NL69965C - - Google Patents

Info

Publication number
NL69965C
NL69965C NL69965DA NL69965C NL 69965 C NL69965 C NL 69965C NL 69965D A NL69965D A NL 69965DA NL 69965 C NL69965 C NL 69965C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL69965C publication Critical patent/NL69965C/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18Electroplating using modulated, pulsed or reversing current
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00Chemistry: electrical and wave energy
    • Y10S204/09Wave forms
NL69965D 1945-08-10 NL69965C (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US610107A US2451341A (en) 1945-08-10 1945-08-10 Electroplating

Publications (1)

Publication Number Publication Date
NL69965C true NL69965C (de)

Family

ID=24443683

Family Applications (1)

Application Number Title Priority Date Filing Date
NL69965D NL69965C (de) 1945-08-10

Country Status (6)

Country Link
US (1) US2451341A (de)
CH (1) CH272268A (de)
DE (1) DE947657C (de)
FR (1) FR950361A (de)
GB (1) GB630165A (de)
NL (1) NL69965C (de)

Families Citing this family (68)

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US2485258A (en) * 1944-01-03 1949-10-18 Standard Oil Dev Co Electrodepositing lead on copper from a nitrate bath
US2513859A (en) * 1945-09-12 1950-07-04 Crown Cork & Seal Co Method of electroplating of tin on ferrous strip
US2524912A (en) * 1945-09-29 1950-10-10 Westinghouse Electric Corp Process of electrodepositing copper, silver, or brass
US2575712A (en) * 1945-09-29 1951-11-20 Westinghouse Electric Corp Electroplating
US2592614A (en) * 1946-01-08 1952-04-15 Champion Paper & Fibre Co Method of making tubular metallic wave guides
US2635075A (en) * 1948-02-28 1953-04-14 Knapp Monarch Co Plating process
NL71231C (de) * 1948-04-22
NL71719C (de) * 1948-05-01
US2508727A (en) * 1948-07-31 1950-05-23 Shottenfeld Richard Generator polarity control
DE851526C (de) * 1948-10-01 1952-10-06 Siemens Ag Verfahren zur Herstellung von Kupferoxydul-Trockengleichrichtern
US2597082A (en) * 1948-11-02 1952-05-20 Westinghouse Electric Corp Reverse plating timer
US2696466A (en) * 1949-10-14 1954-12-07 Jr John F Beaver Method of electroplating
US2678909A (en) * 1949-11-05 1954-05-18 Westinghouse Electric Corp Process of electrodeposition of metals by periodic reverse current
US2685053A (en) * 1950-06-03 1954-07-27 Samuel D Warren Electrolytic capacitor system
US2686859A (en) * 1950-10-11 1954-08-17 Western Electric Co Electroplating
US2700019A (en) * 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US2701234A (en) * 1951-07-11 1955-02-01 Du Pont Addition agent for copper plating
US2860090A (en) * 1952-02-29 1958-11-11 Paul S Roller Electrolytic generation of metal hydroxide
GB741864A (en) * 1952-06-04 1955-12-14 Silvercrown Ltd Improvements in the electrodeposition of alloys containing copper and tin
US2737485A (en) * 1952-09-22 1956-03-06 Gen Motors Corp Electrodeposition of copper
US2820750A (en) * 1953-03-25 1958-01-21 Charlesworth Percy Allan Electrolytic treatment of metals and alloys
NL187117B (nl) * 1953-04-28 Sumitomo Chemical Co Werkwijze voor de bereiding van alkeenpolymeren, alsmede gevormd voortbrengsel, geheel of ten dele vervaardigd met toepassing daarvan.
US2799636A (en) * 1954-03-03 1957-07-16 Coats & Clark Processing of separable fastener stringers
US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
US2726203A (en) * 1955-06-06 1955-12-06 Robotron Corp High voltage electro-plating method
US2726202A (en) * 1955-06-06 1955-12-06 Robotron Corp Method for plating by condenser discharge
US2791553A (en) * 1956-02-15 1957-05-07 Gen Electric Method of electroplating aluminum
US2951978A (en) * 1957-05-29 1960-09-06 Thor P Ulvestad Reverse pulse generator
US2905603A (en) * 1957-09-04 1959-09-22 American Zinc Inst Zinc plating
DE1166583B (de) * 1958-02-20 1964-03-26 Continental Oil Co Anwendung des Verfahrens zur galvanischen Abscheidung von Metallueberzuegen mittels periodisch wechselndem Umkehrstrom auf die elektrolytische Erzeugung einer Ferrioxidschicht auf Eisen
US3018232A (en) * 1958-06-05 1962-01-23 Westinghouse Electric Corp Addition agent for cyanide plating baths
NL239247A (de) * 1958-11-03
US3232854A (en) * 1959-06-05 1966-02-01 Diamond Alkali Co Chromium plating
US3056733A (en) * 1960-04-23 1962-10-02 Degussa Process for electrolytic deposition of gold-copper-cadmium alloys
US3135671A (en) * 1960-12-01 1964-06-02 Rockwell Standard Co Electrolytic treatment of articles
US3234112A (en) * 1961-03-21 1966-02-08 Nalco Chemical Co Process of producing organic lead compounds
US3407125A (en) * 1965-01-18 1968-10-22 Corning Glass Works Method of making filamentary metal structures
US3549505A (en) * 1967-01-09 1970-12-22 Helmut G Hanusa Reticular structures and methods of producing same
US3755113A (en) * 1971-10-20 1973-08-28 Niizm Method for electrorefining of nickel
JPS5249984A (en) * 1975-10-20 1977-04-21 Agency Of Ind Science & Technol Electrolytic treating method of waste fixed solution
US4140596A (en) * 1975-12-22 1979-02-20 Vereinigte Metallwerke Ranshofen-Berndorf Aktiengesellschaft Process for the electrolytic refining of copper
US4257853A (en) * 1978-10-06 1981-03-24 Bunker Ramo Corporation Metal plating process
US4396467A (en) * 1980-10-27 1983-08-02 General Electric Company Periodic reverse current pulsing to form uniformly sized feed through conductors
US4514265A (en) * 1984-07-05 1985-04-30 Rca Corporation Bonding pads for semiconductor devices
US4586989A (en) * 1985-05-07 1986-05-06 The Boeing Company Method of plating a conductive substrate surface with silver
CA1316482C (en) * 1986-06-30 1993-04-20 Yoshio Shindo Method for producing a zn-series electroplated steel sheet
JP2748767B2 (ja) * 1992-03-19 1998-05-13 松下電器産業株式会社 薄膜磁気ヘッド及びその製造方法
US5624626A (en) * 1995-06-07 1997-04-29 Walz; Thomas J. Method of treating a ceramic body to form a wettable surface
EP1052062A1 (de) 1999-05-03 2000-11-15 Applied Materials, Inc. Vorbehandlung eines fixierten Schleifmittels
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20070096315A1 (en) * 2005-11-01 2007-05-03 Applied Materials, Inc. Ball contact cover for copper loss reduction and spike reduction

