SG119140A1 - Grinding wheel - Google Patents

Grinding wheel

Info

Publication number
SG119140A1
SG119140A1 SG200106155A SG200106155A SG119140A1 SG 119140 A1 SG119140 A1 SG 119140A1 SG 200106155 A SG200106155 A SG 200106155A SG 200106155 A SG200106155 A SG 200106155A SG 119140 A1 SG119140 A1 SG 119140A1
Authority
SG
Singapore
Prior art keywords
grinding wheel
grinding
wheel
Prior art date
Application number
SG200106155A
Other languages
English (en)
Inventor
Suzuki Masaaki
Sekiya Kazuma
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001203115A external-priority patent/JP4885376B2/ja
Priority claimed from JP2001281505A external-priority patent/JP4837853B2/ja
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG119140A1 publication Critical patent/SG119140A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200106155A 2001-07-04 2001-10-05 Grinding wheel SG119140A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001203115A JP4885376B2 (ja) 2001-07-04 2001-07-04 研削ホイール
JP2001281505A JP4837853B2 (ja) 2001-09-17 2001-09-17 研削ホイール

Publications (1)

Publication Number Publication Date
SG119140A1 true SG119140A1 (en) 2006-02-28

Family

ID=26618098

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200106155A SG119140A1 (en) 2001-07-04 2001-10-05 Grinding wheel

Country Status (6)

Country Link
US (1) US6966826B2 (de)
KR (1) KR100750040B1 (de)
DE (1) DE10149712B4 (de)
MY (1) MY134523A (de)
SG (1) SG119140A1 (de)
TW (1) TW491751B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP2004050313A (ja) * 2002-07-17 2004-02-19 Memc Japan Ltd 研削用砥石および研削方法
AT414105B (de) * 2003-09-04 2006-09-15 Schrottner Gerhard Abdeckung zur mediumsführung bei schleifscheiben
AT502503B1 (de) * 2003-09-04 2007-04-15 Schrottner Gerhard Ringsystem zur mediumsführung bei schleifscheiben
JP2009094326A (ja) * 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd ウェーハの研削方法
JP2009095947A (ja) * 2007-10-18 2009-05-07 Disco Abrasive Syst Ltd 研削装置及びウェーハの研削方法
JP4662083B2 (ja) * 2008-02-27 2011-03-30 トヨタ自動車株式会社 研磨装置
KR20110056976A (ko) * 2009-11-23 2011-05-31 삼성전자주식회사 휠 팁의 높이를 조절할 수 있는 웨이퍼 연마 장치
US9011206B2 (en) * 2010-01-13 2015-04-21 A.L.M.T. Corp. Super abrasive wheel with dispensing capability, method of manufacturing wafer using the same, and wafer
JP5855959B2 (ja) * 2012-02-01 2016-02-09 コマツＮｔｃ株式会社 研削砥石および研削装置
JP2015223691A (ja) * 2014-05-30 2015-12-14 天龍製鋸株式会社 カップホイール
SE540285C2 (en) * 2015-01-20 2018-05-22 Htc Sweden Ab System comprising a carrier disk and a floor grinding machine
JP7204318B2 (ja) * 2017-11-06 2023-01-16 株式会社ディスコ 研削ホイール
AT17877U1 (de) 2018-03-12 2023-06-15 Tyrolit Schleifmittelwerke Swarovski Ag & Co K G Schleifwerkzeug zum Schleifen eines Motorblocks
KR102608901B1 (ko) * 2018-12-24 2023-12-01 삼성전자주식회사 웨이퍼 그라인딩 휠
CN109483417B (zh) * 2018-12-28 2023-12-26 西安增材制造国家研究院有限公司 一种金属基微量润滑砂轮及制作方法
CN109483418B (zh) * 2018-12-28 2023-11-17 西安增材制造国家研究院有限公司 金属基微量润滑砂轮及金属基微量润滑砂轮的制作方法
US11699634B2 (en) * 2019-05-03 2023-07-11 Applied Materials, Inc. Water cooled plate for heat management in power amplifiers
JP7497117B2 (ja) * 2020-07-16 2024-06-10 株式会社ディスコ 被加工物の研削方法
JP2022096834A (ja) * 2020-12-18 2022-06-30 株式会社ディスコ 研削ホイール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU566725A1 (ru) * 1976-03-29 1977-07-30 Ордена Трудового Красного Знамени Институт Сверхтвердых Материалов Ан Украинской Сср Шлифовальный торцовый круг
US4854087A (en) * 1987-02-28 1989-08-08 Zahnradfabrik Friedrichshafen A.G. Grinding disc
EP0505615B1 (de) * 1991-03-23 1994-05-11 Ernst Winter & Sohn (Gmbh & Co.) Schleifscheibe
DE29604423U1 (de) * 1996-03-09 1996-05-23 Derkom + Klein GmbH & Co. KG, 42719 Solingen Schleifring
EP0876877A2 (de) * 1997-05-07 1998-11-11 Heinrich Lippert Gmbh Schleifkörper

