ATE438923T1 - Einzel-arbeitsstück-verarbeitungskammer - Google Patents
Einzel-arbeitsstück-verarbeitungskammerInfo
- Publication number
- ATE438923T1 ATE438923T1 AT05725306T AT05725306T ATE438923T1 AT E438923 T1 ATE438923 T1 AT E438923T1 AT 05725306 T AT05725306 T AT 05725306T AT 05725306 T AT05725306 T AT 05725306T AT E438923 T1 ATE438923 T1 AT E438923T1
- Authority
- AT
- Austria
- Prior art keywords
- processing chamber
- workpiece processing
- single workpiece
- process chamber
- rim
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US55264204P | 2004-03-12 | 2004-03-12 | |
US11/075,099 US8118044B2 (en) | 2004-03-12 | 2005-03-08 | Single workpiece processing chamber with tilting load/unload upper rim |
PCT/US2005/008066 WO2005091340A1 (en) | 2004-03-12 | 2005-03-09 | Single workpiece processing chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE438923T1 true ATE438923T1 (de) | 2009-08-15 |
Family
ID=34922232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05725306T ATE438923T1 (de) | 2004-03-12 | 2005-03-09 | Einzel-arbeitsstück-verarbeitungskammer |
Country Status (7)
Country | Link |
---|---|
US (2) | US8118044B2 (de) |
EP (1) | EP1735817B1 (de) |
JP (1) | JP4624406B2 (de) |
KR (1) | KR100836447B1 (de) |
AT (1) | ATE438923T1 (de) |
DE (1) | DE602005015830D1 (de) |
WO (1) | WO2005091340A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6423642B1 (en) * | 1998-03-13 | 2002-07-23 | Semitool, Inc. | Reactor for processing a semiconductor wafer |
US7849865B2 (en) * | 2007-01-05 | 2010-12-14 | Semitool, Inc. | System for processing a workpiece |
WO2013016941A1 (zh) * | 2011-07-29 | 2013-02-07 | 无锡华瑛微电子技术有限公司 | 可调式半导体处理装置及其控制方法 |
CN104395736B (zh) | 2012-06-29 | 2018-12-11 | 皇家飞利浦有限公司 | 对结合的磁性粒子和未结合的磁性粒子进行处理 |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
US11342215B2 (en) | 2017-04-25 | 2022-05-24 | Veeco Instruments Inc. | Semiconductor wafer processing chamber |
WO2018200401A1 (en) * | 2017-04-25 | 2018-11-01 | Veeco Precision Surface Processing Llc | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
CN108508956B (zh) * | 2018-07-11 | 2019-05-03 | 南京卡普科技有限公司 | 一种线性稳压器 |
WO2020039849A1 (ja) * | 2018-08-22 | 2020-02-27 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
US11270898B2 (en) | 2018-09-16 | 2022-03-08 | Applied Materials, Inc. | Apparatus for enhancing flow uniformity in a process chamber |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US13797A (en) * | 1855-11-13 | Mode of hanging carriage-bodies | ||
US5658387A (en) * | 1991-03-06 | 1997-08-19 | Semitool, Inc. | Semiconductor processing spray coating apparatus |
US5980706A (en) * | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
JP3666138B2 (ja) * | 1996-08-30 | 2005-06-29 | 澁谷工業株式会社 | 容器処理装置 |
US5975097A (en) * | 1996-09-02 | 1999-11-02 | Tokyo Electron Limited | Processing apparatus for target processing substrate |
JP3317855B2 (ja) * | 1996-09-02 | 2002-08-26 | 東京エレクトロン株式会社 | 洗浄装置 |
US6247479B1 (en) * | 1997-05-27 | 2001-06-19 | Tokyo Electron Limited | Washing/drying process apparatus and washing/drying process method |
JP3265237B2 (ja) * | 1997-08-01 | 2002-03-11 | 東京エレクトロン株式会社 | 基板縁部の薄膜除去装置 |
JP3110370B2 (ja) | 1998-02-26 | 2000-11-20 | 日本電気ファクトリエンジニアリング株式会社 | 半導体基板現像装置及び現像方法 |
US6900132B2 (en) * | 1998-03-13 | 2005-05-31 | Semitool, Inc. | Single workpiece processing system |
US6930046B2 (en) * | 1999-01-22 | 2005-08-16 | Semitool, Inc. | Single workpiece processing system |
EP1038593B1 (de) * | 1999-04-06 | 2000-10-04 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Einrichtung zum Austrag von zwei oder mehreren Medien mit Mediendüsen |
US6623609B2 (en) * | 1999-07-12 | 2003-09-23 | Semitool, Inc. | Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same |
US6415804B1 (en) * | 1999-12-23 | 2002-07-09 | Lam Research Corporation | Bowl for processing semiconductor wafers |
US6923192B2 (en) * | 2001-06-12 | 2005-08-02 | Goldfinger Technologies, Llc | Stackable process chambers |
JP2003168673A (ja) | 2001-12-03 | 2003-06-13 | Rix Corp | ウエーハの洗浄および乾燥槽 |
WO2003060987A1 (en) * | 2002-01-10 | 2003-07-24 | Nec Corporation | Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
JP2003251255A (ja) | 2002-03-01 | 2003-09-09 | Sumitomo Precision Prod Co Ltd | 基板処理装置 |
US7144459B2 (en) * | 2002-07-19 | 2006-12-05 | Semitool, Inc. | Centrifugal swing arm spray processor |
US7313462B2 (en) * | 2003-06-06 | 2007-12-25 | Semitool, Inc. | Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces |
US7198694B2 (en) * | 2003-06-06 | 2007-04-03 | Semitool, Inc. | Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems |
US7393439B2 (en) * | 2003-06-06 | 2008-07-01 | Semitool, Inc. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
US20050178402A1 (en) * | 2004-02-12 | 2005-08-18 | Stowell R. M. | Methods and apparatus for cleaning and drying a work piece |
US7337663B2 (en) * | 2004-03-12 | 2008-03-04 | Semitool, Inc. | Sonic energy process chamber |
-
2005
- 2005-03-08 US US11/075,099 patent/US8118044B2/en active Active
- 2005-03-09 DE DE602005015830T patent/DE602005015830D1/de active Active
- 2005-03-09 AT AT05725306T patent/ATE438923T1/de active
- 2005-03-09 EP EP05725306A patent/EP1735817B1/de not_active Not-in-force
- 2005-03-09 KR KR1020067019400A patent/KR100836447B1/ko not_active IP Right Cessation
- 2005-03-09 WO PCT/US2005/008066 patent/WO2005091340A1/en active Application Filing
- 2005-03-09 JP JP2007503035A patent/JP4624406B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-17 US US13/299,141 patent/US8562752B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20050199503A1 (en) | 2005-09-15 |
US8118044B2 (en) | 2012-02-21 |
JP4624406B2 (ja) | 2011-02-02 |
US20120060869A1 (en) | 2012-03-15 |
WO2005091340A1 (en) | 2005-09-29 |
EP1735817B1 (de) | 2009-08-05 |
EP1735817A1 (de) | 2006-12-27 |
KR20060131912A (ko) | 2006-12-20 |
KR100836447B1 (ko) | 2008-06-09 |
US8562752B2 (en) | 2013-10-22 |
DE602005015830D1 (de) | 2009-09-17 |
JP2007529120A (ja) | 2007-10-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
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