SG115576A1 - Lga package socket - Google Patents

Lga package socket

Info

Publication number
SG115576A1
SG115576A1 SG200306245A SG200306245A SG115576A1 SG 115576 A1 SG115576 A1 SG 115576A1 SG 200306245 A SG200306245 A SG 200306245A SG 200306245 A SG200306245 A SG 200306245A SG 115576 A1 SG115576 A1 SG 115576A1
Authority
SG
Singapore
Prior art keywords
lga package
package socket
socket
lga
package
Prior art date
Application number
SG200306245A
Other languages
English (en)
Inventor
Shirai Hiroshi
Inoue Masashi
Hashimoto Shinichi
Original Assignee
Tyco Electronics Amp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Amp Kk filed Critical Tyco Electronics Amp Kk
Publication of SG115576A1 publication Critical patent/SG115576A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/32Holders for supporting the complete device in operation, i.e. detachable fixtures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Switches With Compound Operations (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
SG200306245A 2002-10-31 2003-10-16 Lga package socket SG115576A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002317646 2002-10-31
JP2002379635A JP3950795B2 (ja) 2002-10-31 2002-12-27 Lgaパッケージ用ソケット

Publications (1)

Publication Number Publication Date
SG115576A1 true SG115576A1 (en) 2005-10-28

Family

ID=32095471

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200306245A SG115576A1 (en) 2002-10-31 2003-10-16 Lga package socket

Country Status (9)

Country Link
US (1) US7001197B2 (de)
EP (1) EP1416780B1 (de)
JP (1) JP3950795B2 (de)
KR (1) KR20040038752A (de)
CN (1) CN1508912B (de)
DE (1) DE60315237T2 (de)
MY (1) MY137890A (de)
SG (1) SG115576A1 (de)
TW (1) TWM244626U (de)

