SG11202112216YA - Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil - Google Patents

Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil

Info

Publication number
SG11202112216YA
SG11202112216YA SG11202112216YA SG11202112216YA SG11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA SG 11202112216Y A SG11202112216Y A SG 11202112216YA
Authority
SG
Singapore
Prior art keywords
polycrystalline silicon
silicon rod
rod
manufacturing
polycrystalline
Prior art date
Application number
SG11202112216YA
Inventor
Junya Sakai
Hiroyuki Tasaki
Original Assignee
Tokuyama Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuyama Corp filed Critical Tokuyama Corp
Publication of SG11202112216YA publication Critical patent/SG11202112216YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0658—Grinders for cutting-off for cutting workpieces while they are turning about their longitudinal axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Silicon Compounds (AREA)
SG11202112216YA 2019-06-06 2020-04-17 Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil SG11202112216YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019106232 2019-06-06
PCT/JP2020/016832 WO2020246152A1 (en) 2019-06-06 2020-04-17 Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline silicon rod cutting device

Publications (1)

Publication Number Publication Date
SG11202112216YA true SG11202112216YA (en) 2021-12-30

Family

ID=73652094

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112216YA SG11202112216YA (en) 2019-06-06 2020-04-17 Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil

Country Status (7)

Country Link
US (1) US20220219287A1 (en)
EP (1) EP3981566A4 (en)
JP (1) JPWO2020246152A1 (en)
KR (1) KR20220017394A (en)
CN (1) CN113784828A (en)
SG (1) SG11202112216YA (en)
WO (1) WO2020246152A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114855262B (en) * 2022-07-05 2022-09-23 江苏鑫华半导体科技股份有限公司 Pretreatment method for zone-melting polycrystalline silicon rod

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501311Y1 (en) * 1970-10-06 1975-01-14
JPS50119379A (en) * 1974-03-06 1975-09-18
DE3640645A1 (en) * 1986-11-28 1988-06-09 Wacker Chemitronic METHOD FOR SAWING CRYSTAL RODS OR BLOCKS BY MEANS OF INTERNAL HOLE SAWS IN THIN WINDOWS
JPH04122608A (en) * 1990-09-14 1992-04-23 Shin Etsu Handotai Co Ltd Method and apparatus for severing single crystal ingot by slicer with inner peripheral blade
US5172680A (en) * 1991-10-11 1992-12-22 Equipment Development Co., Inc. Dust removal kit for masonry table-saw
JPH0747542A (en) * 1993-08-04 1995-02-21 Komatsu Ltd Removing device for cut powder of semiconductor slicer
JPH07214545A (en) * 1994-01-31 1995-08-15 Okamoto Kosaku Kikai Seisakusho:Kk Method and apparatus for cooling wafer of slicing machine
JPH07304028A (en) * 1994-05-13 1995-11-21 Nippon Steel Corp Slicing machine
JPH0867510A (en) 1994-08-31 1996-03-12 Tokuyama Corp Mechanical workpiece of polycrystal silicon
JPH09255467A (en) * 1996-03-22 1997-09-30 Sumitomo Sitix Corp Supply of raw material of single crystal and holding tool for the same material
DE10019601B4 (en) * 2000-04-20 2006-09-14 Wacker Chemie Ag Layer composite material for sliding elements and for plain bearings, particularly crankshaft bearing, camshaft bearings or connecting rod bearings, comprises primary layer made from copper alloy or aluminum alloy
JP3631425B2 (en) * 2000-09-22 2005-03-23 住友チタニウム株式会社 Processing method of charge rod for pulling single crystal
JP4341449B2 (en) 2004-03-31 2009-10-07 三菱マテリアル株式会社 Polycrystalline silicon rod cutting device
JP2007281210A (en) * 2006-04-07 2007-10-25 Disco Abrasive Syst Ltd Method and apparatus for slicing substrate
JP4965949B2 (en) * 2006-09-22 2012-07-04 信越半導体株式会社 Cutting method
DE102010063407A1 (en) * 2010-12-17 2012-06-21 Wacker Chemie Ag Method and device for producing silicon thin rods
DE102011008400B4 (en) * 2011-01-12 2014-07-10 Siltronic Ag Method for cooling a workpiece made of semiconductor material during wire sawing
DE102011005949B4 (en) * 2011-03-23 2012-10-31 Siltronic Ag Method for separating slices from a workpiece
JP5689382B2 (en) * 2011-07-25 2015-03-25 信越化学工業株式会社 Crushing method of polycrystalline silicon rod
JP6131218B2 (en) * 2014-06-17 2017-05-17 信越化学工業株式会社 Method for calculating and controlling surface temperature of polycrystalline silicon rod, method for producing polycrystalline silicon rod, polycrystalline silicon rod, and polycrystalline silicon lump
JP2016028990A (en) * 2014-07-25 2016-03-03 信越化学工業株式会社 Production method of polycrystalline silicon rod and polycrystalline silicone block
WO2017002670A1 (en) * 2015-06-29 2017-01-05 西尾　康明 Cutting assist device for silicon material, cutting method, and cutting system
CN205167279U (en) * 2015-12-02 2016-04-20 英利能源（中国）有限公司 Silicon wafer cutting device
JP6589744B2 (en) * 2016-06-07 2019-10-16 株式会社Sumco Work cutting method
JP6851831B2 (en) * 2017-01-12 2021-03-31 株式会社ディスコ Processing equipment
CN208645714U (en) * 2018-05-14 2019-03-26 福州天瑞线锯科技有限公司 A kind of silicon single crystal rod slicing device

