SG130168A1 - Silicon wafer surface defect evaluation method - Google Patents

Silicon wafer surface defect evaluation method

Info

Publication number
SG130168A1
SG130168A1 SG200605807-7A SG2006058077A SG130168A1 SG 130168 A1 SG130168 A1 SG 130168A1 SG 2006058077 A SG2006058077 A SG 2006058077A SG 130168 A1 SG130168 A1 SG 130168A1
Authority
SG
Singapore
Prior art keywords
silicon wafer
wafer surface
silicon
evaluation method
defect evaluation
Prior art date
Application number
SG200605807-7A
Other languages
English (en)
Inventor
Wataru Itou
Takeshi Hasegawa
Takaaki Shiota
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of SG130168A1 publication Critical patent/SG130168A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG200605807-7A 2005-08-26 2006-08-24 Silicon wafer surface defect evaluation method SG130168A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005245105 2005-08-26
JP2006169888A JP4743010B2 (ja) 2005-08-26 2006-06-20 シリコンウェーハの表面欠陥評価方法

Publications (1)

Publication Number Publication Date
SG130168A1 true SG130168A1 (en) 2007-03-20

Family

ID=37499678

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200605807-7A SG130168A1 (en) 2005-08-26 2006-08-24 Silicon wafer surface defect evaluation method

Country Status (7)

Country Link
US (1) US7632349B2 (ko)
EP (1) EP1758158B1 (ko)
JP (1) JP4743010B2 (ko)
KR (1) KR100768378B1 (ko)
CN (1) CN1932496B (ko)
MY (1) MY137864A (ko)
SG (1) SG130168A1 (ko)

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CN109273377B (zh) * 2018-09-03 2020-09-15 宁晋晶兴电子材料有限公司 单晶硅同心圆及黑角的检测前预处理方法
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Also Published As

Publication number Publication date
JP4743010B2 (ja) 2011-08-10
MY137864A (en) 2009-03-31
CN1932496B (zh) 2011-10-12
KR20070024431A (ko) 2007-03-02
US7632349B2 (en) 2009-12-15
JP2007088421A (ja) 2007-04-05
US20070044709A1 (en) 2007-03-01
EP1758158A2 (en) 2007-02-28
EP1758158A3 (en) 2009-07-22
CN1932496A (zh) 2007-03-21
KR100768378B1 (ko) 2007-10-18
EP1758158B1 (en) 2011-06-15

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