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7236091U (de) * 1973-02-01 Sielemann H Schleifvorrichtung
US2455597A (en) * 1945-12-07 1948-12-07 Super Cut Grinding wheel
CH321620A (fr) * 1955-05-26 1957-05-15 Fehlmann Henri Dispositif d'arrosage d'une meule rotative
US2840960A (en) * 1956-10-22 1958-07-01 Sheldon M Booth Liquid feed for a grinding wheel
FR1318959A (fr) * 1962-03-23 1963-02-22 Guilhon & Barthelemy Ets Dispositif de grèsage et de son alimentation en eau
US3110993A (en) * 1962-07-18 1963-11-19 Continental Granite Corp Grinding wheel with provision for coolant application
DE1652889C3 (de) * 1967-09-02 1974-01-10 Bayerische Maschinenfabrik F.J. Schlageter, 8400 Regensburg Segmentstirnschleifscheibe
DE2425179A1 (de) * 1973-05-31 1975-01-02 Pramet N P Z Praskove Metalurg Schleifscheibe
US4791760A (en) * 1987-07-09 1988-12-20 Corning Glass Works Grinding wheel coolant distributor
JPH0569338A (ja) * 1991-06-24 1993-03-23 Mitsubishi Materials Corp 通水性カツプ型砥石
JPH10180624A (ja) * 1996-12-19 1998-07-07 Shin Etsu Handotai Co Ltd ラッピング装置及び方法
DE20002338U1 (de) * 2000-01-14 2000-05-04 Peter Wolters Werkzeugmaschinen GmbH, 24768 Rendsburg Maschine zum einseitigen Bearbeiten der Oberflächen von Werkstücken
JP2001205560A (ja) * 2000-01-28 2001-07-31 Disco Abrasive Syst Ltd 研削ホイール及び該研削ホイールの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU566725A1 (ru) * 1976-03-29 1977-07-30 Ордена Трудового Красного Знамени Институт Сверхтвердых Материалов Ан Украинской Сср Шлифовальный торцовый круг
US4854087A (en) * 1987-02-28 1989-08-08 Zahnradfabrik Friedrichshafen A.G. Grinding disc
EP0505615B1 (de) * 1991-03-23 1994-05-11 Ernst Winter & Sohn (Gmbh & Co.) Schleifscheibe
DE29604423U1 (de) * 1996-03-09 1996-05-23 Derkom + Klein GmbH & Co. KG, 42719 Solingen Schleifring
EP0876877A2 (de) * 1997-05-07 1998-11-11 Heinrich Lippert Gmbh Schleifkörper

Also Published As

Publication number Publication date
KR20030004007A (ko) 2003-01-14
KR100750040B1 (ko) 2007-08-16
US20030032382A1 (en) 2003-02-13
MY134523A (en) 2007-12-31
DE10149712A1 (de) 2003-01-16
US6966826B2 (en) 2005-11-22
DE10149712B4 (de) 2013-02-14
TW491751B (en) 2002-06-21

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