SG11201908188SA - Reduced footprint platform architecture with linear vacuum transfer module - Google Patents

Reduced footprint platform architecture with linear vacuum transfer module

Info

Publication number
SG11201908188SA
SG11201908188SA SG11201908188SA SG11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA SG 11201908188S A SG11201908188S A SG 11201908188SA
Authority
SG
Singapore
Prior art keywords
transfer module
international
atv
transfer
california
Prior art date
Application number
Other languages
English (en)
Inventor
Richard H Gould
Richard Blank
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG11201908188SA publication Critical patent/SG11201908188SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Prostheses (AREA)
SG11201908188S 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module SG11201908188SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762471478P 2017-03-15 2017-03-15
PCT/US2018/022397 WO2018170104A1 (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Publications (1)

Publication Number Publication Date
SG11201908188SA true SG11201908188SA (en) 2019-10-30

Family

ID=63523643

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10202110040S SG10202110040SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module
SG11201908188S SG11201908188SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10202110040S SG10202110040SA (en) 2017-03-15 2018-03-14 Reduced footprint platform architecture with linear vacuum transfer module

Country Status (8)

Country Link
US (3) US11521869B2 (zh)
EP (1) EP3596752A4 (zh)
JP (2) JP7275039B2 (zh)
KR (2) KR20230131969A (zh)
CN (1) CN110447095B (zh)
SG (2) SG10202110040SA (zh)
TW (2) TWI765984B (zh)
WO (1) WO2018170104A1 (zh)

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US11164769B2 (en) * 2019-07-30 2021-11-02 Brooks Automation, Inc. Robot embedded vision apparatus
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JP2023520600A (ja) * 2020-04-06 2023-05-17 ラム リサーチ コーポレーション 基板処理システムのプロセスモジュールバイアスアセンブリ用の摺動・枢動アセンブリ
CN113644005A (zh) * 2020-05-11 2021-11-12 中微半导体设备(上海)股份有限公司 一种半导体处理系统
US20240170309A1 (en) * 2021-04-28 2024-05-23 Lam Research Corporation Semiconductor tool arrangements
JP2023070364A (ja) 2021-11-09 2023-05-19 東京エレクトロン株式会社 基板処理システム
WO2023086848A1 (en) * 2021-11-11 2023-05-19 Lam Research Corporation Nesting atmospheric robot arms for high throughput
WO2023205361A1 (en) * 2022-04-22 2023-10-26 Lam Research Corporation Shallow-depth equipment front end module with robot

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Also Published As

Publication number Publication date
KR20190120834A (ko) 2019-10-24
US20200083071A1 (en) 2020-03-12
JP2020510310A (ja) 2020-04-02
KR20230131969A (ko) 2023-09-14
JP7275039B2 (ja) 2023-05-17
EP3596752A4 (en) 2021-01-06
US11908714B2 (en) 2024-02-20
KR102577199B1 (ko) 2023-09-08
TWI793000B (zh) 2023-02-11
TW202232632A (zh) 2022-08-16
JP2023099172A (ja) 2023-07-11
US20230062737A1 (en) 2023-03-02
CN110447095A (zh) 2019-11-12
SG10202110040SA (en) 2021-10-28
WO2018170104A1 (en) 2018-09-20
CN110447095B (zh) 2024-04-26
US20240194505A1 (en) 2024-06-13
TWI765984B (zh) 2022-06-01
TW201901835A (zh) 2019-01-01
EP3596752A1 (en) 2020-01-22
US11521869B2 (en) 2022-12-06

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