SG115319A1 - System and method for reinforcing a bond pad - Google Patents

System and method for reinforcing a bond pad

Info

Publication number
SG115319A1
SG115319A1 SG9800899A SG1998000899A SG115319A1 SG 115319 A1 SG115319 A1 SG 115319A1 SG 9800899 A SG9800899 A SG 9800899A SG 1998000899 A SG1998000899 A SG 1998000899A SG 115319 A1 SG115319 A1 SG 115319A1
Authority
SG
Singapore
Prior art keywords
reinforcing
bond pad
bond
pad
Prior art date
Application number
SG9800899A
Other languages
English (en)
Inventor
Saran Mukil
A Martin Charles
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of SG115319A1 publication Critical patent/SG115319A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05075—Plural internal layers
    • H01L2224/0508—Plural internal layers being stacked
    • H01L2224/05085—Plural internal layers being stacked with additional elements, e.g. vias arrays, interposed between the stacked layers
    • H01L2224/05089—Disposition of the additional element
    • H01L2224/05093—Disposition of the additional element of a plurality of vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05617—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/05624—Aluminium [Al] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48617—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
    • H01L2224/48624—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48699—Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
    • H01L2224/487—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48717—Principal constituent of the connecting portion of the wire connector being Aluminium (Al) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
    • H01L2224/48724—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24529—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface and conforming component on an opposite nonplanar surface
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
    • Y10T428/24545—Containing metal or metal compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
SG9800899A 1997-05-01 1998-04-30 System and method for reinforcing a bond pad SG115319A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/847,239 US6143396A (en) 1997-05-01 1997-05-01 System and method for reinforcing a bond pad

Publications (1)

Publication Number Publication Date
SG115319A1 true SG115319A1 (en) 2005-10-28

Family

ID=25300153

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800899A SG115319A1 (en) 1997-05-01 1998-04-30 System and method for reinforcing a bond pad

Country Status (7)

Country Link
US (2) US6143396A (fr)
EP (1) EP0875934B1 (fr)
JP (1) JPH1154544A (fr)
KR (1) KR100567298B1 (fr)
DE (1) DE69838695T2 (fr)
SG (1) SG115319A1 (fr)
TW (1) TW370710B (fr)

Families Citing this family (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999038204A1 (fr) * 1998-01-23 1999-07-29 Rohm Co., Ltd. Interconnexion damasquinee et dispositif a semi-conducteur
US6232662B1 (en) * 1998-07-14 2001-05-15 Texas Instruments Incorporated System and method for bonding over active integrated circuits
US6037668A (en) * 1998-11-13 2000-03-14 Motorola, Inc. Integrated circuit having a support structure
US8021976B2 (en) 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US6191023B1 (en) * 1999-11-18 2001-02-20 Taiwan Semiconductor Manufacturing Company Method of improving copper pad adhesion
US6198170B1 (en) 1999-12-16 2001-03-06 Conexant Systems, Inc. Bonding pad and support structure and method for their fabrication
KR100358567B1 (ko) * 1999-12-28 2002-10-25 주식회사 하이닉스반도체 반도체소자의 제조방법
KR100324341B1 (ko) * 2000-02-15 2002-02-16 박종섭 반도체 장치의 패드 형성방법
US6495917B1 (en) * 2000-03-17 2002-12-17 International Business Machines Corporation Method and structure of column interconnect
WO2001078145A2 (fr) * 2000-04-12 2001-10-18 Koninklijke Philips Electronics N.V. Dispositif semi-conducteur
KR100388220B1 (ko) * 2000-10-17 2003-06-19 주식회사 하이닉스반도체 반도체장치의 패드부 구조
US6552433B1 (en) * 2001-05-17 2003-04-22 Taiwan Semiconductor Manufacturing Company Bond pads using mesh pattern via structures for protecting devices/circuits under I/O pads
FR2824954A1 (fr) * 2001-05-18 2002-11-22 St Microelectronics Sa Plot de connexion d'un circuit integre
US20020195723A1 (en) * 2001-06-25 2002-12-26 Daniel Collette Bond pad structure
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
SG117395A1 (en) 2001-08-29 2005-12-29 Micron Technology Inc Wire bonded microelectronic device assemblies and methods of manufacturing same
US6864166B1 (en) 2001-08-29 2005-03-08 Micron Technology, Inc. Method of manufacturing wire bonded microelectronic device assemblies
US6678950B1 (en) * 2001-11-01 2004-01-20 Lsi Logic Corporation Method for forming a bonding pad on a substrate
US20030127716A1 (en) * 2002-01-09 2003-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Single layer wiring bond pad with optimum AL film thickness in Cu/FSG process for devices under pads
KR100416614B1 (ko) * 2002-03-20 2004-02-05 삼성전자주식회사 본딩패드 하부구조를 보강하기 위한 반도체 소자 및 그제조방법
TW539621B (en) * 2002-04-03 2003-07-01 Benq Corp Ink jet printer with independent driving circuit for preheat and heat maintance
US6784556B2 (en) * 2002-04-19 2004-08-31 Kulicke & Soffa Investments, Inc. Design of interconnection pads with separated probing and wire bonding regions
US6909196B2 (en) * 2002-06-21 2005-06-21 Micron Technology, Inc. Method and structures for reduced parasitic capacitance in integrated circuit metallizations
JP2004095916A (ja) * 2002-08-30 2004-03-25 Fujitsu Ltd 半導体装置及びその製造方法
US7692315B2 (en) * 2002-08-30 2010-04-06 Fujitsu Microelectronics Limited Semiconductor device and method for manufacturing the same
US6908841B2 (en) * 2002-09-20 2005-06-21 Infineon Technologies Ag Support structures for wirebond regions of contact pads over low modulus materials
US7288845B2 (en) * 2002-10-15 2007-10-30 Marvell Semiconductor, Inc. Fabrication of wire bond pads over underlying active devices, passive devices and/or dielectric layers in integrated circuits
KR100448344B1 (ko) * 2002-10-22 2004-09-13 삼성전자주식회사 웨이퍼 레벨 칩 스케일 패키지 제조 방법
JP4170103B2 (ja) * 2003-01-30 2008-10-22 Ｎｅｃエレクトロニクス株式会社 半導体装置、および半導体装置の製造方法
US6963138B2 (en) * 2003-02-03 2005-11-08 Lsi Logic Corporation Dielectric stack
US6864578B2 (en) * 2003-04-03 2005-03-08 International Business Machines Corporation Internally reinforced bond pads
US6982493B2 (en) 2003-04-03 2006-01-03 International Business Machines Corporation Wedgebond pads having a nonplanar surface structure
US6798035B1 (en) * 2003-06-20 2004-09-28 Lsi Logic Corporation Bonding pad for low k dielectric
JP2005085939A (ja) * 2003-09-08 2005-03-31 Renesas Technology Corp 半導体装置およびその製造方法
JP4579621B2 (ja) * 2003-09-26 2010-11-10 パナソニック株式会社 半導体装置
CN1601735B (zh) * 2003-09-26 2010-06-23 松下电器产业株式会社 半导体器件及其制造方法
US6960836B2 (en) * 2003-09-30 2005-11-01 Agere Systems, Inc. Reinforced bond pad
US7067902B2 (en) * 2003-12-02 2006-06-27 International Business Machines Corporation Building metal pillars in a chip for structure support
WO2005057654A2 (fr) * 2003-12-10 2005-06-23 Philips Intellectual Property & Standards Gmbh Composant semi-conducteur a connexion par fils ayant une metallisation renforcee de connexion interne
CN100466236C (zh) * 2003-12-29 2009-03-04 旺宏电子股份有限公司 半导体元件的结构
JP4938983B2 (ja) * 2004-01-22 2012-05-23 川崎マイクロエレクトロニクス株式会社 半導体集積回路
US7629689B2 (en) * 2004-01-22 2009-12-08 Kawasaki Microelectronics, Inc. Semiconductor integrated circuit having connection pads over active elements
JP4913329B2 (ja) * 2004-02-09 2012-04-11 ルネサスエレクトロニクス株式会社 半導体装置
JP2007019128A (ja) * 2005-07-06 2007-01-25 Sony Corp 半導体装置
JP4957013B2 (ja) * 2006-02-24 2012-06-20 凸版印刷株式会社 半導体素子搭載用基板
DE102006046182B4 (de) * 2006-09-29 2010-11-11 Infineon Technologies Ag Halbleiterelement mit einer Stützstruktur sowie Herstellungsverfahren
US7791199B2 (en) * 2006-11-22 2010-09-07 Tessera, Inc. Packaged semiconductor chips
US8569876B2 (en) 2006-11-22 2013-10-29 Tessera, Inc. Packaged semiconductor chips with array
CN101675516B (zh) * 2007-03-05 2012-06-20 数字光学欧洲有限公司 具有通过过孔连接到前侧触头的后侧触头的芯片
DE102007011126B4 (de) 2007-03-07 2009-08-27 Austriamicrosystems Ag Halbleiterbauelement mit Anschlusskontaktfläche
JP2008258258A (ja) * 2007-04-02 2008-10-23 Sanyo Electric Co Ltd 半導体装置
US8183151B2 (en) 2007-05-04 2012-05-22 Micron Technology, Inc. Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom
JP4522435B2 (ja) * 2007-06-05 2010-08-11 富士通テン株式会社 高周波回路装置、及びレーダ装置
US7919839B2 (en) * 2007-07-24 2011-04-05 Northrop Grumman Systems Corporation Support structures for on-wafer testing of wafer-level packages and multiple wafer stacked structures
KR20100039425A (ko) 2007-07-26 2010-04-15 엔엑스피 비 브이 보강 구조체, 반도체 소자, 조립체, 오디오 회로, 전자 장치 및 보강 구조체 제조 방법
CN101765913B (zh) 2007-07-30 2012-10-03 Nxp股份有限公司 底部粗糙度减小的半导体部件的应力缓冲元件
KR101538648B1 (ko) 2007-07-31 2015-07-22 인벤사스 코포레이션 실리콘 쓰루 비아를 사용하는 반도체 패키지 공정
US20090079082A1 (en) * 2007-09-24 2009-03-26 Yong Liu Bonding pad structure allowing wire bonding over an active area in a semiconductor die and method of manufacturing same
FR2925980B1 (fr) * 2007-12-28 2010-06-04 St Microelectronics Sa Plot de contact electrique
JP4701264B2 (ja) * 2008-04-18 2011-06-15 ルネサスエレクトロニクス株式会社 半導体装置、および半導体装置の製造方法
KR20100060309A (ko) * 2008-11-27 2010-06-07 주식회사 동부하이텍 반도체 소자
JP5452064B2 (ja) * 2009-04-16 2014-03-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置
FR2956927B1 (fr) * 2010-02-26 2012-04-20 Thales Sa Membrane reflechissante deformable pour reflecteur reconfigurable, reflecteur d'antenne reconfigurable et antenne comportant une telle membrane
DE102011107349B4 (de) 2010-06-30 2016-05-12 Micronas Gmbh Bondkontaktstelle auf einem Halbleitersubstrat
US8791575B2 (en) 2010-07-23 2014-07-29 Tessera, Inc. Microelectronic elements having metallic pads overlying vias
US9640437B2 (en) 2010-07-23 2017-05-02 Tessera, Inc. Methods of forming semiconductor elements using micro-abrasive particle stream
US8796135B2 (en) 2010-07-23 2014-08-05 Tessera, Inc. Microelectronic elements with rear contacts connected with via first or via middle structures
US8610259B2 (en) 2010-09-17 2013-12-17 Tessera, Inc. Multi-function and shielded 3D interconnects
US8847380B2 (en) 2010-09-17 2014-09-30 Tessera, Inc. Staged via formation from both sides of chip
KR101059490B1 (ko) * 2010-11-15 2011-08-25 테세라 리써치 엘엘씨 임베드된 트레이스에 의해 구성된 전도성 패드
US8637968B2 (en) 2010-12-02 2014-01-28 Tessera, Inc. Stacked microelectronic assembly having interposer connecting active chips
US8736066B2 (en) 2010-12-02 2014-05-27 Tessera, Inc. Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
US8587126B2 (en) 2010-12-02 2013-11-19 Tessera, Inc. Stacked microelectronic assembly with TSVs formed in stages with plural active chips
US8610264B2 (en) 2010-12-08 2013-12-17 Tessera, Inc. Compliant interconnects in wafers
JP6042347B2 (ja) 2011-01-28 2016-12-14 クレーン アンド カンパニー インコーポレイテッド レーザマーキングされたデバイス
US8802554B2 (en) * 2011-02-15 2014-08-12 Marvell World Trade Ltd. Patterns of passivation material on bond pads and methods of manufacture thereof
CN103765248A (zh) 2011-06-28 2014-04-30 光学物理有限责任公司 低卷曲或无卷曲的光学膜/纸层压材料
US9064707B2 (en) 2011-09-14 2015-06-23 Micronas Gmbh Bonding contact area on a semiconductor substrate
WO2013048875A1 (fr) 2011-09-26 2013-04-04 Technical Graphics, Inc. Procédé pour produire un film composite et dispositifs de sécurité préparés à partir du film composite
JP5926988B2 (ja) * 2012-03-08 2016-05-25 ルネサスエレクトロニクス株式会社 半導体装置
WO2013188518A1 (fr) 2012-06-13 2013-12-19 Visual Physics, Llc Matériau micro-optique plus résistant à l'abrasion
US9768221B2 (en) * 2013-06-27 2017-09-19 Taiwan Semiconductor Manufacturing Company, Ltd. Pad structure layout for semiconductor device
US10804153B2 (en) 2014-06-16 2020-10-13 STATS ChipPAC Pte. Ltd. Semiconductor device and method to minimize stress on stack via
US9768134B2 (en) 2015-01-29 2017-09-19 Micron Technology, Inc. Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
US10896888B2 (en) 2018-03-15 2021-01-19 Microchip Technology Incorporated Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0340727A2 (fr) * 1988-05-06 1989-11-08 Nec Corporation Dispositif semi-conducteur comprenant un film organique comme couche isolante intermédiaire pour des conducteurs à multicouche
JPH0226039A (ja) * 1988-07-14 1990-01-29 Mitsubishi Electric Corp 半導体装置
US5288661A (en) * 1989-10-17 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having bonding pad comprising buffer layer
US5703408A (en) * 1995-04-10 1997-12-30 United Microelectronics Corporation Bonding pad structure and method thereof

