SG11202112216YA - Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil - Google Patents
Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline silInfo
- Publication number
- SG11202112216YA SG11202112216YA SG11202112216YA SG11202112216YA SG11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA
- Authority
- SG
- Singapore
- Prior art keywords
- polycrystalline silicon
- silicon rod
- rod
- manufacturing
- polycrystalline
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0658—Grinders for cutting-off for cutting workpieces while they are turning about their longitudinal axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0675—Grinders for cutting-off methods therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/003—Multipurpose machines; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/12—Saw-blades or saw-discs specially adapted for working stone
- B28D1/121—Circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019106232 | 2019-06-06 | ||
PCT/JP2020/016832 WO2020246152A1 (fr) | 2019-06-06 | 2020-04-17 | Procédé de coupe de tige de silicium polycristallin, procédé de fabrication de tige coupée de tige de silicium polycristallin, procédé de fabrication de pépite de tige de silicium polycristallin et dispositif de coupe de tige de silicium polycristallin |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202112216YA true SG11202112216YA (en) | 2021-12-30 |
Family
ID=73652094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202112216YA SG11202112216YA (en) | 2019-06-06 | 2020-04-17 | Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220219287A1 (fr) |
EP (1) | EP3981566A4 (fr) |
JP (1) | JPWO2020246152A1 (fr) |
KR (1) | KR20220017394A (fr) |
CN (1) | CN113784828A (fr) |
SG (1) | SG11202112216YA (fr) |
WO (1) | WO2020246152A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114855262B (zh) * | 2022-07-05 | 2022-09-23 | 江苏鑫华半导体科技股份有限公司 | 用于区熔的多晶硅棒的预处理方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501311Y1 (fr) * | 1970-10-06 | 1975-01-14 | ||
JPS50119379A (fr) * | 1974-03-06 | 1975-09-18 | ||
DE3640645A1 (de) * | 1986-11-28 | 1988-06-09 | Wacker Chemitronic | Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben |
JPH04122608A (ja) * | 1990-09-14 | 1992-04-23 | Shin Etsu Handotai Co Ltd | 内周刃スライサーによる単結晶インゴットの切断方法及び装置 |
US5172680A (en) * | 1991-10-11 | 1992-12-22 | Equipment Development Co., Inc. | Dust removal kit for masonry table-saw |
JPH0747542A (ja) * | 1993-08-04 | 1995-02-21 | Komatsu Ltd | 半導体スライサーの切粉除去装置 |
JPH07214545A (ja) * | 1994-01-31 | 1995-08-15 | Okamoto Kosaku Kikai Seisakusho:Kk | スライシングマシンのウェハ冷却装置及びウェハ冷却方法 |
JPH07304028A (ja) * | 1994-05-13 | 1995-11-21 | Nippon Steel Corp | スライシングマシン |
JPH0867510A (ja) | 1994-08-31 | 1996-03-12 | Tokuyama Corp | 多結晶シリコン機械的加工物 |
JPH09255467A (ja) * | 1996-03-22 | 1997-09-30 | Sumitomo Sitix Corp | 単結晶用原料の供給方法及び単結晶用原料の保持具 |
DE10019601B4 (de) * | 2000-04-20 | 2006-09-14 | Wacker Chemie Ag | Verfahren zur Herstellung eines polykristallinen Siliciumstabes |
JP3631425B2 (ja) * | 2000-09-22 | 2005-03-23 | 住友チタニウム株式会社 | 単結晶引上げ用チャージロッドの加工方法 |
JP4341449B2 (ja) | 2004-03-31 | 2009-10-07 | 三菱マテリアル株式会社 | 多結晶シリコンロッドの切断装置 |
JP2007281210A (ja) * | 2006-04-07 | 2007-10-25 | Disco Abrasive Syst Ltd | 基板切断方法および基板切断装置 |
JP4965949B2 (ja) * | 2006-09-22 | 2012-07-04 | 信越半導体株式会社 | 切断方法 |
DE102010063407A1 (de) * | 2010-12-17 | 2012-06-21 | Wacker Chemie Ag | Verfahren und Vorrichtung zur Herstellung von Silicium-Dünnstäben |
DE102011008400B4 (de) * | 2011-01-12 | 2014-07-10 | Siltronic Ag | Verfahren zur Kühlung eines Werkstückes aus Halbleitermaterial beim Drahtsägen |
DE102011005949B4 (de) * | 2011-03-23 | 2012-10-31 | Siltronic Ag | Verfahren zum Abtrennen von Scheiben von einem Werkstück |
JP5689382B2 (ja) * | 2011-07-25 | 2015-03-25 | 信越化学工業株式会社 | 多結晶シリコンロッドの破砕方法 |
JP6131218B2 (ja) * | 2014-06-17 | 2017-05-17 | 信越化学工業株式会社 | 多結晶シリコン棒の表面温度の算出方法および制御方法、多結晶シリコン棒の製造方法、多結晶シリコン棒、ならびに、多結晶シリコン塊 |
JP2016028990A (ja) * | 2014-07-25 | 2016-03-03 | 信越化学工業株式会社 | 多結晶シリコン棒の製造方法および多結晶シリコン塊 |
CN107851566B (zh) * | 2015-06-29 | 2021-08-31 | 西尾康明 | 硅材料的切割辅助装置、切割方法、切割系统 |
CN205167279U (zh) * | 2015-12-02 | 2016-04-20 | 英利能源(中国)有限公司 | 一种硅片切割装置 |
JP6589744B2 (ja) * | 2016-06-07 | 2019-10-16 | 株式会社Sumco | ワークの切断方法 |
JP6851831B2 (ja) * | 2017-01-12 | 2021-03-31 | 株式会社ディスコ | 加工装置 |
CN208645714U (zh) * | 2018-05-14 | 2019-03-26 | 福州天瑞线锯科技有限公司 | 一种单晶硅棒切片装置 |
-
2020
- 2020-04-17 KR KR1020217035350A patent/KR20220017394A/ko unknown
- 2020-04-17 US US17/609,877 patent/US20220219287A1/en active Pending
- 2020-04-17 WO PCT/JP2020/016832 patent/WO2020246152A1/fr active Application Filing
- 2020-04-17 JP JP2021524697A patent/JPWO2020246152A1/ja active Pending
- 2020-04-17 SG SG11202112216YA patent/SG11202112216YA/en unknown
- 2020-04-17 EP EP20818319.4A patent/EP3981566A4/fr active Pending
- 2020-04-17 CN CN202080033334.2A patent/CN113784828A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JPWO2020246152A1 (fr) | 2020-12-10 |
EP3981566A1 (fr) | 2022-04-13 |
CN113784828A (zh) | 2021-12-10 |
KR20220017394A (ko) | 2022-02-11 |
EP3981566A4 (fr) | 2023-07-12 |
US20220219287A1 (en) | 2022-07-14 |
TW202046429A (zh) | 2020-12-16 |
WO2020246152A1 (fr) | 2020-12-10 |
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