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TW555196U (en) * 2003-01-22 2003-09-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP2004327301A (ja) * 2003-04-25 2004-11-18 Tyco Electronics Amp Kk Icソケット用吸着キャップおよびそれを用いたicソケット組立体
US7280362B2 (en) * 2003-12-04 2007-10-09 Dell Products L.P. Method and apparatus for attaching a processor and corresponding heat sink to a circuit board
TWI279042B (en) * 2004-03-26 2007-04-11 Hon Hai Prec Ind Co Ltd Electrical connector
US7121843B2 (en) 2004-05-27 2006-10-17 Intel Corporation Integrated circuit socket corner relief
TWI260106B (en) * 2004-06-30 2006-08-11 Hon Hai Prec Ind Co Ltd Land grid array socket
JP2006210293A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 回路部品用ソケット及びその実装方法
US6957973B1 (en) 2005-02-09 2005-10-25 Hon Hai Precision Ind. Co., Ltd. Land grid array connector and method of assembling an IC chip therein
US7097464B1 (en) * 2005-02-09 2006-08-29 Hon Hai Precision Ind. Co., Ltd. LGA connector
JP2006253348A (ja) * 2005-03-10 2006-09-21 Tyco Electronics Amp Kk Icパッケージ、icソケットおよびicソケット組立体
US7425136B2 (en) * 2005-04-28 2008-09-16 Advanced Connection Technology, Inc. Electrical connector capable of dissipating heat generated by an electronic element
US7419383B2 (en) * 2005-09-29 2008-09-02 Intel Corporation Self-balanced dual L-shaped socket
CN200959469Y (zh) * 2006-09-08 2007-10-10 富士康(昆山)电脑接插件有限公司 电连接器
US20080081489A1 (en) * 2006-09-29 2008-04-03 Macgregor Mike G Reliable land grid array socket loading device
CN101192735A (zh) * 2006-11-24 2008-06-04 富士康(昆山)电脑接插件有限公司 电连接器
CN201029124Y (zh) * 2007-01-22 2008-02-27 富士康(昆山)电脑接插件有限公司 电连接器
US7497696B2 (en) * 2007-03-29 2009-03-03 Intel Corporation Socket for land grid array package
CN201130746Y (zh) * 2007-08-17 2008-10-08 富士康(昆山)电脑接插件有限公司 导电端子
CN201113135Y (zh) * 2007-10-23 2008-09-10 富士康(昆山)电脑接插件有限公司 电连接器组件
CN201178163Y (zh) * 2007-11-29 2009-01-07 富士康(昆山)电脑接插件有限公司 电连接器组件
CN201160188Y (zh) * 2007-12-21 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
CN201160141Y (zh) * 2007-12-21 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器组件
TWM341954U (en) * 2008-03-03 2008-10-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN201197040Y (zh) * 2008-03-11 2009-02-18 富士康(昆山)电脑接插件有限公司 电连接器组件
DE102008023640B4 (de) * 2008-05-15 2010-04-15 Tyco Electronics Amp Gmbh Prüfhalter für Mikrochip
TWM349615U (en) * 2008-06-16 2009-01-21 Hon Hai Prec Ind Co Ltd Electrical connector
TWM356303U (en) * 2008-06-16 2009-05-01 Hon Hai Prec Ind Co Ltd Electrical connector
CN201252192Y (zh) * 2008-08-04 2009-06-03 富士康(昆山)电脑接插件有限公司 电连接器组件
TWM351475U (en) 2008-08-11 2009-02-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7708571B2 (en) * 2008-08-15 2010-05-04 Hon Hai Precision Ind. Co., Ltd. Socket assembly with pick up cap
TWM352827U (en) * 2008-08-26 2009-03-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TWM356269U (en) * 2008-10-07 2009-05-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TWM356301U (en) * 2008-10-07 2009-05-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TW201015790A (en) * 2008-10-14 2010-04-16 Hon Hai Prec Ind Co Ltd Electrical connector
TWM359861U (en) * 2008-11-25 2009-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
US7794261B2 (en) * 2008-12-26 2010-09-14 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly having a rotatable clip-fastening mechanism
TWM361658U (en) * 2009-01-13 2009-07-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly and clip thereof
TWM364310U (en) * 2009-02-23 2009-09-01 Hon Hai Prec Ind Co Ltd Electrical connector
TWM365563U (en) * 2009-03-09 2009-09-21 Hon Hai Prec Ind Co Ltd Electrical connector
CN101924284A (zh) * 2009-06-16 2010-12-22 富士康(昆山)电脑接插件有限公司 电连接器及其端子及该电连接器的制造方法
TWM373039U (en) * 2009-07-17 2010-01-21 Hon Hai Prec Ind Co Ltd Electrical connector and contacts thereof
US8367942B2 (en) * 2009-10-27 2013-02-05 Hon Hai Precision Ind. Co., Ltd. Low profile electrical interposer of woven structure and method of making same
TWM380610U (en) * 2009-11-12 2010-05-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
JP5251840B2 (ja) * 2009-11-17 2013-07-31 住友電装株式会社 機器用コネクタ
US8938876B2 (en) * 2010-05-06 2015-01-27 Advanced Micro Devices, Inc. Method of mounting a circuit board
US8837162B2 (en) 2010-05-06 2014-09-16 Advanced Micro Devices, Inc. Circuit board socket with support structure
US8144469B2 (en) 2010-05-07 2012-03-27 Dell Products L.P. Processor loading system
US8279606B2 (en) 2010-05-07 2012-10-02 Dell Products L.P. Processor loading system including a heat dissipater
US7878838B1 (en) 2010-07-07 2011-02-01 International Business Machines Corporation Dual force single point actuation integrated load mechanism for securing a computer processor to a socket
US7963789B1 (en) 2010-07-07 2011-06-21 International Business Machines Corporation Dual force single point actuation integrated load mechanism for securing a computer processor to a socket
JP5719566B2 (ja) * 2010-11-04 2015-05-20 新光電気工業株式会社 Icパッケージ用放熱板及び放熱板を有するicパッケージの接続装置
TWM413232U (en) * 2010-12-03 2011-10-01 Hon Hai Prec Ind Co Ltd Electrical connector
TWM408851U (en) * 2010-12-16 2011-08-01 Hon Hai Prec Ind Co Ltd Electrical connector assembly
CN102651518A (zh) * 2011-02-24 2012-08-29 阿尔卑斯电气株式会社 电子零件用插座
CN103380550B (zh) * 2011-02-28 2015-11-25 惠普发展公司,有限责任合伙企业 弹簧加载盖
TWM444607U (zh) * 2012-06-25 2013-01-01 Hon Hai Prec Ind Co Ltd 電連接器組合及其固持裝置
TW201409860A (zh) 2012-08-27 2014-03-01 Hon Hai Prec Ind Co Ltd 電連接器組合
US8801440B2 (en) 2012-10-08 2014-08-12 Hon Hai Precision Industry Co., Ltd. Electrical connector with low profile
US8834192B2 (en) 2012-10-08 2014-09-16 Hon Hai Precision Industry Co., Ltd. Electrical connector with carrier frame loading electronic package
TW201417414A (zh) * 2012-10-16 2014-05-01 Hon Hai Prec Ind Co Ltd 電連接器組合及其壓接裝置
TW201419672A (zh) 2012-11-14 2014-05-16 Hon Hai Prec Ind Co Ltd 電連接器及其組裝方法
CN103904485B (zh) * 2012-12-28 2016-02-03 富士康(昆山)电脑接插件有限公司 电连接器
US8944854B2 (en) 2013-02-02 2015-02-03 Hon Hai Precision Industry Co., Ltd. Electrical connector with low profile
TWM464847U (zh) 2013-05-07 2013-11-01 Hon Hai Prec Ind Co Ltd 電連接器組合
US9577357B2 (en) * 2015-05-29 2017-02-21 Lotes Co., Ltd Electrical connector with a carrier and terminals located at different distances from side walls
US9793634B2 (en) 2016-03-04 2017-10-17 International Business Machines Corporation Electrical contact assembly for printed circuit boards
CN207781966U (zh) 2018-01-15 2018-08-28 富士康(昆山)电脑接插件有限公司 电连接器组件及其夹持件
JP7233198B2 (ja) 2018-11-07 2023-03-06 株式会社エンプラス コンタクトユニット用フレーム及びソケット