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
US4357203A (en) * 1981-12-30 1982-11-02 Rca Corporation Plasma etching of polyimide
US4572754A (en) * 1984-05-21 1986-02-25 Ctx Corporation Method of making an electrically insulative substrate
FR2591587A1 (fr) * 1985-12-17 1987-06-19 Saint Gobain Vitrage Film organo-mineral depose sur un substrat en verre eventuellement revetu d'une ou plusieurs couches metalliques minces.
JPS62251136A (ja) * 1986-04-25 1987-10-31 三菱樹脂株式会社 金属複合積層板
JPS6465895A (en) * 1987-09-07 1989-03-13 Hitachi Cable Mesh-shaped metal core substrate
US4963697A (en) * 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
US4882454A (en) * 1988-02-12 1989-11-21 Texas Instruments Incorporated Thermal interface for a printed wiring board
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
US5085922A (en) * 1990-05-22 1992-02-04 Mitsubishi Denki Kabushiki Kaisha Printed circuit board
JP2543230B2 (ja) * 1990-06-20 1996-10-16 松下電器産業株式会社 光学情報記録媒体
US5391516A (en) * 1991-10-10 1995-02-21 Martin Marietta Corp. Method for enhancement of semiconductor device contact pads
US5316976A (en) * 1992-07-08 1994-05-31 National Semiconductor Corporation Crater prevention technique for semiconductor processing
US5309025A (en) * 1992-07-27 1994-05-03 Sgs-Thomson Microelectronics, Inc. Semiconductor bond pad structure and method
US5274912A (en) * 1992-09-01 1994-01-04 Rogers Corporation Method of manufacturing a multilayer circuit board
JP3040267B2 (ja) * 1992-10-23 2000-05-15 日本カーバイド工業株式会社 再帰反射性シートの製造方法
JPH06196603A (ja) * 1992-12-23 1994-07-15 Shinko Electric Ind Co Ltd リードフレームの製造方法
US5278077A (en) * 1993-03-10 1994-01-11 Sharp Microelectronics Technology, Inc. Pin-hole patch method for implanted dielectric layer
US5561085A (en) * 1994-12-19 1996-10-01 Martin Marietta Corporation Structure for protecting air bridges on semiconductor chips from damage
JP3400164B2 (ja) * 1995-01-23 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法
JPH08309926A (ja) * 1995-05-17 1996-11-26 Nitto Boseki Co Ltd 積層板材及びそれから作製した織機の綜絖枠
US5777379A (en) * 1995-08-18 1998-07-07 Tessera, Inc. Semiconductor assemblies with reinforced peripheral regions
US5677230A (en) * 1995-12-01 1997-10-14 Motorola Method of making wide bandgap semiconductor devices
US5686762A (en) * 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads
US5844523A (en) * 1996-02-29 1998-12-01 Minnesota Mining And Manufacturing Company Electrical and electromagnetic apparatuses using laminated structures having thermoplastic elastomeric and conductive layers
US5700735A (en) * 1996-08-22 1997-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming bond pad structure for the via plug process
US5792538A (en) * 1997-02-28 1998-08-11 Wea Manufacturing, Inc. Playable optical picture disc
SG72852A1 (en) * 1997-08-15 2000-05-23 Ricoh Kk Optical recording medium and recording and reproducing method using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0340727A2 (fr) * 1988-05-06 1989-11-08 Nec Corporation Dispositif semi-conducteur comprenant un film organique comme couche isolante intermédiaire pour des conducteurs à multicouche
JPH0226039A (ja) * 1988-07-14 1990-01-29 Mitsubishi Electric Corp 半導体装置
US5288661A (en) * 1989-10-17 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having bonding pad comprising buffer layer
US5703408A (en) * 1995-04-10 1997-12-30 United Microelectronics Corporation Bonding pad structure and method thereof

