
DE69828592T8 (de) 1997-09-24 2006-06-08 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum entfernen einer flüssigkeit von einer oberfläche einer substrat
US6398975B1 (en) 1997-09-24 2002-06-04 Interuniversitair Microelektronica Centrum (Imec) Method and apparatus for localized liquid treatment of the surface of a substrate
EP0905746A1 (de) 1997-09-24 1999-03-31 Interuniversitair Micro-Elektronica Centrum Vzw Verfahren zum Entfernen einer Flüssigkeit von einer Oberfläche einer umlaufenden Substrat
US6491764B2 (en) 1997-09-24 2002-12-10 Interuniversitair Microelektronics Centrum (Imec) Method and apparatus for removing a liquid from a surface of a rotating substrate
US6102777A (en) 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
ATE259681T1 (de) * 1998-04-16 2004-03-15 Semitool Inc Verfahren und gerät zur behandlung eines werkstückes, wie ein halbleiterwafer
JP2000100768A (ja) * 1998-09-28 2000-04-07 Tokyo Electron Ltd 回転処理装置
US20020121290A1 (en) 1999-08-25 2002-09-05 Applied Materials, Inc. Method and apparatus for cleaning/drying hydrophobic wafers
US6622334B1 (en) 2000-03-29 2003-09-23 International Business Machines Corporation Wafer edge cleaning utilizing polish pad material
US7000622B2 (en) 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
US6550091B1 (en) * 2000-10-04 2003-04-22 Lam Research Corporation Double-sided wafer edge scrubbing apparatus and method for using the same
JP2002124508A (ja) * 2000-10-13 2002-04-26 Nec Corp 基板用スピン処理装置
ATE417356T1 (de) 2000-10-31 2008-12-15 Sez Ag Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
EP1402566B1 (de) 2001-06-12 2007-02-14 Akrion Technologies, Inc. Megaschallreinigungs- und trocknungsvorrichtung
DE60218708D1 (de) 2001-09-24 2007-04-19 Cosmetic Technologies Llc Vorrichtung und verfahren zum individuellen zusammenstellen von kosmetika
US7350315B2 (en) 2003-12-22 2008-04-01 Lam Research Corporation Edge wheel dry manifold
US20060000494A1 (en) 2004-06-30 2006-01-05 Lam Research Corporation Self-draining edge wheel system and method
US7089687B2 (en) 2004-09-30 2006-08-15 Lam Research Corporation Wafer edge wheel with drying function

Also Published As

Publication number Publication date
CN100444309C (zh) 2008-12-17
EP1697969A1 (de) 2006-09-06
JP4928950B2 (ja) 2012-05-09
WO2005064648A1 (en) 2005-07-14
IL176467A (en) 2011-06-30
KR101121934B1 (ko) 2012-03-09
US7350315B2 (en) 2008-04-01
EP1697969B1 (de) 2009-10-28
DE602004023878D1 (de) 2009-12-10
TWI305928B (en) 2009-02-01
MY144397A (en) 2011-09-15
JP2007515810A (ja) 2007-06-14
US20050132953A1 (en) 2005-06-23
TW200539237A (en) 2005-12-01
CN1898773A (zh) 2007-01-17
KR20060123379A (ko) 2006-12-01
IL176467A0 (en) 2006-10-05

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties