JP7122235B2 - 保持治具 - Google Patents
保持治具 Download PDFInfo
- Publication number
- JP7122235B2 JP7122235B2 JP2018220245A JP2018220245A JP7122235B2 JP 7122235 B2 JP7122235 B2 JP 7122235B2 JP 2018220245 A JP2018220245 A JP 2018220245A JP 2018220245 A JP2018220245 A JP 2018220245A JP 7122235 B2 JP7122235 B2 JP 7122235B2
- Authority
- JP
- Japan
- Prior art keywords
- holding jig
- plate
- back member
- jig according
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
- B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Chemically Coating (AREA)
- Paper (AREA)
- Magnetic Resonance Imaging Apparatus (AREA)
- Telephone Function (AREA)
- Electroplating Methods And Accessories (AREA)
Description
[1]背面部材と、該背面部材に対向し且つ開口部を有する正面部材との間に配置される板状被処理物に液浴処理を施すための板状被処理物用保持治具であって、前記背面部材は、前記正面部材との対向面に、複数の凸部を有することを特徴とする保持治具。
[2]前記凸部の上面の平面視形状は、重力方向に直交する方向に非平行な直線部を有する[1]に記載の保持治具。
[3]前記凸部の上面の平面視形状は、多角形である[2]に記載の保持治具。
[4]前記多角形は、菱形である[3]に記載の保持治具。
[5]前記凸部は、前記対向面において格子状に配置されている[1]~[4]のいずれかに記載の保持治具。
[6]前記格子状は、斜方格子、三角格子、または平行体格子である[5]に記載の保持治具。
[7]前記凸部は、前記背面部材の厚み方向断面において、平均高さが1~3mmである[1]~[6]のいずれかに記載の保持治具。
[8]前記背面部材は、厚み方向に連通する貫通孔を有する[1]~[7]のいずれかに記載の保持治具。
[9]前記貫通孔は、重力方向の最も上方に配置される凸部より上側、および/または、重力方向の最も下方に配置される凸部より下側に形成されている[8]に記載の保持治具。
[10]前記凸部の上面の合計面積は、前記開口部の面積に対して、80面積%以下である[1]~[9]のいずれかに記載の保持治具。
上記開閉ロック14aと14bは、背面部材11と正面部材13が液浴処理中に開かないように構成すればその種類は特に限定されず、例えば、嵌合する凸部と凹部を設ける構成や、磁力を用いる構成などが挙げられる。
11 背面部材
12 開口部
13 正面部材
14a、14b 開閉ロック
15 凸部
16a、16b 貫通孔
21 ガイド
31 接点
32 遮蔽部材
Claims (9)
- 背面部材と、該背面部材に対向し且つ開口部を有する正面部材との間に配置される板状被処理物に液浴処理を施すための板状被処理物用保持治具であって、
前記背面部材は、前記正面部材との対向面に、複数の凸部を有しており、
前記凸部は、前記対向面において格子状に配置されており、
前記凸部の上面は、前記板状被処理物と接触していることを特徴とする保持治具。 - 前記凸部の上面の平面視形状は、重力方向に直交する方向に非平行な直線部を有する請求項1に記載の保持治具。
- 前記凸部の上面の平面視形状は、多角形である請求項2に記載の保持治具。
- 前記多角形は、菱形である請求項3に記載の保持治具。
- 前記格子状は、斜方格子、三角格子、または平行体格子である請求項1に記載の保持治具。
- 前記凸部は、前記背面部材の厚み方向断面において、平均高さが1~3mmである請求項1~5のいずれかに記載の保持治具。
- 前記背面部材は、厚み方向に連通する貫通孔を有する請求項1~6のいずれかに記載の保持治具。
- 前記貫通孔は、重力方向の最も上方に配置される凸部より上側、および/または、重力方向の最も下方に配置される凸部より下側に形成されている請求項7に記載の保持治具。
- 前記凸部の上面の合計面積は、前記開口部の面積に対して、80面積%以下である請求項1~8のいずれかに記載の保持治具。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018220245A JP7122235B2 (ja) | 2018-11-26 | 2018-11-26 | 保持治具 |
US16/683,699 US11887882B2 (en) | 2018-11-26 | 2019-11-14 | Holding jig |
CN201911141722.8A CN111218710A (zh) | 2018-11-26 | 2019-11-20 | 保持夹具 |
KR1020190150036A KR20200062044A (ko) | 2018-11-26 | 2019-11-21 | 보유 지지 지그 |
TW108142460A TWI821461B (zh) | 2018-11-26 | 2019-11-22 | 保持治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018220245A JP7122235B2 (ja) | 2018-11-26 | 2018-11-26 | 保持治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020084264A JP2020084264A (ja) | 2020-06-04 |
