SG117444A1 - Conductive polishing article for electrochemical mechanical polishing - Google Patents
Conductive polishing article for electrochemical mechanical polishingInfo
- Publication number
- SG117444A1 SG117444A1 SG200302562A SG200302562A SG117444A1 SG 117444 A1 SG117444 A1 SG 117444A1 SG 200302562 A SG200302562 A SG 200302562A SG 200302562 A SG200302562 A SG 200302562A SG 117444 A1 SG117444 A1 SG 117444A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- conductive
- article
- substrate
- electrochemical mechanical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/140,010 US6979248B2 (en) | 2002-05-07 | 2002-05-07 | Conductive polishing article for electrochemical mechanical polishing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG117444A1 true SG117444A1 (en) | 2005-12-29 |
Family
ID=29249779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200302562A SG117444A1 (en) | 2002-05-07 | 2003-05-06 | Conductive polishing article for electrochemical mechanical polishing |
Country Status (9)
Country | Link |
---|---|
US (1) | US6979248B2 (de) |
EP (1) | EP1361023B1 (de) |
JP (2) | JP2004134732A (de) |
KR (3) | KR200321046Y1 (de) |
CN (3) | CN2751972Y (de) |
AT (1) | ATE322959T1 (de) |
DE (1) | DE60304505T2 (de) |
SG (1) | SG117444A1 (de) |
TW (3) | TWI274386B (de) |
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US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
US7344432B2 (en) * | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
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JP2004181584A (ja) * | 2002-12-04 | 2004-07-02 | Showa Denko Kk | 研磨用複合材料及び砥石、研削材料、研磨材料並びに電子部品の加工方法及びシリコンの加工方法 |
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DE102004028658A1 (de) * | 2004-06-15 | 2006-01-05 | Albert-Ludwigs-Universität Freiburg, vertreten durch den Rektor | Komposit-Werkzeugelektrode für die elektrochemische Materialbearbeitung und Verfahren zu deren Herstellung |
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TW201417195A (zh) * | 2012-10-23 | 2014-05-01 | Wecon Automation Corp | 圓形式晶粒置放方法 |
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US9914197B2 (en) | 2013-12-09 | 2018-03-13 | Saint-Gobain Abrasives, Inc. | Abrasive assembly having alignment elements |
US9914199B2 (en) * | 2013-12-09 | 2018-03-13 | Saint-Gobain Abrasives, Inc. | Abrasive disc |
CN104894634A (zh) * | 2014-03-03 | 2015-09-09 | 盛美半导体设备(上海)有限公司 | 新型电化学抛光装置 |
CN105619965A (zh) * | 2014-11-28 | 2016-06-01 | 苏州力合光电薄膜科技有限公司 | 自润滑薄膜结构及其制造方法和应用 |
ES2604830B1 (es) * | 2016-04-28 | 2017-12-18 | Drylyte, S.L. | Proceso para alisado y pulido de metales por transporte iónico mediante cuerpos sólidos libres, y cuerpos sólidos para llevar a cabo dicho proceso. |
KR102142197B1 (ko) * | 2018-12-28 | 2020-09-14 | 임교순 | 필름 연결형 누설 감지 커넥터 |
CN116003726A (zh) * | 2022-11-09 | 2023-04-25 | 合肥宏光研磨科技有限公司 | 碳纳米管改性聚氨酯抛光衬垫材料及其制备方法 |
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- 2002-05-07 US US10/140,010 patent/US6979248B2/en not_active Expired - Fee Related
-
2003
- 2003-05-02 EP EP03252801A patent/EP1361023B1/de not_active Expired - Lifetime
- 2003-05-02 AT AT03252801T patent/ATE322959T1/de not_active IP Right Cessation
- 2003-05-02 DE DE60304505T patent/DE60304505T2/de not_active Expired - Lifetime
- 2003-05-06 SG SG200302562A patent/SG117444A1/en unknown
- 2003-05-07 CN CNU032575270U patent/CN2751972Y/zh not_active Expired - Fee Related
- 2003-05-07 TW TW092112489A patent/TWI274386B/zh not_active IP Right Cessation
- 2003-05-07 CN CNU032575262U patent/CN2737501Y/zh not_active Expired - Fee Related
- 2003-05-07 KR KR20-2003-0014154U patent/KR200321046Y1/ko not_active IP Right Cessation
- 2003-05-07 TW TW092208363U patent/TW592164U/zh not_active IP Right Cessation
- 2003-05-07 CN CNB031234178A patent/CN100413032C/zh not_active Expired - Fee Related
- 2003-05-07 JP JP2003129443A patent/JP2004134732A/ja not_active Withdrawn
- 2003-05-07 TW TW092208365U patent/TW578641U/zh not_active IP Right Cessation
- 2003-05-07 KR KR20-2003-0014153U patent/KR200331228Y1/ko not_active IP Right Cessation
- 2003-05-07 KR KR10-2003-0028979A patent/KR20030087569A/ko not_active Application Discontinuation
- 2003-10-10 JP JP2003271742U patent/JP3100987U/ja not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
TW578641U (en) | 2004-03-01 |
ATE322959T1 (de) | 2006-04-15 |
TW592164U (en) | 2004-06-11 |
TWI274386B (en) | 2007-02-21 |
DE60304505D1 (de) | 2006-05-24 |
US20030209448A1 (en) | 2003-11-13 |
EP1361023A2 (de) | 2003-11-12 |
JP2004134732A (ja) | 2004-04-30 |
EP1361023A3 (de) | 2004-04-07 |
KR200331228Y1 (ko) | 2003-10-23 |
DE60304505T2 (de) | 2006-09-07 |
EP1361023B1 (de) | 2006-04-12 |
CN100413032C (zh) | 2008-08-20 |
CN2751972Y (zh) | 2006-01-18 |
KR20030087569A (ko) | 2003-11-14 |
JP3100987U (ja) | 2004-06-03 |
CN1458671A (zh) | 2003-11-26 |
KR200321046Y1 (ko) | 2003-07-25 |
CN2737501Y (zh) | 2005-11-02 |
US6979248B2 (en) | 2005-12-27 |
TW200402100A (en) | 2004-02-01 |
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