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE225873C (de) *
US1215354A (en) * 1912-05-01 1917-02-13 American Bank Note Co Intaglio printing-plate and the method of making same.
US1260661A (en) * 1917-09-04 1918-03-26 British America Nickel Corp Ltd Method of recovering metals from alloys.
US1566265A (en) * 1922-01-11 1925-12-22 Antisell Frank Linden Process of producing electrolytic copper
US1565216A (en) * 1922-06-10 1925-12-08 William P Topping Electroplated stereotype plate or nickel-plated printing plate and process of making the same
US1527734A (en) * 1922-12-14 1925-02-24 Electrolytic Corp Apparatus and method for electrolytically depositing metals
US1534709A (en) * 1924-05-17 1925-04-21 Francis A Holt Method of conducting electrolytic operations
US1544451A (en) * 1924-07-05 1925-06-30 Electro Metallurg Co Electrodeposition of chromium
US1918605A (en) * 1928-01-09 1933-07-18 Parker Rust Proof Co Chromium plating
GB401933A (en) * 1933-02-21 1933-11-23 Henderik Van Der Horst A new or improved method of providing a hard wearing surface in the cylinder bores of internal combustion engines
DE603910C (de) * 1933-07-16 1934-10-11 Otto Kaltenbach Verfahren zur galvanischen Herstellung von Metallniederschlaegen
GB472514A (en) * 1936-04-14 1937-09-24 Harshaw Chem Corp Improvements relating to the electro-deposition of nickel
NL57383C (de) * 1938-09-03
DE748266C (de) * 1941-02-11 1944-10-31 Dr Max Hischmann Verfahren zur Erzeugung galvanischer Niederschlaege von Goldlegierungen

Also Published As

Publication number Publication date
DE947657C (de) 1956-08-23
GB630165A (en) 1949-10-06
CH272268A (de) 1950-12-15
US2451341A (en) 1948-10-12
FR950361A (fr) 1949-09-26

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