JP7122235B2 true JP7122235B2 (ja) | 2022-08-19 |
Family
ID=70770862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018220245A Active JP7122235B2 (ja) | 2018-11-26 | 2018-11-26 | 保持治具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11887882B2 (ja) |
JP (1) | JP7122235B2 (ja) |
KR (1) | KR20200062044A (ja) |
CN (1) | CN111218710A (ja) |
TW (1) | TWI821461B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111733439B (zh) * | 2020-06-30 | 2021-05-25 | 西安微电子技术研究所 | 一种bga封装电路模块的镀覆挂具及加工方法 |
WO2023170163A1 (en) * | 2022-03-09 | 2023-09-14 | Octapharma Ag | Mold for applying a liquid onto a plasma-based or cryoprecipitate-based film and method for coating a plasma-based or cryoprecipitate-based film |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013142169A (ja) | 2012-01-11 | 2013-07-22 | Mitsubishi Electric Corp | 電気めっき用保持具およびこの保持具を用いた電気めっき装置 |
JP2017110303A (ja) | 2016-02-25 | 2017-06-22 | 株式会社荏原製作所 | めっき装置に使用される基板ホルダの漏れ検査方法 |
WO2017163849A1 (ja) | 2016-03-22 | 2017-09-28 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP2019081914A (ja) | 2017-10-27 | 2019-05-30 | 上村工業株式会社 | ワーク保持治具及びロードアンロード装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4376382A (en) | 1980-12-01 | 1983-03-15 | James W. Raymond | Resettable lock assembly |
JPS5810384Y2 (ja) * | 1980-12-09 | 1983-02-25 | 株式会社東芝 | 印刷配線基板用電気メツキ治具 |
JPH0429662A (ja) | 1990-05-25 | 1992-01-31 | Kubota Corp | 車両の動力伝達装置 |
JPH0429662U (ja) * | 1990-06-27 | 1992-03-10 | ||
JP4037504B2 (ja) * | 1998-01-09 | 2008-01-23 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具 |
JP3847434B2 (ja) | 1997-12-15 | 2006-11-22 | 株式会社荏原製作所 | 半導体ウエハのメッキ治具 |
EP1113093B1 (en) * | 1999-05-18 | 2014-04-23 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
US7022211B2 (en) * | 2000-01-31 | 2006-04-04 | Ebara Corporation | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer |
JP3154267U (ja) * | 2009-07-09 | 2009-10-15 | 株式会社アイプラント | めっき処理物保持具 |
US20140251798A1 (en) * | 2011-10-19 | 2014-09-11 | Jcu Corporation | Substrate electroplating jig |
JP5643239B2 (ja) * | 2012-01-30 | 2014-12-17 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP5782398B2 (ja) | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
US9865494B2 (en) * | 2013-05-23 | 2018-01-09 | Nikon Corporation | Substrate holding method, substrate holding apparatus, exposure apparatus and exposure method |
JP2015126035A (ja) * | 2013-12-25 | 2015-07-06 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP6739295B2 (ja) * | 2016-09-08 | 2020-08-12 | 株式会社荏原製作所 | 基板ホルダ、めっき装置、及び基板を保持する方法 |
JP6739307B2 (ja) * | 2016-09-29 | 2020-08-12 | 株式会社荏原製作所 | 基板ホルダ、めっき装置、及び基板ホルダの製造方法 |