Also Published As

Publication number Publication date
EP0875934A2 (fr) 1998-11-04
JPH1154544A (ja) 1999-02-26
DE69838695T2 (de) 2008-10-30
DE69838695D1 (de) 2007-12-27
KR100567298B1 (ko) 2006-05-25
KR19980086680A (ko) 1998-12-05
US6143396A (en) 2000-11-07
TW370710B (en) 1999-09-21
US6625882B1 (en) 2003-09-30
EP0875934B1 (fr) 2007-11-14
EP0875934A3 (fr) 1999-10-13

Similar Documents

Publication Publication Date Title
SG115319A1 (en) System and method for reinforcing a bond pad
IL125675A0 (en) A method and system for radio-location determination
GB2327388B (en) Method for reinforcing structural members
IL133091A0 (en) A system and method for packaging integrated circuits
EP0930978A4 (fr) Composition et procede pour polir un composite
HK1033786A1 (en) A secure messging system
SG71823A1 (en) Bump bonding method and bump bonding apparatus
GB2321683B (en) Method and device for controlling a brake system
ZA985834B (en) Method for reinforcing structural members
GB9821553D0 (en) System and method for utilizing a RAM disk
GB2327105B (en) Method and device for controlling a brake system
IL134658A0 (en) Method and system for creating multi-instanced software with a preprocessor
EP0912311A4 (fr) Procede pour coller un revetement sur un coussinet flexible
PL340495A1 (en) Paper-to-paper bonding method
GB9812165D0 (en) Method for making a reservoir and reservoir system
GB2321682B (en) A braking system
IL125222A0 (en) A key-agreement system and method
GB2313269B (en) System and method for optimally compressing a software specification
GB9825164D0 (en) Saddle pad
GB9715136D0 (en) Supporting pad for a joint
SG52939A1 (en) Metal plate-bonded concrete and method for bonding a metal plate and a concrete
HUP9800838A3 (en) Package based on fango and method for making thereof
IL121669A0 (en) A novel key-generation system and method
GB2330443B (en) Method and apparatus for securing a first member to a second member
SG33670A1 (en) A preconditioner for a polishing pad and method for using the same