JP7497117B2 - 被加工物の研削方法 - Google Patents
被加工物の研削方法 Download PDFInfo
- Publication number
- JP7497117B2 JP7497117B2 JP2020121899A JP2020121899A JP7497117B2 JP 7497117 B2 JP7497117 B2 JP 7497117B2 JP 2020121899 A JP2020121899 A JP 2020121899A JP 2020121899 A JP2020121899 A JP 2020121899A JP 7497117 B2 JP7497117 B2 JP 7497117B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- groove
- chuck table
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 30
- 239000004575 stone Substances 0.000 claims description 9
- 235000012431 wafers Nutrition 0.000 description 17
- 230000002093 peripheral effect Effects 0.000 description 12
- 239000006061 abrasive grain Substances 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 10
- 230000032258 transport Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
4:基台、4a:開口
6:ロボットアーム
8a,8b:カセット配置領域
10a,10b:カセット
11:被加工物、11a:表面、11b:裏面、11c:溝、11d:側壁
12:位置合わせ機構
14:ローディングアーム
16:ターンテーブル
18:チャックテーブル、18a:保持面
20:回転駆動源
22a,22b:支持構造
24a,24b:研削送りユニット
26:ガイドレール
28:移動プレート
30:ボールねじ
32:パルスモータ
34a,34b:研削ユニット
36:ハウジング
38:スピンドル
40:回転駆動源
41:矢印
42:マウント
44a,44b:研削ホイール
46:環状基台
48:研削砥石、48a:底面、48b:内周側面、48c:外周側面
50:厚さ測定器、52a:第1のハイトゲージ、52b:第2のハイトゲージ
54:アンローディングアーム
56:洗浄ユニット
58:制御部
A:搬入搬出位置、B:粗研削位置、C:仕上げ研削位置
D1,D2,E1,E2:グラフ
Claims (2)
- 被加工物を保持するチャックテーブルと、
スピンドルを有し、環状に配置された複数の研削砥石を有する研削ホイールを該スピンドルに装着し、該スピンドルを中心として該研削ホイールを回転させた状態で、該チャックテーブルで保持された該被加工物を研削する研削ユニットと、
を備える研削装置を用いて該被加工物を研削する被加工物の研削方法であって、
該被加工物を保持した該チャックテーブルを回転させない状態で、該スピンドルを回転させながら該研削ユニットを研削送りして該被加工物を研削することにより、該被加工物の裏面側に仕上げ厚さに至らない深さを有する円弧状の溝を形成する溝形成ステップと、
該溝形成ステップの後、該スピンドルを回転させたまま該複数の研削砥石が該溝の内部に配置された状態で該チャックテーブルの回転を開始することにより該溝の側壁を研削し、該被加工物から溝を除去する溝除去ステップと、
該溝除去ステップの後、該スピンドルと該チャックテーブルとを回転させながら該研削ユニットを研削送りして、該被加工物が仕上げ厚さとなるまで該被加工物の裏面側の全体を研削する全面研削ステップと、
を備えることを特徴とする被加工物の研削方法。 - 該溝除去ステップでは、該研削ユニットを研削送りしながら該チャックテーブルを回転させることを特徴とする請求項1記載の被加工物の研削方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020121899A JP7497117B2 (ja) | 2020-07-16 | 2020-07-16 | 被加工物の研削方法 |
US17/347,765 US11590630B2 (en) | 2020-07-16 | 2021-06-15 | Workpiece grinding method |
KR1020210077751A KR20220009869A (ko) | 2020-07-16 | 2021-06-16 | 피가공물의 연삭 방법 |
TW110125005A TW202205418A (zh) | 2020-07-16 | 2021-07-07 | 被加工物之磨削方法 |
DE102021207222.4A DE102021207222A1 (de) | 2020-07-16 | 2021-07-08 | Schleifverfahren für ein werkstück |
CN202110783497.9A CN113941934A (zh) | 2020-07-16 | 2021-07-12 | 被加工物的磨削方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020121899A JP7497117B2 (ja) | 2020-07-16 | 2020-07-16 | 被加工物の研削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022018650A JP2022018650A (ja) | 2022-01-27 |
JP7497117B2 true JP7497117B2 (ja) | 2024-06-10 |
Family
ID=79021361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020121899A Active JP7497117B2 (ja) | 2020-07-16 | 2020-07-16 | 被加工物の研削方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11590630B2 (ja) |