Also Published As

Publication number Publication date
JPWO2020246152A1 (en) 2020-12-10
EP3981566A4 (en) 2023-07-12
TW202046429A (en) 2020-12-16
US20220219287A1 (en) 2022-07-14
WO2020246152A1 (en) 2020-12-10
KR20220017394A (en) 2022-02-11
CN113784828A (en) 2021-12-10
EP3981566A1 (en) 2022-04-13

Similar Documents

Publication Publication Date Title
EP3269479A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3441167A4 (en) Surface-coated cutting tool and method for producing same
EP3357615A4 (en) Cutting tool and method for producing same
EP3444053A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3613864A4 (en) Cemented carbide, cutting tool comprising same, and method for preparing cemented carbide
EP3357614A4 (en) Surface-coated cutting tool and method for producing same
EP3266756A4 (en) Polycrystalline diamond body, cutting tool, wear-resistant tool, grinding tool and method for producing polycrystalline diamond body
EP3326741A4 (en) Surface-coated cutting tool and method for producing same
EP3686302A4 (en) Cemented carbide alloy, cutting tool, and method for manufacturing cemented carbide alloy
EP3656493A4 (en) Cutting insert and method for manufacturing cutting insert
EP3246422A4 (en) Cermet, cutting tool, and method for manufacturing cermet
EP3412386A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3308886A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3263253A4 (en) Insert, drill, and method of manufacturing cut workpiece employing same
EP3351520A4 (en) Method for producing diamond polycrystal, diamond polycrystal, cutting tool, wear-resistant tool, and grinding tool
EP3674022A4 (en) Cutting tool and manufacturing method thereof
GB202006774D0 (en) Carbide material for cutting devices and associated method of manufacture
SG10202000252QA (en) Workpiece cutting method
EP3590636A4 (en) Surface-coated cutting tool and production method therefor
SG10202008562RA (en) Cutting blade and manufacturing method of cutting blade
EP3865233A4 (en) Cutting tool and manufacturing method therefor
EP3769872A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3769871A4 (en) Surface-coated cutting tool and manufacturing method therefor
EP3505278B8 (en) Surface-coated cutting tool and method for manufacturing the same
SG11202112216YA (en) Method for cutting polycrystalline silicon rod, method for manufacturing cut rod of polycrystalline silicon rod, method for manufacturing nugget of polycrystalline silicon rod, and polycrystalline sil