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310350A (en) * 1991-03-27 1994-05-10 Yamaichi Electric Co., Ltd. Connector
US6191480B1 (en) * 1999-09-07 2001-02-20 International Business Machines Corporation Universal land grid array socket engagement mechanism
US6449157B1 (en) * 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism

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JPH0286090A (ja) 1988-09-21 1990-03-27 Isamu Hanada 高周波誘導加熱装置
US5074798A (en) * 1989-10-24 1991-12-24 Wells Electronics, Inc. Modular socket for an integrated circuit
US5387120A (en) * 1993-02-19 1995-02-07 Wells Electronics, Inc. Latching IC connector
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US6086387A (en) * 1998-05-14 2000-07-11 International Business Machines Corporation Cover assembly for a socket adaptable to IC modules of varying thickness used for burn-in testing
JP3066586B2 (ja) * 1998-12-05 2000-07-17 モレックス インコーポレーテッド ピングリッドアレイパッケージ用ソケット
US6280222B1 (en) * 2000-07-25 2001-08-28 Hon Hai Precision Ind. Co., Ltd. LGA socket with reliable securing mechanism
TW532713U (en) * 2002-06-13 2003-05-11 Hon Hai Prec Ind Co Ltd Retainer device
US6735085B2 (en) * 2002-08-15 2004-05-11 Hon Hai Precision Ind. Co., Ltd. Foldable retention device for land grid array connector assembly
CN2567819Y (zh) * 2002-09-04 2003-08-20 富士康(昆山)电脑接插件有限公司 电连接器组件
CN2588571Y (zh) * 2002-12-12 2003-11-26 富士康(昆山)电脑接插件有限公司 电连接器
CN2599802Y (zh) * 2002-12-20 2004-01-14 富士康(昆山)电脑接插件有限公司 电连接器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310350A (en) * 1991-03-27 1994-05-10 Yamaichi Electric Co., Ltd. Connector
US6191480B1 (en) * 1999-09-07 2001-02-20 International Business Machines Corporation Universal land grid array socket engagement mechanism
US6449157B1 (en) * 2001-10-03 2002-09-10 Ho Kang Chu IC package assembly with retention mechanism

Also Published As

Publication number Publication date
KR20040038752A (ko) 2004-05-08
CN1508912B (zh) 2010-06-16
JP3950795B2 (ja) 2007-08-01
US20040095693A1 (en) 2004-05-20
CN1508912A (zh) 2004-06-30
MY137890A (en) 2009-03-31
EP1416780B1 (de) 2007-08-01
EP1416780A3 (de) 2005-03-09
EP1416780A2 (de) 2004-05-06
DE60315237T2 (de) 2008-04-17
DE60315237D1 (de) 2007-09-13
JP2004207184A (ja) 2004-07-22
US7001197B2 (en) 2006-02-21
TWM244626U (en) 2004-09-21

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