JPS501311Y1 - - Google Patents
Info
- Publication number
- JPS501311Y1 JPS501311Y1 JP9880670U JP9880670U JPS501311Y1 JP S501311 Y1 JPS501311 Y1 JP S501311Y1 JP 9880670 U JP9880670 U JP 9880670U JP 9880670 U JP9880670 U JP 9880670U JP S501311 Y1 JPS501311 Y1 JP S501311Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9880670U JPS501311Y1 (fr) | 1970-10-06 | 1970-10-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9880670U JPS501311Y1 (fr) | 1970-10-06 | 1970-10-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS501311Y1 true JPS501311Y1 (fr) | 1975-01-14 |
Family
ID=33261312
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9880670U Expired JPS501311Y1 (fr) | 1970-10-06 | 1970-10-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS501311Y1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007281210A (ja) * | 2006-04-07 | 2007-10-25 | Disco Abrasive Syst Ltd | 基板切断方法および基板切断装置 |
WO2020246152A1 (fr) * | 2019-06-06 | 2020-12-10 | 株式会社トクヤマ | Procédé de coupe de tige de silicium polycristallin, procédé de fabrication de tige coupée de tige de silicium polycristallin, procédé de fabrication de pépite de tige de silicium polycristallin et dispositif de coupe de tige de silicium polycristallin |
-
1970
- 1970-10-06 JP JP9880670U patent/JPS501311Y1/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007281210A (ja) * | 2006-04-07 | 2007-10-25 | Disco Abrasive Syst Ltd | 基板切断方法および基板切断装置 |
WO2020246152A1 (fr) * | 2019-06-06 | 2020-12-10 | 株式会社トクヤマ | Procédé de coupe de tige de silicium polycristallin, procédé de fabrication de tige coupée de tige de silicium polycristallin, procédé de fabrication de pépite de tige de silicium polycristallin et dispositif de coupe de tige de silicium polycristallin |