SG121988A1 - Composition for selectively polishing silicon nitride layer and polishing method employing it - Google Patents
Composition for selectively polishing silicon nitride layer and polishing method employing itInfo
- Publication number
- SG121988A1 SG121988A1 SG200506653A SG200506653A SG121988A1 SG 121988 A1 SG121988 A1 SG 121988A1 SG 200506653 A SG200506653 A SG 200506653A SG 200506653 A SG200506653 A SG 200506653A SG 121988 A1 SG121988 A1 SG 121988A1
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- polishing
- nitride layer
- silicon nitride
- method employing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 title abstract 5
- 229910052581 Si3N4 Inorganic materials 0.000 title abstract 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 3
- 239000006061 abrasive grain Substances 0.000 abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 238000003486 chemical etching Methods 0.000 abstract 1
- 231100000989 no adverse effect Toxicity 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004304651A JP4954462B2 (ja) | 2004-10-19 | 2004-10-19 | 窒化シリコン膜選択的研磨用組成物およびそれを用いる研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG121988A1 true SG121988A1 (en) | 2006-05-26 |
Family
ID=35602813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200506653A SG121988A1 (en) | 2004-10-19 | 2005-10-11 | Composition for selectively polishing silicon nitride layer and polishing method employing it |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7217989B2 (ja) |
| EP (1) | EP1650278B1 (ja) |
| JP (1) | JP4954462B2 (ja) |
| KR (1) | KR101153756B1 (ja) |
| CN (1) | CN1796482B (ja) |
| AT (1) | ATE453698T1 (ja) |
| DE (1) | DE602005018586D1 (ja) |
| SG (1) | SG121988A1 (ja) |
| TW (1) | TWI366225B (ja) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8759216B2 (en) * | 2006-06-07 | 2014-06-24 | Cabot Microelectronics Corporation | Compositions and methods for polishing silicon nitride materials |
| WO2008117593A1 (ja) * | 2007-03-26 | 2008-10-02 | Jsr Corporation | 化学機械研磨用水系分散体および半導体装置の化学機械研磨方法 |
| JP5403262B2 (ja) * | 2007-03-26 | 2014-01-29 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体、および半導体装置の化学機械研磨方法 |
| KR101396853B1 (ko) * | 2007-07-06 | 2014-05-20 | 삼성전자주식회사 | 실리콘 질화물 연마용 슬러리 조성물, 이를 이용한 실리콘질화막의 연마 방법 및 반도체 장치의 제조 방법 |
| MY149975A (en) * | 2007-09-21 | 2013-11-15 | Cabot Microelectronics Corp | Polishing composition and method utilizing abrasive particles treated with an aminosilane |
| CN101802125B (zh) * | 2007-09-21 | 2013-11-06 | 卡伯特微电子公司 | 使用经氨基硅烷处理的研磨剂颗粒的抛光组合物和方法 |
| TW201038690A (en) | 2008-09-26 | 2010-11-01 | Rhodia Operations | Abrasive compositions for chemical mechanical polishing and methods for using same |
| EP2343732B1 (en) * | 2008-10-20 | 2018-10-10 | Nitta Haas Incorporated | Composition for polishing silicon nitride |
| CN101955731A (zh) * | 2009-07-13 | 2011-01-26 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| WO2011093153A1 (ja) | 2010-02-01 | 2011-08-04 | Jsr株式会社 | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法 |
| US8497210B2 (en) | 2010-10-04 | 2013-07-30 | International Business Machines Corporation | Shallow trench isolation chemical mechanical planarization |
| CN103484024B (zh) * | 2013-09-13 | 2014-10-15 | 上海新安纳电子科技有限公司 | 一种二氧化硅介电材料用化学机械抛光液及其制备方法 |
| US9583359B2 (en) | 2014-04-04 | 2017-02-28 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for selectively polishing silicon nitride over silicon oxide films |
| CN105369250B (zh) * | 2015-12-16 | 2017-12-08 | 重庆硕奥科技有限公司 | 一种基于纳米二氧化硅的电路板用蚀刻液 |
| CN105463460A (zh) * | 2015-12-16 | 2016-04-06 | 无锡吉进环保科技有限公司 | 一种基于纳米二氧化硅的电路板用蚀刻液的制备方法 |
| EP3526298A4 (en) | 2016-10-17 | 2020-06-24 | Cabot Microelectronics Corporation | SELECTIVE MECHANICAL AND CHEMICAL POLISHING COMPOSITIONS FOR OXIDE AND NITRIDE, WITH IMPROVED PATTERN SELECTIVITY AND REDUCED “HOLLOW ZONE” PHENOMENON |
| US10711158B2 (en) | 2017-09-28 | 2020-07-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them |
