EP1361023A3 - Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten - Google Patents

Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten Download PDF

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Publication number
EP1361023A3
EP1361023A3 EP03252801A EP03252801A EP1361023A3 EP 1361023 A3 EP1361023 A3 EP 1361023A3 EP 03252801 A EP03252801 A EP 03252801A EP 03252801 A EP03252801 A EP 03252801A EP 1361023 A3 EP1361023 A3 EP 1361023A3
Authority
EP
European Patent Office
Prior art keywords
polishing
conductive
article
substrate
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03252801A
Other languages
English (en)
French (fr)
Other versions
EP1361023A2 (de
EP1361023B1 (de
Inventor
Yongqi Hu
Yan Wang
Alain Duboust
Feng Q. Liu
Rashid Mavliev
Liang-Yuh Chen
Ratson Morad
Sasson Somekh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP1361023A2 publication Critical patent/EP1361023A2/de
Publication of EP1361023A3 publication Critical patent/EP1361023A3/de
Application granted granted Critical
Publication of EP1361023B1 publication Critical patent/EP1361023B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electroplating Methods And Accessories (AREA)
EP03252801A 2002-05-07 2003-05-02 Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten Expired - Lifetime EP1361023B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US140010 1987-12-31
US10/140,010 US6979248B2 (en) 2002-05-07 2002-05-07 Conductive polishing article for electrochemical mechanical polishing

Publications (3)

Publication Number Publication Date
EP1361023A2 EP1361023A2 (de) 2003-11-12
EP1361023A3 true EP1361023A3 (de) 2004-04-07
EP1361023B1 EP1361023B1 (de) 2006-04-12

Family

ID=29249779

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03252801A Expired - Lifetime EP1361023B1 (de) 2002-05-07 2003-05-02 Polierartikel zum elektrochemisch-mechanischen Polieren von Substraten

Country Status (9)

Country Link
US (1) US6979248B2 (de)
EP (1) EP1361023B1 (de)
JP (2) JP2004134732A (de)
KR (3) KR200321046Y1 (de)
CN (3) CN2751972Y (de)
AT (1) ATE322959T1 (de)
DE (1) DE60304505T2 (de)
SG (1) SG117444A1 (de)
TW (3) TWI274386B (de)

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US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US6783657B2 (en) * 2002-08-29 2004-08-31 Micron Technology, Inc. Systems and methods for the electrolytic removal of metals from substrates
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DE602004008880T2 (de) * 2003-02-18 2008-06-26 Parker-Hannifin Corp., Cleveland Polierartikel für elektro-chemisches-mechanisches polieren
US7842169B2 (en) * 2003-03-04 2010-11-30 Applied Materials, Inc. Method and apparatus for local polishing control
WO2004108358A2 (en) * 2003-06-06 2004-12-16 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6848977B1 (en) * 2003-08-29 2005-02-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad for electrochemical mechanical polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US8066552B2 (en) 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7128821B2 (en) * 2004-01-20 2006-10-31 Taiwan Semiconductor Manufacturing Co., Ltd. Electropolishing method for removing particles from wafer surface
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US7618529B2 (en) * 2004-05-25 2009-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad for electrochemical mechanical polishing
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ATE322959T1 (de) 2006-04-15
TW592164U (en) 2004-06-11
TWI274386B (en) 2007-02-21
DE60304505D1 (de) 2006-05-24
US20030209448A1 (en) 2003-11-13
EP1361023A2 (de) 2003-11-12
JP2004134732A (ja) 2004-04-30
KR200331228Y1 (ko) 2003-10-23
DE60304505T2 (de) 2006-09-07
EP1361023B1 (de) 2006-04-12
CN100413032C (zh) 2008-08-20
CN2751972Y (zh) 2006-01-18
KR20030087569A (ko) 2003-11-14
JP3100987U (ja) 2004-06-03
SG117444A1 (en) 2005-12-29
CN1458671A (zh) 2003-11-26
KR200321046Y1 (ko) 2003-07-25
CN2737501Y (zh) 2005-11-02
US6979248B2 (en) 2005-12-27
TW200402100A (en) 2004-02-01

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