SG11201807416YA - Substrate holder and plating apparatus - Google Patents

Substrate holder and plating apparatus

Info

Publication number
SG11201807416YA
SG11201807416YA SG11201807416YA SG11201807416YA SG11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA SG 11201807416Y A SG11201807416Y A SG 11201807416YA
Authority
SG
Singapore
Prior art keywords
substrate
substrate holder
plating apparatus
holding
plating
Prior art date
Application number
SG11201807416YA
Other languages
English (en)
Inventor
Yoshitaka Mukaiyama
Toshio Yokoyama
Junitsu Yamakawa
Takuya Tsushima
Tomonori Hirao
Sho Tamura
Hirotaka Ohashi
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11201807416YA publication Critical patent/SG11201807416YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Vapour Deposition (AREA)
SG11201807416YA 2016-03-22 2017-03-07 Substrate holder and plating apparatus SG11201807416YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016057028A JP6596372B2 (ja) 2016-03-22 2016-03-22 基板ホルダ及びめっき装置
PCT/JP2017/008875 WO2017163849A1 (ja) 2016-03-22 2017-03-07 基板ホルダ及びめっき装置

Publications (1)

Publication Number Publication Date
SG11201807416YA true SG11201807416YA (en) 2018-10-30

Family

ID=59900180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807416YA SG11201807416YA (en) 2016-03-22 2017-03-07 Substrate holder and plating apparatus

Country Status (7)

Country Link
US (1) US11015261B2 (ja)
JP (1) JP6596372B2 (ja)
KR (1) KR102074338B1 (ja)
CN (1) CN109072475B (ja)
SG (1) SG11201807416YA (ja)
TW (1) TWI685056B (ja)
WO (1) WO2017163849A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019003891A1 (ja) * 2017-06-28 2019-01-03 株式会社荏原製作所 基板ホルダ及びめっき装置
JP6721131B2 (ja) 2017-09-07 2020-07-08 株式会社Ihi 筒体塗装装置
JP7085968B2 (ja) * 2018-11-15 2022-06-17 株式会社荏原製作所 基板ホルダ、めっき装置および基板のめっき方法
JP7122235B2 (ja) * 2018-11-26 2022-08-19 上村工業株式会社 保持治具
CN111945212B (zh) * 2019-05-15 2021-11-05 颀中科技（苏州）有限公司 用于电镀设备的夹具
TWI722555B (zh) * 2019-09-04 2021-03-21 日月光半導體製造股份有限公司 電鍍治具
JP7264780B2 (ja) * 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
KR102292186B1 (ko) * 2020-03-10 2021-08-23 주식회사 포엠일렉트로옵틱 자동 보호테이프 박리 및 홀더 결합 장치
KR102374337B1 (ko) * 2020-12-09 2022-03-16 가부시키가이샤 에바라 세이사꾸쇼 도금 장치, 및 기판 홀더 조작 방법
KR20230027215A (ko) * 2021-01-08 2023-02-27 가부시키가이샤 에바라 세이사꾸쇼 기판 홀더, 도금 장치, 도금 방법 및 기억 매체
MX2024010995A (es) * 2022-03-09 2024-09-17 Octapharma Ag Molde para aplicar un liquido sobre una pelicula a base de plasma o crioprecipitado y metodo para recubrir una pelicula a base de plasma o crioprecipitado.
TWI845213B (zh) * 2023-03-20 2024-06-11 中勤實業股份有限公司 基板的框架模組

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2633452B1 (fr) * 1988-06-28 1990-11-02 Doue Julien Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur
JPH0677308A (ja) * 1992-08-25 1994-03-18 Mitsubishi Electric Corp 半導体製造装置
JP4037504B2 (ja) * 1998-01-09 2008-01-23 株式会社荏原製作所 半導体ウエハのメッキ治具
TW580745B (en) * 1997-12-15 2004-03-21 Ebara Corp Electroplating jig for semiconductor wafers and apparatus for electroplating wafers
US6783299B2 (en) * 1999-07-26 2004-08-31 Ovadia Meron Latch for detachably attaching and mounting a semiconductor wafer to a support ring
JP3588777B2 (ja) * 2002-04-12 2004-11-17 株式会社山本鍍金試験器 電気めっき試験器の陰極カートリッジ
US7601248B2 (en) * 2002-06-21 2009-10-13 Ebara Corporation Substrate holder and plating apparatus
JP4828959B2 (ja) * 2006-02-17 2011-11-30 住友重機械工業株式会社 基板ホルダ及び基板ホルダの取扱方法
EP2350357B1 (en) 2008-11-14 2019-08-21 Luxembourg Institute of Science and Technology A substrate holder for holding a conductive substrate during plating thereof
JP5585238B2 (ja) * 2010-06-24 2014-09-10 東京エレクトロン株式会社 基板処理装置
JP5766048B2 (ja) 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置
US9728435B2 (en) * 2010-10-21 2017-08-08 Ebara Corporation Plating apparatus and plating method
US9464362B2 (en) * 2012-07-18 2016-10-11 Deca Technologies Inc. Magnetically sealed wafer plating jig system and method
JP5908266B2 (ja) * 2011-11-30 2016-04-26 株式会社Ｓｃｒｅｅｎホールディングス 陽極化成装置及びそれを備えた陽極化成システム並びに半導体ウエハ
JP5981534B2 (ja) * 2012-04-20 2016-08-31 株式会社Ｊｃｕ 基板めっき治具及びそれを利用しためっき装置
DE102012019389B4 (de) * 2012-10-02 2018-03-29 Atotech Deutschland Gmbh Haltevorrichtung für eine Ware und Behandlungsverfahren
TWI561683B (en) * 2012-10-18 2016-12-11 Process Automation Int Ltd A hanger and an electroplating system with such a hanger
US9865493B2 (en) * 2012-11-14 2018-01-09 Jcu Corporation Substrate plating jig
JP2016008344A (ja) * 2014-06-26 2016-01-18 株式会社村田製作所 めっき用治具

Also Published As

Publication number Publication date
KR102074338B1 (ko) 2020-02-07
US11015261B2 (en) 2021-05-25
CN109072475B (zh) 2020-06-09
US20190084777A1 (en) 2019-03-21
CN109072475A (zh) 2018-12-21
JP6596372B2 (ja) 2019-10-23
TW201735236A (zh) 2017-10-01
KR20180124039A (ko) 2018-11-20
JP2017171966A (ja) 2017-09-28
WO2017163849A1 (ja) 2017-09-28
TWI685056B (zh) 2020-02-11

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