JP6893142B2 (ja) * | 2017-07-25 | 2021-06-23 | 上村工業株式会社 | ワーク保持治具及び電気めっき装置 |
-
2018
- 2018-11-26 JP JP2018220245A patent/JP7122235B2/ja active Active
-
2019
- 2019-11-14 US US16/683,699 patent/US11887882B2/en active Active
- 2019-11-20 CN CN201911141722.8A patent/CN111218710A/zh active Pending
- 2019-11-21 KR KR1020190150036A patent/KR20200062044A/ko active Search and Examination
- 2019-11-22 TW TW108142460A patent/TWI821461B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013142169A (ja) | 2012-01-11 | 2013-07-22 | Mitsubishi Electric Corp | 電気めっき用保持具およびこの保持具を用いた電気めっき装置 |
JP2017110303A (ja) | 2016-02-25 | 2017-06-22 | 株式会社荏原製作所 | めっき装置に使用される基板ホルダの漏れ検査方法 |
WO2017163849A1 (ja) | 2016-03-22 | 2017-09-28 | 株式会社荏原製作所 | 基板ホルダ及びめっき装置 |
JP2019081914A (ja) | 2017-10-27 | 2019-05-30 | 上村工業株式会社 | ワーク保持治具及びロードアンロード装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111218710A (zh) | 2020-06-02 |
KR20200062044A (ko) | 2020-06-03 |
US11887882B2 (en) | 2024-01-30 |
TW202020238A (zh) | 2020-06-01 |
US20200168499A1 (en) | 2020-05-28 |
TWI821461B (zh) | 2023-11-11 |
JP2020084264A (ja) | 2020-06-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7122235B2 (ja) | 保持治具 | |
TW419399B (en) | Post-lapping cleaning process for silicon wafers | |
US20050016565A1 (en) | Cleaning masks | |
CN103286089B (zh) | 基板清洗装置以及清洗方法 | |
CN101798698A (zh) | 基底板、接触环、唇缘密封件与接触环以及电镀设备和电镀方法 | |
JP2011174177A (ja) | めっき方法及びめっき装置 | |
JP2007056350A (ja) | メッキ装置 | |
KR100827481B1 (ko) | 웨이퍼의 도금장치 | |
KR101687758B1 (ko) | 유연기판 또는 유리기판 위에 도금하기 위한 전기 도금장치용 스테이지 | |
CN110144609A (zh) | 一种多次沉锌的电镀加工方法 | |
KR100820745B1 (ko) | 소형 가공물 표면 처리용 지그 유니트 | |
JPH0448629A (ja) | 半導体ウェーハの液処理装置 | |
WO2005010947A2 (en) | Cleaning masks | |
JPH09148289A (ja) | 洗浄装置 | |
JPH0317300A (ja) | 被メツキ物用のサイホン管 | |
JP6204832B2 (ja) | めっき装置およびめっき方法 | |
TWI668783B (zh) | Fosb型出貨用晶圓收容容器之洗淨方法 | |
KR101826783B1 (ko) | 방열부재의 도금방법 | |
KR0135877Y1 (ko) | 도금용 지그 | |
JP2001262397A (ja) | 袋状ワークの浸漬保持具 | |
JP2007270282A (ja) | バレルめっき方法 | |
JP2000031103A (ja) | 洗浄方法、洗浄液置換方法、洗浄装置並びに洗浄槽 | |
JP2021113342A (ja) | 表面処理装置及びNiめっきステンレススクリーン印刷用メッシュ | |
JP3756237B2 (ja) | 薄箔保持装置および吊り下げ式薄箔保持装置 | |
RU59889U1 (ru) | Кассета для очистки полупроводниковых пластин |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7426 Effective date: 20190204 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210805 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220427 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220629 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220719 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220808 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7122235 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |