DE60218163D1 - Megaschallreinigungs- und trocknungsvorrichtung - Google Patents

Megaschallreinigungs- und trocknungsvorrichtung

Info

Publication number
DE60218163D1
DE60218163D1 DE60218163T DE60218163T DE60218163D1 DE 60218163 D1 DE60218163 D1 DE 60218163D1 DE 60218163 T DE60218163 T DE 60218163T DE 60218163 T DE60218163 T DE 60218163T DE 60218163 D1 DE60218163 D1 DE 60218163D1
Authority
DE
Germany
Prior art keywords
splash guard
chuck
substrate
mega
drying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60218163T
Other languages
English (en)
Other versions
DE60218163T2 (de
Inventor
M Lauerhaas
Jr J Nicolosi
Paul Mertens
William Fyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Interuniversitair Microelektronica Centrum vzw IMEC
Akrion Technologies Inc
Original Assignee
Interuniversitair Microelektronica Centrum vzw IMEC
Akrion Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interuniversitair Microelektronica Centrum vzw IMEC, Akrion Technologies Inc filed Critical Interuniversitair Microelektronica Centrum vzw IMEC
Publication of DE60218163D1 publication Critical patent/DE60218163D1/de
Application granted granted Critical
Publication of DE60218163T2 publication Critical patent/DE60218163T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60218163T 2001-06-12 2002-06-12 Megaschallreinigungs- und trocknungsvorrichtung Expired - Lifetime DE60218163T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US29773601P 2001-06-12 2001-06-12
US297736P 2001-06-12
US30492001P 2001-07-11 2001-07-11
US304920P 2001-07-11
US31672501P 2001-08-30 2001-08-30
US316725P 2001-08-30
PCT/US2002/018761 WO2002101795A2 (en) 2001-06-12 2002-06-12 Megasonic cleaner and dryer system

Publications (2)

Publication Number Publication Date
DE60218163D1 true DE60218163D1 (de) 2007-03-29
DE60218163T2 DE60218163T2 (de) 2007-11-22

Family

ID=27404512

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60218163T Expired - Lifetime DE60218163T2 (de) 2001-06-12 2002-06-12 Megaschallreinigungs- und trocknungsvorrichtung

Country Status (7)

Country Link
US (6) US20020185155A1 (de)
EP (1) EP1402566B1 (de)
JP (1) JP4114188B2 (de)
KR (2) KR20090104115A (de)
AT (1) ATE354175T1 (de)
DE (1) DE60218163T2 (de)
WO (5) WO2002101798A2 (de)

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Also Published As

Publication number Publication date
US20020185153A1 (en) 2002-12-12
ATE354175T1 (de) 2007-03-15
KR20090104115A (ko) 2009-10-05
WO2002101799A3 (en) 2003-02-27
WO2002101796A2 (en) 2002-12-19
JP4114188B2 (ja) 2008-07-09
WO2002101798A3 (en) 2003-02-27
US6923192B2 (en) 2005-08-02
WO2002101799A2 (en) 2002-12-19
DE60218163T2 (de) 2007-11-22
EP1402566A2 (de) 2004-03-31
US6928751B2 (en) 2005-08-16
WO2002101795A2 (en) 2002-12-19
US20040231188A1 (en) 2004-11-25
WO2002101798A2 (en) 2002-12-19
WO2002101795A3 (en) 2003-03-06
KR20040028782A (ko) 2004-04-03
US20020185154A1 (en) 2002-12-12
US20020185152A1 (en) 2002-12-12
JP2004537168A (ja) 2004-12-09
WO2002101796A3 (en) 2003-02-27
US20020185155A1 (en) 2002-12-12
EP1402566B1 (de) 2007-02-14
WO2002101797A3 (en) 2003-02-27
US20040020512A1 (en) 2004-02-05
US6754980B2 (en) 2004-06-29
WO2002101797A2 (en) 2002-12-19

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