JP (1) | JP7497117B2 (ja) |
KR (1) | KR20220009869A (ja) |
CN (1) | CN113941934A (ja) |
DE (1) | DE102021207222A1 (ja) |
TW (1) | TW202205418A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022175736A (ja) * | 2021-05-14 | 2022-11-25 | 株式会社ディスコ | 被加工物の研削方法 |
DE102021213524A1 (de) | 2021-11-30 | 2023-06-01 | Disco Corporation | Schleifverfahren für ein werkstück und schleifvorrichtung |
WO2024127679A1 (ja) * | 2022-12-17 | 2024-06-20 | 株式会社ディスコ | 半導体部材加工砥石、半導体部材加工工具、半導体製造装置、および半導体部材加工砥石の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070287363A1 (en) | 2006-06-07 | 2007-12-13 | Texas Instruments Incorporated | Apparatus for Grinding a Wafer |
JP2009246098A (ja) | 2008-03-31 | 2009-10-22 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2012016770A (ja) | 2010-07-07 | 2012-01-26 | Disco Corp | 研削方法および研削装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG119140A1 (en) * | 2001-07-04 | 2006-02-28 | Disco Corp | Grinding wheel |
JP4464113B2 (ja) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
JP5073962B2 (ja) * | 2006-05-12 | 2012-11-14 | 株式会社ディスコ | ウエーハの加工方法 |
JP4986568B2 (ja) * | 2006-10-11 | 2012-07-25 | 株式会社ディスコ | ウエーハの研削加工方法 |
US7892072B2 (en) * | 2007-09-10 | 2011-02-22 | Stats Chippac, Ltd. | Method for directional grinding on backside of a semiconductor wafer |
JP5276823B2 (ja) | 2007-10-04 | 2013-08-28 | 株式会社ディスコ | ウェーハの研削加工装置 |
JP5996260B2 (ja) * | 2012-05-09 | 2016-09-21 | 株式会社ディスコ | 被加工物の分割方法 |
JP2017056522A (ja) * | 2015-09-17 | 2017-03-23 | 株式会社ディスコ | 研削ホイール及び研削方法 |
JP2022160807A (ja) * | 2021-04-07 | 2022-10-20 | 株式会社ディスコ | 被加工物の加工方法 |
JP2022168925A (ja) * | 2021-04-27 | 2022-11-09 | 株式会社ディスコ | 研削方法 |
-
2020
- 2020-07-16 JP JP2020121899A patent/JP7497117B2/ja active Active
-
2021
- 2021-06-15 US US17/347,765 patent/US11590630B2/en active Active
- 2021-06-16 KR KR1020210077751A patent/KR20220009869A/ko active Search and Examination
- 2021-07-07 TW TW110125005A patent/TW202205418A/zh unknown
- 2021-07-08 DE DE102021207222.4A patent/DE102021207222A1/de active Pending
- 2021-07-12 CN CN202110783497.9A patent/CN113941934A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070287363A1 (en) | 2006-06-07 | 2007-12-13 | Texas Instruments Incorporated | Apparatus for Grinding a Wafer |
JP2009246098A (ja) | 2008-03-31 | 2009-10-22 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2012016770A (ja) | 2010-07-07 | 2012-01-26 | Disco Corp | 研削方法および研削装置 |
Also Published As
Publication number | Publication date |
---|---|
CN113941934A (zh) | 2022-01-18 |
KR20220009869A (ko) | 2022-01-25 |
TW202205418A (zh) | 2022-02-01 |
US11590630B2 (en) | 2023-02-28 |
DE102021207222A1 (de) | 2022-01-20 |
JP2022018650A (ja) | 2022-01-27 |
US20220016741A1 (en) | 2022-01-20 |
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