SG10202008562RA - Cutting blade and manufacturing method of cutting blade - Google Patents
Cutting blade and manufacturing method of cutting bladeInfo
- Publication number
- SG10202008562RA SG10202008562RA SG10202008562RA SG10202008562RA SG10202008562RA SG 10202008562R A SG10202008562R A SG 10202008562RA SG 10202008562R A SG10202008562R A SG 10202008562RA SG 10202008562R A SG10202008562R A SG 10202008562RA SG 10202008562R A SG10202008562R A SG 10202008562RA
- Authority
- SG
- Singapore
- Prior art keywords
- cutting blade
- manufacturing
- blade
- cutting
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/002—Materials or surface treatments therefor, e.g. composite materials
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019166094A JP2021041502A (en) | 2019-09-12 | 2019-09-12 | Cutting blade, manufacturing method for cutting blade and cutting method for wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202008562RA true SG10202008562RA (en) | 2021-04-29 |
Family
ID=74686219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202008562RA SG10202008562RA (en) | 2019-09-12 | 2020-09-03 | Cutting blade and manufacturing method of cutting blade |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210078204A1 (en) |
JP (2) | JP2021041502A (en) |
KR (1) | KR20210031603A (en) |
CN (1) | CN112476257A (en) |
DE (1) | DE102020211447A1 (en) |
SG (1) | SG10202008562RA (en) |
TW (1) | TW202111790A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230178536A1 (en) * | 2021-12-07 | 2023-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Trimming and Sawing Processes in the Formation of Wafer-Form Packages |
TWI832179B (en) * | 2022-03-22 | 2024-02-11 | 盛新材料科技股份有限公司 | Wafer positioning fixture and wafer processing method using the same |
CN116377416B (en) * | 2023-03-08 | 2023-12-12 | 北京爱克瑞特金刚石工具有限公司 | Scribing cutter and manufacturing method thereof |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6271102B1 (en) * | 1998-02-27 | 2001-08-07 | International Business Machines Corporation | Method and system for dicing wafers, and semiconductor structures incorporating the products thereof |
JP2001030175A (en) * | 1999-07-21 | 2001-02-06 | Asahi Diamond Industrial Co Ltd | Super grinding particle cutter |
EP1126003B1 (en) * | 2000-02-16 | 2004-04-28 | Mitsubishi Materials Corporation | Resin bonded abrasive tool |
JP2004188475A (en) | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | Laser machining method |
JP2005064230A (en) | 2003-08-12 | 2005-03-10 | Disco Abrasive Syst Ltd | Dividing method of plate-shaped article |
JP2007111827A (en) * | 2005-10-20 | 2007-05-10 | Read Co Ltd | DIAMOND OR cBN GRINDING STONE, AND ITS MANUFACTURING METHOD |
JP5395446B2 (en) * | 2009-01-22 | 2014-01-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device and manufacturing method of semiconductor device |
JP6223237B2 (en) * | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | Cutting equipment |
JP2018094646A (en) * | 2016-12-09 | 2018-06-21 | 株式会社ディスコ | Cutting blade |
JP6814663B2 (en) * | 2017-03-01 | 2021-01-20 | 株式会社ディスコ | Cutting method of work piece |
JP7114169B2 (en) * | 2018-02-14 | 2022-08-08 | 株式会社ディスコ | Cutting blade shaping method |
-
2019
- 2019-09-12 JP JP2019166094A patent/JP2021041502A/en active Pending
-
2020
- 2020-08-18 KR KR1020200102977A patent/KR20210031603A/en unknown
- 2020-09-03 SG SG10202008562RA patent/SG10202008562RA/en unknown
- 2020-09-09 CN CN202010938855.4A patent/CN112476257A/en active Pending
- 2020-09-09 TW TW109130903A patent/TW202111790A/en unknown
- 2020-09-10 US US17/016,713 patent/US20210078204A1/en not_active Abandoned
- 2020-09-11 DE DE102020211447.1A patent/DE102020211447A1/en active Pending
-
2024
- 2024-01-10 JP JP2024001958A patent/JP2024026699A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112476257A (en) | 2021-03-12 |
US20210078204A1 (en) | 2021-03-18 |
TW202111790A (en) | 2021-03-16 |
JP2024026699A (en) | 2024-02-28 |
DE102020211447A1 (en) | 2021-03-18 |
KR20210031603A (en) | 2021-03-22 |
JP2021041502A (en) | 2021-03-18 |
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