| US11186748B2 (en) | 2017-09-28 | 2021-11-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous anionic functional silica slurry and amine carboxylic acid compositions for selective nitride removal in polishing and methods of using them |
| US10508221B2 (en) | 2017-09-28 | 2019-12-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous low abrasive silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of making and using them |
| US10584265B2 (en) | 2017-09-28 | 2020-03-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them |
| CN111363550A (zh) * | 2018-12-26 | 2020-07-03 | 上海新阳半导体材料股份有限公司 | 选择性刻蚀液组合物及其制备方法和应用 |
| JP6958774B1 (ja) | 2020-06-30 | 2021-11-02 | Jsr株式会社 | 砥粒の製造方法、化学機械研磨用組成物及び化学機械研磨方法 |
| CN114672252B (zh) * | 2022-04-11 | 2023-11-28 | 宁波日晟新材料有限公司 | 一种无味氮化铝抛光液及其制备方法和应用 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3190742B2 (ja) * | 1992-10-12 | 2001-07-23 | 株式会社東芝 | 研磨方法 |
| US6046110A (en) * | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
| JP3514908B2 (ja) * | 1995-11-13 | 2004-04-05 | 株式会社東芝 | 研磨剤 |
| JP3230986B2 (ja) | 1995-11-13 | 2001-11-19 | 株式会社東芝 | ポリッシング方法、半導体装置の製造方法及び半導体製造装置。 |
| EP0786504A3 (en) | 1996-01-29 | 1998-05-20 | Fujimi Incorporated | Polishing composition |
| US5968239A (en) | 1996-11-12 | 1999-10-19 | Kabushiki Kaisha Toshiba | Polishing slurry |
| JPH11176773A (ja) | 1997-12-12 | 1999-07-02 | Toshiba Corp | 研磨方法 |
| TW416104B (en) * | 1998-08-28 | 2000-12-21 | Kobe Steel Ltd | Method for reclaiming wafer substrate and polishing solution composition for reclaiming wafer substrate |
| JP2000183003A (ja) * | 1998-10-07 | 2000-06-30 | Toshiba Corp | 銅系金属用研磨組成物および半導体装置の製造方法 |
| JP2001115144A (ja) * | 1999-10-15 | 2001-04-24 | Hitachi Chem Co Ltd | 研磨材、基板の研磨方法及び半導体装置 |
| JP2001187878A (ja) * | 1999-12-28 | 2001-07-10 | Nec Corp | 化学的機械的研磨用スラリー |
| US6355075B1 (en) * | 2000-02-11 | 2002-03-12 | Fujimi Incorporated | Polishing composition |
| JP4439755B2 (ja) * | 2001-03-29 | 2010-03-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法 |
| KR100557600B1 (ko) * | 2001-06-29 | 2006-03-10 | 주식회사 하이닉스반도체 | 나이트라이드 cmp용 슬러리 |
| JP2003170349A (ja) * | 2001-09-27 | 2003-06-17 | Fujimi Inc | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
| JP4083528B2 (ja) * | 2002-10-01 | 2008-04-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| KR100627510B1 (ko) | 2002-12-30 | 2006-09-22 | 주식회사 하이닉스반도체 | 나이트라이드용 ｃｍｐ 슬러리 |
| JP4267348B2 (ja) * | 2003-03-05 | 2009-05-27 | 花王株式会社 | 研磨基板の製造方法 |
| JP4401672B2 (ja) | 2003-03-31 | 2010-01-20 | キヤノン株式会社 | 情報処理装置、情報処理方法及びプログラム |
| US20050108947A1 (en) * | 2003-11-26 | 2005-05-26 | Mueller Brian L. | Compositions and methods for chemical mechanical polishing silica and silicon nitride |
| US20060021972A1 (en) * | 2004-07-28 | 2006-02-02 | Lane Sarah J | Compositions and methods for chemical mechanical polishing silicon dioxide and silicon nitride |
-
2004
- 2004-10-19 JP JP2004304651A patent/JP4954462B2/ja active Active
-
2005
- 2005-10-05 EP EP05256210A patent/EP1650278B1/en active Active
- 2005-10-05 AT AT05256210T patent/ATE453698T1/de not_active IP Right Cessation
- 2005-10-05 DE DE602005018586T patent/DE602005018586D1/de active Active
- 2005-10-11 SG SG200506653A patent/SG121988A1/en unknown
- 2005-10-18 US US11/251,880 patent/US7217989B2/en active Active
- 2005-10-18 TW TW094136344A patent/TWI366225B/zh active
- 2005-10-19 KR KR1020050098657A patent/KR101153756B1/ko active IP Right Grant
- 2005-10-19 CN CN2005101161919A patent/CN1796482B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI366225B (en) | 2012-06-11 |
| JP2006120728A (ja) | 2006-05-11 |
| EP1650278B1 (en) | 2009-12-30 |
| CN1796482A (zh) | 2006-07-05 |
| EP1650278A3 (en) | 2006-10-04 |
| EP1650278A2 (en) | 2006-04-26 |
| CN1796482B (zh) | 2010-06-02 |
| JP4954462B2 (ja) | 2012-06-13 |
| ATE453698T1 (de) | 2010-01-15 |
| US20060084270A1 (en) | 2006-04-20 |
| KR20060054116A (ko) | 2006-05-22 |
| KR101153756B1 (ko) | 2012-06-13 |
| US7217989B2 (en) | 2007-05-15 |
| DE602005018586D1 (de) | 2010-02-11 |
| TW200703491A (en) | 2007-01-16 |
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